Patent application number | Description | Published |
20080285052 | SHAPE MEASURING APPARATUS, EXPOSURE APPARATUS, AND COMPUTER - A shape measuring apparatus for measuring the shape of a measurement target surface includes an interferometer and computer. The interferometer senses interference light formed by measurement light from the measurement target surface and reference light by a photoelectric converter, while changing the light path length of the measurement light or the reference light. The computer Fourier-transforms a first interference signal sensed by the photoelectric converter to obtain a phase distribution and an amplitude distribution, shapes the amplitude distribution, inversely Fourier-transforms the phase distribution and the shaped amplitude distribution to obtain a second interference signal, and determines the shape of the measurement target surface based on the second interference signal. | 11-20-2008 |
20090101037 | GAP MEASURING METHOD, IMPRINT METHOD, AND IMPRINT APPARATUS - A gap measuring method for measuring a gap between two members by irradiating the two members with light is constituted by preparing a first member and a second member which are disposed opposite to each other; irradiating the first member and the second member with light from one member side to obtain spectral data about intensity of reflected light or transmitted light from the other member side; and determining a gap between the first member and the second member by comparing the obtained spectral data with a database in which a gap length and an intensity spectrum are correlated with each other. | 04-23-2009 |
20090108483 | ALIGNMENT METHOD, IMPRINT METHOD, ALIGNMENT APPARATUS, AND POSITION MEASUREMENT METHOD - In an alignment method for effecting alignment between two plate-like objects, a first plate-like object provided with a first alignment mark and a second plate-like object provide with a second alignment mark are disposed opposite to each other. A first area and a second area are provided at mutually nonoverlapping positions in an image pickup area for being observed through an image pickup device. Images of the first and second alignment marks are picked up by the image pickup device from a direction substantially perpendicular to an in-plane direction of the first and second plate-like objects. Alignment control is effected by using first information about a deviation of the first alignment mark from a predetermined position in the first area and second information about a deviation of the second alignment mark from a predetermined position in the second area. | 04-30-2009 |
20090138135 | ALIGNMENT METHOD, EXPOSURE METHOD, PATTERN FORMING METHOD, AND EXPOSURE APPARATUS - An alignment method is provided in which a substrate including first and second layers is aligned in forming a second pattern in the second layer. The method includes storing first alignment measurement data to be used in alignment performed in forming a first pattern and a second alignment mark in the second layer, the first alignment measurement data obtained by measuring a first alignment mark provided in the first layer; obtaining second alignment measurement data by measuring the second alignment mark through a resist applied over the second layer; obtaining third alignment measurement data by measuring the first alignment mark through the resist; and performing alignment of the substrate in accordance with a first difference between the first and second alignment measurement data, or in accordance with the first difference and a second difference between the first and third alignment measurement data. | 05-28-2009 |
20090152239 | PROCESS FOR PRODUCING A CHIP USING A MOLD - A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate | 06-18-2009 |
20090152753 | MOLD, IMPRINT METHOD, AND PROCESS FOR PRODUCING A CHIP - A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate | 06-18-2009 |
20090219499 | SURFACE SHAPE MEASURING APPARATUS, EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD - A surface shape measuring apparatus includes an illumination system and a light receiving system. The illumination system splits wide-band light from a light source into measurement light and reference light, illuminates the measurement light to obliquely enter a surface of the film, and illuminates the reference light to obliquely enter a reference mirror. The light receiving system combines the measurement light reflected by the surface of the film and the reference light reflected by the reference mirror with each other and introduces the combined light to a photoelectric conversion element. An incident angle of the measurement light upon the surface of the film and an incident angle of the reference light upon the reference mirror are each larger than the Brewster's angle. S-polarized light and p-polarized light included in the measurement light entering a surface of the substrate have equal intensity on the photoelectric conversion element. | 09-03-2009 |
