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Heung-Kyu
Heung-Kyu Jang, Suwon-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20080310898 | IMAGE FORMING APPARATUS - An image forming apparatus having an automatic document feeding unit so as to successively read documents is disclosed. The image forming apparatus includes an image forming unit to form an image on a printing medium, an image reading unit pivotally coupled to an upper portion of the image forming unit to expose and shield a top of the image forming unit, an automatic document feeding unit pivotally coupled to an upper portion of the image reading unit to expose and shield a top of the image reading unit, and a locking device to selectively expose any one of the top of the image forming unit and the top of the image reading unit. Since the locking device prevents the top of the image forming unit and the top of the image reading unit from being simultaneously exposed, the automatic document feeding unit can be prevented from being damaged due to the simultaneous exposure of the top of the image forming unit and the top of the image reading unit. | 12-18-2008 |
| 20100178091 | IMAGE FORMING APPARATUS INCLUDING A REVERSING FEEDING UNIT - Disclosed is an image forming apparatus including a reverse-feeding unit. The reverse-feeding unit includes a frame which forms a first feeding path along which a printing medium is fed and a second feeding path which is branched off from the first feeding path, a guide plate which rotates between a first position in which the printing medium fed along the first feeding path is supported and a second position in which the supported printing medium is directed towards the second feeding path, and a plate driving unit which comprises an actuator which actuates the guide plate, a driving source which drives the actuator, and an electronic clutch which selectively transmits a driving force of the driving source to the actuator. | 07-15-2010 |
Heung-Kyu Kim, Geongju-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100090351 | ELECTRO COMPONENT PACKAGE - An electro component package is disclosed. The electro component package in accordance with an embodiment of the present invention includes a first package substrate having a first chip mounted on an upper surface thereof, the first chip having a through-via formed therein; a second package substrate being separated from the first package substrate and having a second chip mounted on an upper surface thereof; and a connection substrate having one end connected with an upper surface of the first chip and the other end connected with an upper surface of the second chip, the connection substrate electrically connecting the first chip with the second chip. | 04-15-2010 |
Heung-Kyu Kwon, Gumi-Dong KR
| Patent application number | Description | Published |
|---|---|---|
| 20090317947 | Semiconductor package with heat sink, stack package using the same and manufacturing method thereof - A semiconductor package may include a heat sink. The heat sink may be disposed above and spaced apart from a substrate, which may support a semiconductor chip. The heat sink may have a hole. A liquid molding compound may be provided through the hole of the heat sink to form an encapsulant. The encapsulant may seal the semiconductor chip, leaving an upper portion of the heat sink exposed. A tape supporting the heat sink may be provided on the substrate. The tape may be removed after the encapsulant is provided. | 12-24-2009 |