Patent application number | Description | Published |
20130200534 | SEALANT LAMINATED COMPOSITE, SEALED SEMICONDUCTOR DEVICES MOUNTING SUBSTRATE, SEALED SEMICONDUCTOR DEVICES FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - Described herein is a sealant laminated composite for collectively sealing a semiconductor device's mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor device's forming surface of a wafer on which semiconductor devices are formed. The composite can include a support wafer and an uncured resin layer constituted of an uncured thermosetting resin formed on one side of the support wafer. In certain aspects, the sealant laminated composite is very versatile, even when a large diameter or thin substrate or wafer is sealed. In certain aspects, this can prevent the substrate or wafer from warping and the semiconductor devices from peeling; can collectively seal a semiconductor device's mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor device's forming surface of a wafer on which semiconductor devices are formed on a wafer level; and can provide a sealant laminated composite that is excellent in the heat resistance and humidity resistance after sealing. | 08-08-2013 |
20130241087 | SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME - A method for producing a semiconductor apparatus with a mold including an upper mold half and a lower mold half, includes: an arranging step of arranging on one of the upper mold half and the lower mold half of the mold a substrate on which a semiconductor device is mounted, the mold being kept at a room temperature or heated to a temperature up to 200° C., and arranging on the other of the upper mold half and the lower mold half a substrate on which no semiconductor device is mounted; an integrating step of integrating the substrate on which the semiconductor device is mounted and the substrate on which no semiconductor device is mounted by molding a thermosetting resin with the mold on which the substrates are arranged; and a step of dicing the integrated substrates taken out of the mold to obtain an individualized semiconductor apparatus. | 09-19-2013 |
20140091483 | METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS - A method of manufacturing a semiconductor apparatus includes: a charging step of charging the thermosetting resin in excess of an amount necessary for forming the sealing layer to fill the inside of the first cavity with the thermosetting resin and discharging an excess of the thermosetting resin from the first cavity; an integrating step of integrating the substrate on which the semiconductor device is mounted, the substrate on which no semiconductor device is mounted and the sealing layer by molding the thermosetting resin while pressurizing the upper mold and the lower mold; and a dicing step of extracting the integrated substrates from the molding mold and dicing the integrated substrates to obtain an individual semiconductor apparatus. | 04-03-2014 |
20140138856 | FIBER-CONTAINING RESIN SUBSTRATE, DEVICE-MOUNTING SUBSTRATE AND DEVICE-FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS - A fiber-containing resin substrate for collectively encapsulating a semiconductor-device-mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor-device-forming surface of a wafer on which a semiconductor device is formed, including a resin-impregnated fibrous base material which is obtained by impregnating a fibrous base material with a thermosetting resin and semi-curing or curing the thermosetting resin and has a linear expansion coefficient (ppm/° C.) in an X-Y direction of less than 3 ppm, and an uncured resin layer formed of an uncured thermosetting resin on one side of the resin-impregnated fibrous base material. | 05-22-2014 |
20140138857 | ENCAPSULANT EQUIPPED WITH SUPPORTING SUBSTRATE, ENCAPSULATED SUBSTRATE HAVING SEMICONDUCTOR DEVICES MOUNTING THEREON, ENCAPSULATED WAFER HAVING SEMICONDUCTOR DEVICES FORMING THEREON, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - The invention provides an encapsulant equipped with the supporting substrate which is an encapsulant for collectively encapsulating a semiconductor devices mounting surface of a substrate having semiconductor devices mounting thereon or a semiconductor devices forming surface of a wafer having semiconductor devices forming thereon, and the encapsulant equipped with the supporting substrate comprises a supporting substrate having a difference of a linear expansion coefficient from that of the substrate or the wafer of 5 ppm or less and a thermosetting resin layer being laminated, wherein the thermosetting resin layer has a shape having a height difference to a thickness direction. | 05-22-2014 |
20140264956 | SEALANT LAMINATED COMPOSITE, SEALED SEMICONDUCTOR DEVICES MOUNTING SUBSTRATE, SEALED SEMICONDUCTOR DEVICES FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - Disclosed is a sealant laminated composite for collectively sealing a semiconductor devices mounting surface of a substrate on which semiconductor devices may be mounted or a semiconductor devices forming surface of a wafer on which semiconductor devices may be formed, including a support wafer that may be composed of silicon and an uncured resin layer that may be constituted of an uncured thermosetting resin formed on one side of the support wafer. | 09-18-2014 |
20150028497 | ENCAPSULANT WITH BASE FOR USE IN SEMICONDUCTOR ENCAPSULATION, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - The present invention provides an encapsulant with a base for use in semiconductor encapsulation, for collectively encapsulating a device mounting surface of a substrate on which semiconductor devices are mounted, or a device forming surface of a wafer on which semiconductor devices are formed, the encapsulant comprising the base, an encapsulating resin layer composed of an uncured or semi-cured thermosetting resin formed on one surface of the base, and a surface resin layer formed on the other surface of the base. The encapsulant enables a semiconductor apparatus having a good appearance and laser marking property to be manufactured. | 01-29-2015 |
20150197885 | SURFACE-MODIFIED GLASS FIBER FILM - The present invention provides a surface-modified glass fiber film having its surface modified by a silicon-containing compound, and a value of a common flexural rigidity of the surface-modified glass fiber film as measured by the method described in JIS R 3420 is in the range of 3 to 100 times as compared to a value of the common flexural rigidity of an unmodified glass fiber film. | 07-16-2015 |