20090283938 | IMPRINT APPARATUS, IMPRINT METHOD, AND MOLD FOR IMPRINT - An imprint apparatus for imprinting a mold pattern onto a substrate or a member on the substrate includes a light source for irradiating a surface of the mold disposed opposite to the substrate and a surface of the substrate with light; an optical system for guiding the light from the light source to the surface of the mold and the surface of the substrate and guiding reflected lights from these surfaces to a spectroscope; a spectroscope for dispersing the reflected lights guided by the optical system into a spectrum; and an analyzer for analyzing a distance between the surface of the mold and the surface of the substrate. The analyzer calculates the distance between the surface of the mold and the surface of the substrate by measuring a distance between the surface of the mold and a surface formed at a position away from the surface of the mold. | 11-19-2009 |
20090286172 | SURFACE SHAPE MEASUREMENT APPARATUS AND EXPOSURE APPARATUS - A surface shape measurement apparatus is configured to measure a surface shape of an object to be measured, and includes a beam splitter configured to split white light from a light source into two light beams, a pair of prisms each configured to increase an incident angle of each light beam that has been split by the beam splitter and directed to the object or a reference surface, each prism having an antireflection part that is formed at a period of a wavelength of the white light or smaller and has a moth-eye shape, a superimposition unit configured to superimpose object light from the object with reference light from the reference surface and has passed the second prism, and to generate white interference light, and a Lyot filter configured to discretely separate the white interference light for each of a plurality of wavelengths. | 11-19-2009 |
20100031833 | IMPRINT APPARATUS, IMPRINT METHOD, AND ARTICLE MANUFACTURING METHOD - There is provided an imprint apparatus configured to perform an imprint in which a resin on a substrate is molded using a mold and a pattern is formed on the substrate. The apparatus includes a press unit configured to press the resin on the substrate and the mold to each other, a cure unit configured to irradiate light to the resin molded by the mold to cure the resin, and a movement unit configured to move the mold and the substrate, from a position at which the press is performed by the press unit to a position at which the light is irradiated by the cure unit, and from the position at which the light is irradiated by the cure unit to a position at which the mold is released. | 02-11-2010 |
20100072649 | IMPRINT APPARATUS AND ARTICLE MANUFACTURING METHOD - An imprint apparatus molds resin dispensed on a shot region of a substrate with a mold and forms a pattern of resin on the shot region. The apparatus includes a mold stage configured to hold the mold, a substrate stage configured to hold the substrate, a drive mechanism configured to change a relative positional relationship between the mold stage and the substrate stage in an X-Y plane that defines a coordinate of the shot region and a Z-axis direction perpendicular to the X-Y plane, and a controller. The controller is configured to control the drive mechanism so that the mold and the shot region perform relative vibration, in the X-Y plane, with respect to a relative position where the mold and the shot region align, and a distance between the mold and the shot region decreases in the Z-axis direction in parallel with the vibration, and the resin is molded by the mold. | 03-25-2010 |
20100072653 | IMPRINTING APPARATUS AND METHOD THEREFOR - There is provided an imprinting apparatus that transfers a pattern of a mold to a resin on a substrate, the imprinting apparatus including a deposition mechanism configured to deposit the resin onto the substrate; a first driving mechanism configured to change a relative position, on a plane parallel to the surface of the substrate, of the substrate and the mold; a second driving mechanism configured to change the relative position, on a plane parallel to the surface of the substrate, of the substrate and the deposition mechanism; and a control unit configured to control the deposition mechanism and the driving mechanism so as to perform a resin deposition process of depositing the resin onto the substrate and an imprint process of transferring the pattern of the mold to the resin on the substrate in parallel. | 03-25-2010 |
