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Heydari, CA

Ali Heydari, Albany, CA US

Patent application numberDescriptionPublished
20080230894Carbon nanotubes for active direct and indirect cooling of electronics device - A system for cooling a semiconductor device is disclosed. The system includes a lid encasing the semiconductor device, a first plurality of carbon nanotubes disposed within the lid, and a fluid system configured to pass a fluid through the lid. Furthermore, a second system for cooling a semiconductor device is disclosed. The second system includes a lid, a first plurality of carbon nanotubes disposed within the lid, and a fluid system configured to pass a fluid through the lid. The lid is configured to be mounted over and encase the semiconductor device. Additionally, a method for cooling a semiconductor device is disclosed. The method includes disposing a first plurality of carbon nanotubes within a lid, mounting the lid over the semiconductor device, and passing a fluid through the lid.09-25-2008
20100032141 COOLING SYSTEM UTILIZING CARBON NANOTUBES FOR COOLING OF ELECTRICAL SYSTEMS - A cooling system to cool the airflow through a electrical system includes a CNT heat exchanger module disposed within a housing of the electrical system, a cooling device configured to receive a coolant, a unit board disposed within the housing of the electrical system, and an air flow device configured to pass air across at least a portion of the unit board and at least a portion of the CNT heat exchanger module. The CNT heat exchanger module includes a member having a hole defined therethrough and a plurality of carbon nanotubes (CNTs) attached to the member. The coolant is propagated through the hole in the member so as to dissipate the heat generated by the electrical system.02-11-2010
20100175851MODULAR ABSORPTION HEAT SINK DEVICES FOR PASSIVE COOLING OF SERVERS AND OTHER ELECTRONICS - A passive heat sink for cooling an electronic component such as a high-performance processor. The heat sink includes a shell with a surface that is positionable adjacent a heat generating surface of the electronic component. The shell includes a heat exchanger portion with cooling fins extending outward and positioned in a fan-provided airflow. A generator compartment is provided within the shell with a generator vessel for containing an absorbent, and the generator compartment is maintained at a pressure lower than ambient. The generator compartment conducts heat away from the electronic component to the absorbent in the generator vessel. An absorber compartment, at a pressure lower than the generator compartment, is provided within the shell above the generator compartment, and, in use, an absorption refrigeration cycle contained within the shell is activated by heat from the electronic component. A bubble pump moves absorbent from the generator compartment to the absorber compartment.07-15-2010

Ali Heydari, San Diego, CA US

Patent application numberDescriptionPublished
20090308081INTEGRATED CIRCUIT CHIP COOLING USING MAGNETOHYDRODYNAMICS AND RECYCLED POWER - Some embodiments of the present invention provide a system that cools an integrated circuit (IC) chip within a computer system. During operation, the system converts heat generated by a heat-generating device within the computer system during operation of the computer system into thermoelectric power. Next, the system supplies the thermoelectric power to drive a fluid pump. Finally, the system uses the fluid pump to conduct heat away from the IC chip.12-17-2009

Ali Heydari, Berkeley, CA US

Patent application numberDescriptionPublished
20110128699COOLING SERVERS IN A DATA CENTER USING FANS EXTERNAL TO SERVERS - To avoid the need to operate in-chassis fans to cool rack-mounted servers in a data center, the data center is arranged into a hot aisle and a cold aisle. The cold aisle is adjacent to a first side of the rack mounted servers and receives cold air from a cold air supply unit. The hot aisle is adjacent to a second side of the rack-mounted servers and has a lower pressure than the cold aisle. Because of the pressure difference between the cold aisle and the hot aisle, cold air flows through the rack-mounted servers, cooling electronic equipment therein, into the hot aisle. Control systems are used to obtain sufficient cooling.06-02-2011
20110154842COOLING COMPUTING DEVICES IN A DATA CENTER WITH AMBIENT AIR COOLED USING HEAT FROM THE COMPUTING DEVICES - To reduce power consumption and more efficiently cool computing devices in a data center, an air supply unit supplies air from outside the data center to an air handling unit, which cools servers within the data center using the supplied air. Using air from outside the data center, rather than recirculating and cooling air from within the data center, reduces the power consumption of the data center. In an embodiment, a chiller and/or an evaporative cooling system are coupled to the air supply unit to allow further cooling of the outside air before it is circulated. Heat generated by the servers within the data center is collected, for example using thermal pathways coupled to server components, and used by the chiller in an absorption or adsorption process to further reduce power consumption of the data center and allow the air handling unit to further cool the outside air.06-30-2011

