Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Hideki Ina, Tokyo JP

Hideki Ina, Tokyo JP

Patent application numberDescriptionPublished
20080285052SHAPE MEASURING APPARATUS, EXPOSURE APPARATUS, AND COMPUTER - A shape measuring apparatus for measuring the shape of a measurement target surface includes an interferometer and computer. The interferometer senses interference light formed by measurement light from the measurement target surface and reference light by a photoelectric converter, while changing the light path length of the measurement light or the reference light. The computer Fourier-transforms a first interference signal sensed by the photoelectric converter to obtain a phase distribution and an amplitude distribution, shapes the amplitude distribution, inversely Fourier-transforms the phase distribution and the shaped amplitude distribution to obtain a second interference signal, and determines the shape of the measurement target surface based on the second interference signal.11-20-2008
20090101037GAP MEASURING METHOD, IMPRINT METHOD, AND IMPRINT APPARATUS - A gap measuring method for measuring a gap between two members by irradiating the two members with light is constituted by preparing a first member and a second member which are disposed opposite to each other; irradiating the first member and the second member with light from one member side to obtain spectral data about intensity of reflected light or transmitted light from the other member side; and determining a gap between the first member and the second member by comparing the obtained spectral data with a database in which a gap length and an intensity spectrum are correlated with each other.04-23-2009
20090108483ALIGNMENT METHOD, IMPRINT METHOD, ALIGNMENT APPARATUS, AND POSITION MEASUREMENT METHOD - In an alignment method for effecting alignment between two plate-like objects, a first plate-like object provided with a first alignment mark and a second plate-like object provide with a second alignment mark are disposed opposite to each other. A first area and a second area are provided at mutually nonoverlapping positions in an image pickup area for being observed through an image pickup device. Images of the first and second alignment marks are picked up by the image pickup device from a direction substantially perpendicular to an in-plane direction of the first and second plate-like objects. Alignment control is effected by using first information about a deviation of the first alignment mark from a predetermined position in the first area and second information about a deviation of the second alignment mark from a predetermined position in the second area.04-30-2009
20090138135ALIGNMENT METHOD, EXPOSURE METHOD, PATTERN FORMING METHOD, AND EXPOSURE APPARATUS - An alignment method is provided in which a substrate including first and second layers is aligned in forming a second pattern in the second layer. The method includes storing first alignment measurement data to be used in alignment performed in forming a first pattern and a second alignment mark in the second layer, the first alignment measurement data obtained by measuring a first alignment mark provided in the first layer; obtaining second alignment measurement data by measuring the second alignment mark through a resist applied over the second layer; obtaining third alignment measurement data by measuring the first alignment mark through the resist; and performing alignment of the substrate in accordance with a first difference between the first and second alignment measurement data, or in accordance with the first difference and a second difference between the first and third alignment measurement data.05-28-2009
20090152239PROCESS FOR PRODUCING A CHIP USING A MOLD - A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate 06-18-2009
20090152753MOLD, IMPRINT METHOD, AND PROCESS FOR PRODUCING A CHIP - A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate 06-18-2009
20090219499SURFACE SHAPE MEASURING APPARATUS, EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD - A surface shape measuring apparatus includes an illumination system and a light receiving system. The illumination system splits wide-band light from a light source into measurement light and reference light, illuminates the measurement light to obliquely enter a surface of the film, and illuminates the reference light to obliquely enter a reference mirror. The light receiving system combines the measurement light reflected by the surface of the film and the reference light reflected by the reference mirror with each other and introduces the combined light to a photoelectric conversion element. An incident angle of the measurement light upon the surface of the film and an incident angle of the reference light upon the reference mirror are each larger than the Brewster's angle. S-polarized light and p-polarized light included in the measurement light entering a surface of the substrate have equal intensity on the photoelectric conversion element.09-03-2009
20090283938IMPRINT APPARATUS, IMPRINT METHOD, AND MOLD FOR IMPRINT - An imprint apparatus for imprinting a mold pattern onto a substrate or a member on the substrate includes a light source for irradiating a surface of the mold disposed opposite to the substrate and a surface of the substrate with light; an optical system for guiding the light from the light source to the surface of the mold and the surface of the substrate and guiding reflected lights from these surfaces to a spectroscope; a spectroscope for dispersing the reflected lights guided by the optical system into a spectrum; and an analyzer for analyzing a distance between the surface of the mold and the surface of the substrate. The analyzer calculates the distance between the surface of the mold and the surface of the substrate by measuring a distance between the surface of the mold and a surface formed at a position away from the surface of the mold.11-19-2009
20090286172SURFACE SHAPE MEASUREMENT APPARATUS AND EXPOSURE APPARATUS - A surface shape measurement apparatus is configured to measure a surface shape of an object to be measured, and includes a beam splitter configured to split white light from a light source into two light beams, a pair of prisms each configured to increase an incident angle of each light beam that has been split by the beam splitter and directed to the object or a reference surface, each prism having an antireflection part that is formed at a period of a wavelength of the white light or smaller and has a moth-eye shape, a superimposition unit configured to superimpose object light from the object with reference light from the reference surface and has passed the second prism, and to generate white interference light, and a Lyot filter configured to discretely separate the white interference light for each of a plurality of wavelengths.11-19-2009