20100072664 | IMPRINT APPARATUS AND METHOD OF MANUFACTURING ARTICLE - An imprint apparatus for pressing resin and a mold to each other in a Z-axis direction to form a resin pattern on a shot region includes: a mold chuck; an X-Y stage; a reference mark formed on the stage; a first scope configured to measure a positional deviation in an x-y plane between a mold mark and the reference mark; a second scope configured to measure a position of a substrate mark in the plane not via the mold mark; and a dispenser configured to dispense resin. In the plane, the dispenser center is deviated in position from the mold chuck center by a first distance in a first direction, and the second scope center is deviated in position from the dispenser center by a distance smaller than twice the first distance in the first direction or a second direction opposite thereto. | 03-25-2010 |
20100072667 | IMPRINTING METHOD - An imprinting method for depositing resins to a substrate, bringing a mold into contact with the resins, and transferring a pattern formed on the mold to the resins includes a first imprinting process for transferring the pattern to a first resin and a second imprinting process for forming the pattern on a second resin in an area adjacent to an area formed during the first imprinting process. The amount of the second resin to be deposited during the second imprinting process is different from that of the first resin used during the first imprinting process so that a gap between the area formed during the first imprinting process and an area to be formed during the second imprinting process is filled. | 03-25-2010 |
20100078840 | IMPRINT APPARATUS AND METHOD OF MANUFACTURING ARTICLE - An apparatus for pressing resin on a shot region of a substrate and a mold to each other to form a resin pattern on the shot region, including: a mold chuck; an X-Y stage including a substrate chuck, the resin held by the substrate chuck and mold held by the mold chuck being pressed to each other in a Z-axis direction; a dispenser for dispensing the resin on the shot region; a scope for measuring, in an X-Y plane, a position of a substrate mark formed in each of a plurality of shot regions of the substrate held by the substrate chuck; and a reference mark formed on the X-Y stage. The X-Y stage has a moving range allowing the dispenser to dispense the resin on all shot regions of the substrate, and the position of the reference mark can be measured within the moving range of the X-Y stage. | 04-01-2010 |
20100233377 | IMPRINT APPARATUS AND METHOD - An imprint apparatus which includes an imprint head configured to hold a mold, and performs an imprint process including dispensing of a resin to a shot region on a substrate and pressing of the mold and the dispensed resin with each other, comprises a controller configured to control an order of the imprint process for a plurality of selected shot regions on the substrate, and a first dispenser and a second dispenser configured to dispense the resin, wherein the first dispenser is arranged on a side of a first direction with respect to the imprint head, and the second dispenser is arranged on a side of a second direction opposite to the first direction with respect to the imprint head. | 09-16-2010 |
20110151124 | IMPRINT APPARATUS, IMPRINT METHOD, AND ARTICLE MANUFACTURING METHOD - An imprint apparatus performs processing including dispensing of a resin onto an imprint region on a substrate and molding of the dispensed resin using a mold. The imprint apparatus includes a dispenser including a discharge section having an array of ports for discharging the resin, and configured to dispense the resin onto the imprint region; and a controller configured to control the dispenser, during a processing for a plurality of imprint regions of which nominal sizes are the same, such that switching is performed from one subset of the array of ports used for dispensing the resin onto one imprint region to another subset of the array of ports for dispensing the resin onto another imprint region. | 06-23-2011 |
20110198783 | PROCESS FOR PRODUCING A DEVICE USING A MOLD - In order to provide a mold and an imprint apparatus which permit adjustment of a depth of an imprint pattern after the imprint pattern is formed, the mold is constituted by a mold substrate including a first material and a surface layer, constituting a projection of the mold and including a second material, for forming a pattern on the photocurable resin material. The first material is more etchable than the second material. The first material and the second material have optical transmittances capable of curing the photocurable resin material with respect to at least a part of wavelength range of ultraviolet light. | 08-18-2011 |
20110236579 | IMPRINT APPARATUS AND METHOD OF MANUFACTURING ARTICLE - An imprint apparatus which cures a resin dispensed on a substrate while the resin and a pattern surface of a mold are in contact with each other, comprises a supply portion configured to supply a gas, used to accelerate filling of a concave portion of the pattern surface of the mold with the resin, to a space which the pattern surface of the mold faces, and a controller configured to control the supply portion to supply the gas to the space before the resin and the pattern surface of the mold are brought into contact with each other, wherein the supply portion is configured to supply the gas to the space via a porous portion formed in at least part of the mold. | 09-29-2011 |
