Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Hermerding

James G. Hermerding, San Jose, CA US

Patent application numberDescriptionPublished
20080317086Self-calibrating digital thermal sensors - Methods and apparatus relating to calibration of digital thermal sensors after manufacturing are described. In one embodiment, a temperature value sensed by a digital thermal sensor may be calibrated based on a temperature value sensed by a thermal diode. The thermal diode and the digital thermal sensor may be on the same integrated circuit chip. Other embodiments are also disclosed.12-25-2008
20090089607Systems and methods for voltage regulator communication - Systems and method for providing a regulated voltage supply to an integrated circuit. In an embodiment of the invention, a voltage regulator in a system provides an integrated circuit in the system with information related to the voltage regulator providing a supply voltage to the integrated circuit. In another embodiment of the invention, the integrated circuit makes determinations about the operating characteristic of the system using information from the voltage regulator.04-02-2009
20100079940DUAL CHAMBER SEALED PORTABLE COMPUTER - In general, in one aspect, the disclosure describes a laptop computer that can allow for enhanced cooling of a passively cooled notebook while maintaining the desired waterproof and dust resistance of the design. This is achieved by creating a separate cooling channel where air can flow through to provide cooling to an electronics enclosure connected thereto. The cooling channel may utilize membranes (e.g., hydrophobic membranes) to protect again water and dust penetration. In some cases, two fans are used in opposite directions in order to automatically clean the membranes from dust accumulation.04-01-2010

Patent applications by James G. Hermerding, San Jose, CA US

Jim Hermerding, San Jose, CA US

Patent application numberDescriptionPublished
20090322150INTERVENTION OF INDEPENDENT SELF-REGULATION OF POWER CONSUMPTION DEVICES - Methods and apparatuses for intervening in the self power or thermal regulations of a plurality of independent power consumption devices are described herein. The novel methods may include monitoring power consumption and thermal conditions of the plurality of power consumption (i.e., power/heat dissipation) devices that are configured to independently self-regulate their power/thermal production. A determination may then be made as to whether an aggregate of the power and/or thermal production of the plurality of power consumption devices exceed a threshold. And if the aggregate of the power or thermal production of the power consumption devices was determined to exceed the threshold, terminating, at least partially, the independent self-regulating of the thermal production and intervening in the thermal regulation of one or more of the power consumption devices. In contrast, if the aggregate of the power and/or thermal production of the plurality of power consumption devices is determined to be below the threshold then the power consumption devices may be allowed to self-regulate their power consumptions, and in some instances, one or more of the individual power clamps for the one or more of the power consumption devices may be relaxed or raised.12-31-2009
20100064162TECHNIQUES TO MANAGE OPERATIONAL PARAMETERS FOR A PROCESSOR - Techniques to manage operational parameters for a processor are described. For instance, a method includes monitoring performance values representing physical characteristics for multiple components of a computing platform, and managing a performance level for a processor based on the performance values and one or more operational parameters for the processor. The operational parameters may include one or more transitory operational parameters that cause the processor to temporarily exceed operational parameters set by a thermal design power limit. Other embodiments are described and claimed.03-11-2010
20110127834INTERVENTION OF INDEPENDENT SELF-REGULATION OF POWER CONSUMPTION DEVICES - Methods and apparatuses for intervening in the self power or thermal regulations of a plurality of independent power consumption devices are described herein. The novel methods may include monitoring power consumption and thermal conditions of the plurality of power consumption (i.e., power/heat dissipation) devices that are configured to independently self-regulate their power/thermal production. A determination may then be made as to whether an aggregate of the power and/or thermal production of the plurality of power consumption devices exceed a threshold. And if the aggregate of the power or thermal production of the power consumption devices was determined to exceed the threshold, terminating, at least partially, the independent self-regulating of the thermal production and intervening in the thermal regulation of one or more of the power consumption devices. In contrast, if the aggregate of the power and/or thermal production of the plurality of power consumption devices is determined to be below the threshold then the power consumption devices may be allowed to self-regulate their power consumptions, and in some instances, one or more of the individual power clamps for the one or more of the power consumption devices may be relaxed or raised.06-02-2011

Patent applications by Jim Hermerding, San Jose, CA US

Jim G. Hermerding, San Jose, CA US

Patent application numberDescriptionPublished
20100205464METHOD AND APPARATUS FOR ON-DIE TEMPERATURE SENSING AND CONTROL - For one disclosed embodiment, a plurality of processor cores may be on a semiconductor die. The processor cores may have at least one corresponding temperature sensor. Circuitry on the semiconductor die may generate thermal event indications based on sensed temperatures from multiple temperature sensors of multiple processor cores. A thermal event indication may indicate that a sensed temperature exceeds a temperature point. Central management logic on the semiconductor die may receive thermal event indications based on sensed temperatures from multiple temperature sensors of multiple processor cores. The central management logic may modify operation of one or more of the processor cores in response to a thermal event indication. Other embodiments are also disclosed.08-12-2010