| Patent application number | Description | Published |
|---|
| 20080197376 | Method for Producing an Optical, Radiation-Emitting Component and Optical, Radiation-Emitting Component - The invention related to a method for producing an optical and a radiation-emitting component by a molding process, and to an optical and a radiation-emitting component having well-defined viscosity. | 08-21-2008 |
| 20080203410 | Methods for the Production of Luminescent Diode Chips and Luminescent Diode Chip - The invention relates to a method of making LED chips provided with a luminescence conversion material containing at least one phosphor. In the method, a layer composite is prepared that includes an LED layer sequence for a multiplicity of LED chips and comprises on a main surface at least one electrical contact surface for each LED chip, for electrically connecting said chip. A layer of adhesion promoter is applied to the main surface and selectively removed from at least portions of the contact surfaces. At least one phosphor is then applied to the main surface. Alternatively, a luminescence conversion material is applied to the main surface and selectively removed from at least portions of the contact surfaces. The invention also relates to an LED chip provided with a luminescence conversion material. | 08-28-2008 |
| 20080265266 | Housing for an Optoelectronic Component, Optoelectronic Component and Method for the Production of an Optoelectronic Component - A housing for an optoelectronic component which includes a carrier with a chip mounting surface is disclosed. An optical element which is produced separately from the carrier is applied to the carrier. The chip mounting surface and the optical element define a parting plane, the parting plane between carrier and optical element being arranged in the plane of the chip mounting surface. Also disclosed is an optoelectronic component having a housing of this type and a method for producing an optoelectronic component of this type. | 10-30-2008 |
| 20080265268 | Optoelectronic Component - An optoelectronic component is described, comprising a semiconductor body that emits electromagnetic radiation of a first wavelength when the optoelectronic component is in operation, and a separate optical element disposed spacedly downstream of the semiconductor body in its radiation direction. The optical element comprises at least one first wavelength conversion material that converts radiation of the first wavelength to radiation of a second wavelength different from the first. | 10-30-2008 |
| 20080266884 | Cooling Device for Cooling a Semiconductor Component, in Particular, an Optoelectronic Semiconductor Component - The invention relates to a cooling device for cooling a semiconductor component ( | 10-30-2008 |
| 20090065800 | OPTOELECTRONIC COMPONENT, DEVICE COMPRISING A PLURALITY OF OPTOELECTRONIC COMPONENTS, AND METHOD FOR THE PRODUCTION OF AN OPTOELECTRONIC COMPONENT - Disclosed is an optoelectronic component ( | 03-12-2009 |
| 20090173957 | WAVELENGTH-CONVERTING CONVERTER MATERIAL, LIGHT-EMITTING OPTICAL COMPONENT, AND METHOD FOR THE PRODUCTION THEREOF - Disclosed is a wavelength-converting converter material comprising at least one wavelength-converting phosphor comprising phosphor particles, wherein a portion of said phosphor or all of said phosphor is present in the form of nanoparticles. Also disclosed is a light-emitting optical component comprising such a converter material and a method for producing such components. | 07-09-2009 |
| 20090206352 | Luminescence conversion led - A luminescence conversion LED having a radiation emitting chip that is connected to electrical connections and is surrounded by a housing that comprises at least a basic body and a cap, the chip being seated on the basic body, in particular in a cutout of the basic body, and the primary radiation of the chip being converted at least partially into longer wave radiation by a conversion element, wherein the cap is formed by a vitreous body, the conversion means being contained in the vitreous body, the refractive index of the vitreous body being higher than 1.6, preferably at least n=1.7. | 08-20-2009 |
| 20090212308 | METHOD FOR PRODUCING AN LED CHIP AND LED CHIP - A method is disclosed in which a base body is prepared that comprises a layer sequence intended for the LED chip and suitable for emitting electromagnetic radiation. A cap layer is applied to at least one main surface of the base body. A cavity is introduced into the cap layer and is completely or partially filled with a luminescence conversion material. The luminescence conversion material comprises at least one phosphor. A method is also disclosed in which the cap layer comprises photostructurable material and at least one phosphor, such that it is able to function as a luminescence conversion material and can be photostructured directly. LED chips that are producible by means of the method are also described. | 08-27-2009 |