20110278259 | PROCESS FOR PRODUCING A CHIP USING A MOLD - A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate | 11-17-2011 |
20130107279 | OPTICAL APPARATUS, POSITION DETECTION APPARATUS, MICROSCOPE APPARATUS, AND EXPOSURE APPARATUS | 05-02-2013 |
20130148091 | LITHOGRAPHY APPARATUS AND METHOD, AND METHOD OF MANUFACTURING ARTICLE - A lithography apparatus which positions a substrate based on measurement of a position of an alignment mark on the substrate to form a pattern on the substrate. The apparatus includes an acquisition unit configured to acquire a first required alignment precision in a first direction, and a second required alignment precision in a second direction different from the first direction, and a controller configured to determine, based on the first required alignment precision, a first condition for a first measurement process of measuring a position of an alignment mark in the first direction, to determine, based on the second required alignment precision, a second condition for a second measurement process of measuring a position of an alignment mark in the second direction. | 06-13-2013 |
20130148122 | METHOD OF MANUFACTURING DEVICE, AND SUBSTRATE - A method includes a first step of forming a circuit pattern and an alignment mark on a substrate and a second step of measuring a position of the alignment mark and positioning the substrate. The alignment mark includes a first linear pattern arranged on one side of a first straight line, a second linear pattern arranged on the other side of the first straight line, a third linear pattern arranged on one side of a second straight line, and a fourth linear pattern arranged on the other side of the second straight line. The first step includes determining total number of the third and fourth linear patterns to be formed and total number of the first and second linear patterns to be formed based on required precisions in directions along the first and second straight lines. | 06-13-2013 |
20130171570 | DRAWING APPARATUS, AND METHOD OF MANUFACTURING ARTICLE - The present invention provides a drawing apparatus including a stage having a reference mark, and configured to hold a substrate and to be moved, a charged particle optical system, a first measuring device having an optical axis spaced apart from an axis of the charged particle optical system by a first distance and configured to measure a position of an alignment mark formed on the substrate, a second measuring device having an optical axis spaced apart from the axis of the charged particle optical system by a second distance and configured to measure a position of the reference mark, and a processor configured to obtain a baseline of the first measuring device based on positions of the reference mark respectively measured by the first measuring device and the second measuring device. | 07-04-2013 |
20130188165 | LITHOGRAPHY APPARATUS, AND METHOD OF MANUFACTURING ARTICLE - A lithography apparatus includes: a rotation mechanism configured to rotate a substrate; a first measurement device configured to measure a position of an alignment mark formed on the substrate in a first direction with a first precision; a second measurement device configured to measure a position of an alignment mark formed on the substrate in a second direction with a second precision higher than the first precision; and a controller configured to control the rotation mechanism so that a direction, in which the substrate requires an overlay precision higher than another direction, is aligned with the second direction. | 07-25-2013 |
20130216954 | DRAWING APPARATUS, AND METHOD OF MANUFACTURING ARTICLE - A drawing apparatus, which draws a pattern on a substrate with a plurality of charged particle beams, includes: a charged particle optical system configured to emit the plurality of charged particle beams onto the substrate; and a controller configured to control an operation of the charged particle optical system. The controller is configured to control the operation so as to compensate for a distortion of the pattern that is determined based on first data of an undulation of a surface of the substrate and second data of an inclination of each of the plurality of charged particle beams with respect to an axis of the charged particle optical system. | 08-22-2013 |
