Heyen
André Heyen, Malmedy BE
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20140077054 | Support Ultraportable multifonctions - Ultraportable support (A, B, B′, C, D, E), comprising at least two feet ( | 03-20-2014 |
Andre R.g. Heyen, Malmedy BE
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20120142260 | ABRASIVE ARTICLE FOR SHAPING OF INDUSTRIAL MATERIALS - An abrasive article including a base having an annular shape defining a central opening; and a mounting assembly coupled to the base, wherein a portion of the mounting assembly is under a compressive force, and a grinding segment coupled to the mounting member. | 06-07-2012 |
Andre R. G. Heyen, Bertrange LU
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20090199692 | Circular Saw Blade With Offset Gullets - A saw blade includes a circular core having a plurality of cutting elements along its periphery, and a central arbor hole. One or more offset gullets extend radially inward from the perimeter of the core. Each offset gullet includes a first opening in one side of the core and a second opening in the other side of the core. The first and second openings are adjacent but at least partially offset from one another, so that at least a portion of the offset gullet is not see-through. | 08-13-2009 |
20090199693 | Circular Saw Blade With Elliptical Gullets - A saw blade includes a circular core having a plurality of cutting elements along its periphery, and a central arbor hole. One or more gullets extend radially inward from the perimeter of the core. Each gullet includes a shape that includes at least one elongated curve that enlarges radii in gullet areas prone to cracking, relative to other gullet areas. | 08-13-2009 |
André R. G. Heyen, Malmedy BE
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20140051340 | ABRASIVE ARTICLE FOR SHAPING OF INDUSTRIAL MATERIALS - An abrasive article including a base having an annular shape defining a central opening; and a mounting assembly coupled to the base, wherein a portion of the mounting assembly is under a compressive force, and a grinding segment coupled to the mounting member. | 02-20-2014 |
20140069023 | ABRASIVE ARTICLE INCORPORATING AN INFILTRATED ABRASIVE SEGMENT - An abrasive article includes a base, an abrasive member comprising three distinct phases bonded to each other including abrasive particles, a metal matrix, and an infiltrant. The abrasive article further includes a backing region between the abrasive member and the base, wherein the backing region comprises a laser welded bond joint. | 03-13-2014 |
André R. G. Heyen, Malmedy BE
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20110165826 | ABRASIVE ARTICLE INCORPORATING AN INFILTRATED ABRASIVE SEGMENT - An abrasive article includes a base, an abrasive member comprising three distinct phases bonded to each other including abrasive particles, a metal matrix, and an infiltrant. The abrasive article further includes a backing region between the abrasive member and the base, wherein the backing region comprises a laser welded bond joint. | 07-07-2011 |
Guenter Heyen, Mount Gilead, NC US
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20150107749 | Process and Device for Gluing Dried Fibers Designated for the Production of Fiberboards - The present invention provides in a process for obtaining glued dried fibers suitable for the production of fiberboards, characterized by the following steps: carrying dried fibers in an air stream for the removal of high density contaminants from the dried fibers by means of gravity, and gluing said dried fibers. The invention thereto also provides a modified air density separator comprising one or more injection means for a gluing composition. The invention also relates to a fiber board manufacturing plant comprising an air density separator according to an embodiment of the invention. | 04-23-2015 |
Janet Heyen, Penfield, NY US
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20150189761 | METHOD FOR DEPOSITING AND CURING NANOPARTICLE-BASED INK - A method for forming a conductive pattern on a substrate deposits, onto a surface of the substrate, a nanoparticle ink that comprises nanoparticles of a conductive or semiconductor material, at least one low boiling point solvent, and from 0.1 weight % to 50 weight % of a high boiling point solvent. The method forms a partially wet patterned substrate by drying the deposited nanoparticle ink to a wetness range between about 3 weight % and 8 weight % solvent. The method directs a patterned illumination of laser light to cure the deposited ink pattern on the partially wet patterned substrate. | 07-02-2015 |
Janet Heyen, Rochester, NY US
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20140287158 | PERFORMANCE OF CONDUCTIVE COPPER PASTE USING COPPER FLAKE - A conductive paste for screen application has a mixture of copper flake having a mean diameter between 1.0-8.0 micrometers and copper nanoparticles having a mean diameter from 10 nm to 100 nm, wherein the ratio of the copper flake to the nanoparticles is between 2:1 and 5:1 by weight; and a resin comprising about half of a polymer having a molecular weight in excess of 10,000 and one or more solvents. | 09-25-2014 |
20140287159 | CONDUCTIVE PASTE FORMULATIONS FOR IMPROVING ADHESION TO PLASTIC SUBSTRATES - A conductive paste for screen application to a substrate has a mixture of copper particles having a mean diameter between 1.0-5.0 micrometers and polymer-coated copper nanoparticles having a mean diameter from 10 nm to 100 nm. The ratio of the copper particles to the nanoparticles is between 2:1 and 5:1 by weight. The paste has a resin comprising a binder portion and a solvent portion, wherein the binder portion is about half of the resin by weight, and a plasticizer having a boiling point above about 200 degrees C., wherein the plasticizer is from 1-3% of the paste, by weight. | 09-25-2014 |
Johann Heyen, Muenchen DE
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20090321917 | Electrical Component - The invention discloses an electrical component with a carrier substrate, on which at least one semiconductor chip is mounted. Terminal areas are arranged on the underside of the carrier substrate and contact areas designed for the assembly with semiconductor chips are arranged on the upper side. The carrier substrate has a functional area that is divided into sections, wherein each section is assigned at least one function such as, e.g., as a filter, a frequency-separating filter, a balun, etc. A separate area of the carrier substrate is assigned to each section. The following applies to at least one of the sections: the contact area and/or the terminal area that is conductively connected to the section lies outside the base of this section. The connecting line that conductively connects the input or output of the respective section to the contact area and/or the terminal area is preferably shielded from the section by a ground area. | 12-31-2009 |
Johann Heyen, Munich DE
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20080212283 | Electrical Component - According to one variant, an electrical component is specified, with a substrate ( | 09-04-2008 |
Josh Heyen, Indianapolis, IN US
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20120028327 | MATERIALS AND METHODS FOR IDENTIFYING AND USING YEAST STRAINS THAT METABOLIZE PENTOSE SUGARS IN THE PRESENCE OF D-GLUCOSE - Disclosed herein are materials and methods for creating and/or isolating variants of yeasts especially variants of | 02-02-2012 |