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Hesen

Leonardus Hesen, Hegelsom NL

Patent application numberDescriptionPublished
20120076231RF DIVIDER USING DIRECT DIGITAL SYNTHESIS - An RF divider directly synthesizes a desired RF as a digital pattern that can be programmed and output at a VCO frequency. An exemplary RF divider comprises a pre-sequencer and a parallel-to-serial converter. The pre-sequencer successively outputs consecutive M-bit sections of a parallel word, where the parallel word comprises one or more copies of a frequency dividing bit pattern defining a frequency divisor. The parallel-to-serial converter performs a parallel-to-serial conversion on the M-bit sections of the parallel word based on the fixed radio frequency to generate an output signal having the desired radio frequency, where the output signal comprises a serial bit stream of the parallel word.03-29-2012
20120081156High Speed RF Divider - High-speed RF differential, Quadrature, divide-by-2 clock divider designs are based on inverters and clocking circuits connected in a serial ring formation. In one embodiment, only NMOS transistors are used in the inverters, and only PMOS transistors are used in the clocking circuits. This structure uses only 12 transistors, The input can be coupled directly to a VCO output, and provides minimum loading, as each VCO output is connected to only two transistors. Another embodiment comprises clocked inverter stages connected in a serial ring configuration with inverters between stages. The RF clock (or VCO signal) is used at the outer side of the inverters for speed improvement. In both circuits, positive and negative clock inputs are connected alternately at each stage of the ring.04-05-2012

Leonardus Hesen, Hegelson NL

Patent application numberDescriptionPublished
20120081163RF DUTY CYCLE CORRECTION CIRCUIT - A duty-cycle correction circuit comprises a plurality of AC-coupled, independently-biased inverter stages connected in series. A periodic signal is applied to an input of the plurality of inverter stages. Each inverter stage comprises an inverter with a resistive element connected in feedback between its output and input nodes. Each inverter stage is AC-coupled to a prior stage via a capacitor. The AC-coupling allows the signal to pass between inverter stages, but DC-isolates each inverter stage from adjacent stages, allowing each stage to maintain an independent DC bias of the signal at that stage. By virtue of the feedback resistive element, each stage defines a transition point between high and low signal states. Due to non-zero rise and fall times of the periodic signal, the independent DC bias of each stage is operative to incrementally shift the transition point of the periodic signal at each stage towards a desired duty-cycle.04-05-2012

Leonardus Henricus Maria Hesen, Hegelsom NL

Patent application numberDescriptionPublished
20090174483GAIN-CONTROLLED LOW NOISE AMPLIFIER MEANS - A gain-controlled low noise amplifier means is provided. The amplifier means comprises an amplifier (T07-09-2009

Leonardus H. M. Hesen, Hegelsom NL

Patent application numberDescriptionPublished
20100207678MIXER ARCHITECTURE - This invention relates to a device, a method, a system, wherein at least two mixer units are associated with at least two different mixer frequencies, and wherein each of said mixer units comprises a first input configured to receive at least one input signal to be mixed, and wherein at least one amplifier is coupled to said at least two mixer units, wherein each of said at least one amplifier is coupled to at least two outputs of at least two different mixer units of said at least two mixer units.08-19-2010

Paulus Martinus Catharina Hesen, Eindhoven NL

Patent application numberDescriptionPublished
20110198738METHOD FOR MANUFACTURING A MICROELECTRONIC PACKAGE COMPRISING AT LEAST ONE MICROELECTRONIC DEVICE - A method for manufacturing a microelectronic package (08-18-2011

Paulus Martinus Catharina Hesen, Hamburg DE

Patent application numberDescriptionPublished
20100117171SENSOR PACKAGE - Sensor package 05-13-2010

Paulus M. C. Hesen, Eindhoven NL

Patent application numberDescriptionPublished
20110062565METHOD FOR MANUFACTURING A MICROELECTRONIC PACKAGE COMPRISING AT LEAST ONE MICROELECTRONIC DEVICE - A method for manufacturing a microelectronic package (03-17-2011