20130230805 | DRAWING APPARATUS, REFERENCE MEMBER, AND METHOD OF MANUFACTURING ARTICLE - A drawing apparatus includes a charged particle optical system, a first measurement device including an image taking optical system and configured to measure a position of a reference mark in a first direction, a second measurement device configured to measure a position of the reference mark in the first direction based on an amount of charged particle beams that arrives thereat from the reference mark on which the charged particle beam are incident. The reference mark includes a first region having a first edge inclined with respect to a second direction perpendicular to the first direction and a second region having a second edge parallel to the second direction. A processor obtains a baseline based on measurement result with respect to the first region obtained by the first measurement device and measurement result with respect to the second region obtained by the second measurement device. | 09-05-2013 |
20130265575 | DETECTION APPARATUS, LITHOGRAPHY APPARATUS, CHARGED PARTICLE BEAM APPARATUS, AND ARTICLE MANUFACTURING METHOD - A detection apparatus includes an optical system including a polarization beam splitter and a quarter-wave plate. The optical system illuminates a mark via the polarization beam splitter and the quarter-wave plate in sequence, and directs light reflected from the mark via the quarter-wave plate and the polarization beam splitter in sequence towards a light-receiving element An airtight container configured to enclose therein at least part of the optical system includes, as a partition wall thereof, a light transmitting member arranged in an optical path between the polarization beam splitter and the quarter-wave plate. | 10-10-2013 |
20140107984 | GENERATION METHOD, DESIGN METHOD, MANUFACTURING METHOD OF OPTICAL SYSTEM, AND STORAGE MEDIUM - The present invention provides a generation method of generating, by a computer, initial data to be used when designing an optical system in which a plurality of lenses are arranged in an optical axis direction, wherein in an optical system model in which a thickness of each lens and intervals between the plurality of lenses are set to 0, letting m be the number of lenses, r | 04-17-2014 |
20140120199 | MOLD, IMPRINT METHOD, AND PROCESS FOR PRODUCING CHIP - A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate | 05-01-2014 |
20140153003 | MEASURING APPARATUS, IMPRINT SYSTEM, MEASURING METHOD, AND DEVICE MANUFACTURING METHOD - An measuring apparatus includes: a storage unit configured to store a relationship, regarding an irradiation condition predetermined based on a correlation between a characteristic of each of beams of reflected light obtained from a plurality of patterns different from one another in a thickness of a residual layer in a recessed portion and the thickness of the residual layer of each of the plurality of patterns, between the characteristic of the reflected light from each pattern and the thickness of the residual layer of the pattern; and a processing unit configured to, based on a characteristic of reflected light from a pattern formed on a substrate irradiated with light under the irradiation condition and the relationship stored in the storage unit, obtain a thickness of a residual layer in a recessed portion of the pattern formed on the substrate. | 06-05-2014 |
20140168629 | DRAWING APPARATUS, AND ARTICLE MANUFACTURING METHOD - Provided is a drawing apparatus including a plurality of drawing devices each of which is configured to draw a pattern on a substrate with a plurality of charged particle beams, the plurality of drawing devices performing respective drawings in parallel, the drawing apparatus comprising: a measuring device configured to measure a flatness of the substrate, wherein each of the plurality of drawing devices comprises: a charged particle optical system configured to irradiate the substrate with the plurality of charged particle beams; and a controller configured to control an operation of the charged particle optical system so as to compensate for distortion of the pattern which is determined by data of inclination of a charged particle beam of the charged particle beams with respect to an axis of the charged particle optical system and data of the flatness measured by the measuring device. | 06-19-2014 |
20140234467 | IMPRINT APPARATUS AND METHOD OF MANUFACTURING ARTICLE - An imprint apparatus which cures a resin dispensed on a substrate while the resin and a pattern surface of a mold are in contact with each other, comprises a supply portion configured to supply a gas, used to accelerate filling of a concave portion of the pattern surface of the mold with the resin, to a space which the pattern surface of the mold faces, and a controller configured to control the supply portion to supply the gas to the space before the resin and the pattern surface of the mold are brought into contact with each other, wherein the supply portion is configured to supply the gas to the space via a porous portion formed in at least part of the mold. | 08-21-2014 |