Gill Heydari, Menlo Park, CA US

Patent application numberDescriptionPublished
20100296423Multi-Medium Signal Transmission System and Method - A system and method are provided for transmitting and receiving a data stream through multiple paths in different mediums. A data stream can be demuxed into separate sub-streams and the separate sub-streams can be communicated to a device through different mediums, where the separate sub-streams can be muxed into a single substream at the receiving device. For example, one sub-stream can be conveyed wirelessly through an antenna, or through several antennas via MIMO transmission, and one sub-stream can be conveyed through a wire medium, such as a telephone line or a power line. Various pre-processing techniques, such as STBC encoding, FEC encoding, and MIMO matrix encoding as well as different methods of demuxing can be implemented to improve reliability and throughput of the system.11-25-2010

Payam Heydari, Irvine, CA US

Patent application numberDescriptionPublished
20080317160CODE-MODULATED PATH-SHARING MULTI-SIGNAL SYSTEMS - Described herein are code-modulated multi-signal systems. In one embodiment, a multi-signal system receives multiple input signals and code-modulates each input signal with a unique code to distinguish the input signal from the other input signals. The input signals may come from multiple antennas, multiple sensors, multiple channels, etc. The code-modulated signals are then combined into a combined signal that is sent through shared blocks and/or transmitted across a shared medium in a shared path. After shared processing and/or shared transmission, the individual signals are recovered using matched filters. Each matched filter contains a code corresponding to one of the unique codes for recovering the corresponding signal from the combined signal. The recovered signals may then be inputted to additional processors for further processing.12-25-2008
20090021307MULTI-BAND, INDUCTOR RE-USE LOW NOISE AMPLIFIER - Described herein are multi-band LNAs that reuse inductors for different frequency bands to minimize chip area. In an embodiment, a multi-band LNA is capable of operating in a narrowband (NB) and a wideband (WB) while reusing at least one input impedance matching inductor and at least one load inductor for both bands. The reuse of inductors results in a more efficient use of chip area. In an exemplary embodiment, the LNA comprises a common source transistor and a common gate transistor. In this embodiment, the LNA operates in a common source configuration using the common source transistor to amplify input signals in the NB, and operates in a common gate configuration using the common gate transistor to amplify input signals in the WB. The LNA reuses an input impedance matching inductor and a load inductor in both configurations, and thus both bands.01-22-2009
20090075613DISTRIBUTED RF FRONT-END FOR UWB RECEIVERS - Described herein are ultra wide-band distributed RF (UWB-DRF) front-end receivers comprising composite cells distributed along transmission lines, where each composite cell comprises a low-noise amplifier (LNA) merged with a mixer. By merging the LNA and the mixer in each composite cell, the power consumption and chip area of the RF front-end is reduced. Further, the distributed architecture of the RF front-end allows it to operate over a wide bandwidth by absorbing the parasitic capacitances of the composite cells into the transmission lines of the RF-front end. Embodiments of the RF front-end provide wideband flat gain, low noise figure (NF), wideband linearity, and wideband matching at the inputs of the RF front-end. In an embodiment, a programmable resistance at the termination of the RF transmission line allows the RF front-end to trade off a few decibels of mismatch at the RF input for higher gain and lower NF.03-19-2009
20090088115Novel Distributed Direct Conversion Receiver (DDCR) for UWB Systems - A novel DDCR RF front-end for use in UWB applications combining a distributed approach which provides wideband functionality of the RF front-end with I-Q requirement of DCRs. The distributed architecture uses composite cells of a merged LNA and mixer along the input RF T-line.04-02-2009

Patent applications by Payam Heydari, Irvine, CA US