20100031833IMPRINT APPARATUS, IMPRINT METHOD, AND ARTICLE MANUFACTURING METHOD - There is provided an imprint apparatus configured to perform an imprint in which a resin on a substrate is molded using a mold and a pattern is formed on the substrate. The apparatus includes a press unit configured to press the resin on the substrate and the mold to each other, a cure unit configured to irradiate light to the resin molded by the mold to cure the resin, and a movement unit configured to move the mold and the substrate, from a position at which the press is performed by the press unit to a position at which the light is irradiated by the cure unit, and from the position at which the light is irradiated by the cure unit to a position at which the mold is released.02-11-2010
20100072649IMPRINT APPARATUS AND ARTICLE MANUFACTURING METHOD - An imprint apparatus molds resin dispensed on a shot region of a substrate with a mold and forms a pattern of resin on the shot region. The apparatus includes a mold stage configured to hold the mold, a substrate stage configured to hold the substrate, a drive mechanism configured to change a relative positional relationship between the mold stage and the substrate stage in an X-Y plane that defines a coordinate of the shot region and a Z-axis direction perpendicular to the X-Y plane, and a controller. The controller is configured to control the drive mechanism so that the mold and the shot region perform relative vibration, in the X-Y plane, with respect to a relative position where the mold and the shot region align, and a distance between the mold and the shot region decreases in the Z-axis direction in parallel with the vibration, and the resin is molded by the mold.03-25-2010
20100072653IMPRINTING APPARATUS AND METHOD THEREFOR - There is provided an imprinting apparatus that transfers a pattern of a mold to a resin on a substrate, the imprinting apparatus including a deposition mechanism configured to deposit the resin onto the substrate; a first driving mechanism configured to change a relative position, on a plane parallel to the surface of the substrate, of the substrate and the mold; a second driving mechanism configured to change the relative position, on a plane parallel to the surface of the substrate, of the substrate and the deposition mechanism; and a control unit configured to control the deposition mechanism and the driving mechanism so as to perform a resin deposition process of depositing the resin onto the substrate and an imprint process of transferring the pattern of the mold to the resin on the substrate in parallel.03-25-2010
20100072664IMPRINT APPARATUS AND METHOD OF MANUFACTURING ARTICLE - An imprint apparatus for pressing resin and a mold to each other in a Z-axis direction to form a resin pattern on a shot region includes: a mold chuck; an X-Y stage; a reference mark formed on the stage; a first scope configured to measure a positional deviation in an x-y plane between a mold mark and the reference mark; a second scope configured to measure a position of a substrate mark in the plane not via the mold mark; and a dispenser configured to dispense resin. In the plane, the dispenser center is deviated in position from the mold chuck center by a first distance in a first direction, and the second scope center is deviated in position from the dispenser center by a distance smaller than twice the first distance in the first direction or a second direction opposite thereto.03-25-2010
20100072667IMPRINTING METHOD - An imprinting method for depositing resins to a substrate, bringing a mold into contact with the resins, and transferring a pattern formed on the mold to the resins includes a first imprinting process for transferring the pattern to a first resin and a second imprinting process for forming the pattern on a second resin in an area adjacent to an area formed during the first imprinting process. The amount of the second resin to be deposited during the second imprinting process is different from that of the first resin used during the first imprinting process so that a gap between the area formed during the first imprinting process and an area to be formed during the second imprinting process is filled.03-25-2010
20100078840IMPRINT APPARATUS AND METHOD OF MANUFACTURING ARTICLE - An apparatus for pressing resin on a shot region of a substrate and a mold to each other to form a resin pattern on the shot region, including: a mold chuck; an X-Y stage including a substrate chuck, the resin held by the substrate chuck and mold held by the mold chuck being pressed to each other in a Z-axis direction; a dispenser for dispensing the resin on the shot region; a scope for measuring, in an X-Y plane, a position of a substrate mark formed in each of a plurality of shot regions of the substrate held by the substrate chuck; and a reference mark formed on the X-Y stage. The X-Y stage has a moving range allowing the dispenser to dispense the resin on all shot regions of the substrate, and the position of the reference mark can be measured within the moving range of the X-Y stage.04-01-2010
20100233377IMPRINT APPARATUS AND METHOD - An imprint apparatus which includes an imprint head configured to hold a mold, and performs an imprint process including dispensing of a resin to a shot region on a substrate and pressing of the mold and the dispensed resin with each other, comprises a controller configured to control an order of the imprint process for a plurality of selected shot regions on the substrate, and a first dispenser and a second dispenser configured to dispense the resin, wherein the first dispenser is arranged on a side of a first direction with respect to the imprint head, and the second dispenser is arranged on a side of a second direction opposite to the first direction with respect to the imprint head.09-16-2010
20110151124IMPRINT APPARATUS, IMPRINT METHOD, AND ARTICLE MANUFACTURING METHOD - An imprint apparatus performs processing including dispensing of a resin onto an imprint region on a substrate and molding of the dispensed resin using a mold. The imprint apparatus includes a dispenser including a discharge section having an array of ports for discharging the resin, and configured to dispense the resin onto the imprint region; and a controller configured to control the dispenser, during a processing for a plurality of imprint regions of which nominal sizes are the same, such that switching is performed from one subset of the array of ports used for dispensing the resin onto one imprint region to another subset of the array of ports for dispensing the resin onto another imprint region.06-23-2011

Patent applications by Hideki Ina, Tokyo JP