20140320836 | LITHOGRAPHY APPARATUS, LITHOGRAPHY METHOD, AND METHOD FOR MANUFACTURING DEVICE - An apparatus includes an optical system configured to irradiate a surface of a substrate with a beam, a control unit configured to control a position of the irradiation of the beam, and a first measurement unit and a second measurement unit each configured to measure a position of a mark formed on the substrate. The second measurement unit is placed at a position closer to an optical axis of the optical system than the first measurement unit is. Based on a position measurement value measured by the first measurement unit and position measurement values measured at different timings by the second measurement unit, the control unit controls the position of the beam irradiated to the substrate. The position measurement values measured at the different timings are values obtained from the same mark or values obtained from two marks adjacent to a common shot area. | 10-30-2014 |
20140322654 | LITHOGRAPHY APPARATUS, AND METHOD FOR MANUFACTURING ARTICLE - A lithography apparatus for substrate patterning, includes a substrate stage having a reference mark, an optical system irradiating the substrate with the charged particle beam, a first measurement device measuring a position of an alignment mark formed on the substrate, a second measurement device having an optical axis apart from an axis of the optical system by a distance shorter than that of the first measurement device, and measuring a position of the reference mark, a processor obtaining a base line of the first measurement device based on positions of the reference mark respectively measured by the first and second measurement device and a base line of the second measurement device, the position of the reference mark being measured by the second measurement device based on an optical signal obtained via the reference mark with the stage moved. | 10-30-2014 |
20140322655 | STAGE APPARATUS, LITHOGRAPHY APPARATUS, AND METHOD OF MANUFACTURING ARTICLE - A stage apparatus includes first, second, third, and fourth stages arranged along a plane defined by first and second axes orthogonal to each other, each of the first to fourth stages holding an article and being subjected to scanning along the plane, and a controller configured to control the scanning of the first to fourth stages in synchronization such that a pair of the first and second stages and a pair of the third and fourth stages are respectively positioned symmetrically to each other with respect to the first axis and a pair of the first and third stages and a pair of the second and fourth stages are respectively positioned symmetrically to each other with respect to the second axis. | 10-30-2014 |
20140322831 | LITHOGRAPHY APPARATUS, LITHOGRAPHY METHOD, AND METHOD OF MANUFACTURING ARTICLE - A lithography apparatus for performing pattern formation on a substrate includes a stage configured to hold the substrate and be movable, an optical system configured to irradiate the substrate with an energy beam for the pattern formation, and a controller configured to set an arrangement of first and second marks for overlay inspection, which is variable with respect to a first substrate for condition setting, and control the stage and the optical system so that first processing for forming the first mark on the first substrate without the pattern formation and second processing for forming the second mark on the first substrate with the pattern formation are performed based on the set arrangement. | 10-30-2014 |
20140322833 | IRRADIATION APPARATUS FOR IRRADIATING CHARGED PARTICLE BEAM, METHOD FOR IRRADIATION OF CHARGED PARTICLE BEAM, AND METHOD FOR MANUFACTURING ARTICLE - An apparatus includes an optical system configured to irradiate a substrate with a charged particle beam, a control unit configured to control an irradiation position of the charged particle beam, and a first measurement unit and a second measurement unit each configured to measure a surface position of the substrate. The first measurement unit and the second measurement unit have different characteristics in terms of charging. The control unit controls the irradiation position of the charged particle beam based on values measured by the first measurement unit and the second measurement unit. | 10-30-2014 |
20150022796 | INTERFEROMETER, LITHOGRAPHY APPARATUS, AND METHOD OF MANUFACTURING ARTICLE - An interferometer includes: an optical system configured to generate interfering light by dividing light from a light source, and combining reference light and measurement light; a detector configured to detect the interfering light generated by the optical system; and an optical member configured to give spatial coherence to the light from the light source before the detector detects the light from the light source. The optical member gives higher spatial coherence in a second direction serving as a direction of a line of intersection of a cross section of a beam of the light incident on the optical member, and a plane including optical paths of the light from the light source before being divided by the optical system, the reference light, the measurement light, and the interfering light, than in a first direction perpendicular to the plane. | 01-22-2015 |