| 20090212316 | Surface-mounted optoelectronic semiconductor component and method for the production thereof - A surface-mounted component, comprising an optoelectronic semiconductor chip, a molded body integrally molded onto the semiconductor chip, a mounting area formed at least in places by a surface of the molded body, at least one connection location and side areas of the component which are produced by means of singulation. | 08-27-2009 |
| 20090261365 | Optoelectronic Componet Which Emits Electromagnetic Radiation, and Method for Production of an Optoelectronic Component - An optoelectronic component comprising a housing and a luminescence diode chip arranged in the housing is specified, which component emits a useful radiation. The housing has a housing material which is transmissive to the useful radiation and which is admixed with radiation-absorbing particles in a targeted manner for setting a predetermined radiant intensity or luminous intensity of the emitted useful radiation. The radiation-absorbing particles reduce the radiant intensity or the luminous intensity by a defined value in a targeted manner in order thus to set a predetermined radiant intensity or luminous intensity for the component. A method for producing an optoelectronic component of this type is additionally disclosed. | 10-22-2009 |
| 20090297090 | Illumination Unit Comprising Luminescence Diode Chip and Optical Waveguide, Method for Producing an Illumination Unit and LCD Display - An illumination unit comprising a luminescence diode chip mounted on a chip carrier and comprising an optical waveguide is specified. The optical waveguide is joined together from at least two separate parts, wherein the luminescence diode chip is encapsulated by one of the parts of the optical waveguide. A method for producing a luminescence diode chip of this type and also an LCD display comprising an illumination unit of this type are furthermore specified. | 12-03-2009 |
| 20100193815 | Method for the Manufacture of an Optoelectronic Component and an Optoelectronic Component - A method is disclosed for the manufacture of an optoelectronic component. A substrate has a first primary face and a second primary face that lies opposite the first primary face. A semiconductor body that is capable of emitting electromagnetic radiation from a front side is attached to the first primary face of the substrate. A covering that is transparent to the radiation from the optoelectronic semiconductor body is applied to at least the front side of the semiconductor body. The covering is given the form of an optical element by using a closed cavity that is shaped with the contour of the optical element. | 08-05-2010 |
| 20100314635 | CHIP ARRANGEMENT, CONNECTION ARRANGEMENT, LED AND METHOD FOR PRODUCING A CHIP ARRANGEMENT - A chip arrangement for an optoelectronic component includes at least one semiconductor chip which emits electromagnetic radiation, and a connection arrangement which includes planes that are electrically insulated from one another, at least one plane having a cavity and at least one plane being a heat dissipating plane, wherein at least two electrically insulated conductors are arranged in at least the two planes, the semiconductor chip is arranged within the cavity and has at least two connection locations, and each of the connection locations is electrically conductively connected to a respective one of the conductors. | 12-16-2010 |
| 20110049551 | Illuminating Device - A lighting device ( | 03-03-2011 |
| 20110140284 | OPTOELECTRONIC COMPONENT - An optoelectronic component includes a carrier with a mounting side and having at least one functional element, at least one substrateless optoelectronic semiconductor chip with a top and an opposed bottom and is electrically conductive by way of the top and the bottom, wherein the bottom faces the mounting side and the semiconductor chip is mounted on the mounting side, and at least one structured electrical contact film located on the top. | 06-16-2011 |
| 20110141716 | Illumination Device for Backlighting a Display, and a Display Comprising such an Illumination Device - An illumination device ( | 06-16-2011 |
| 20110143627 | Luminescence Conversion LED - A luminescence conversion LED having a radiation emitting chip that is connected to electrical connections and is surrounded by a housing that comprises at least a basic body and a cap, the chip being seated on the basic body, in particular in a cutout of the basic body, and the primary radiation of the chip being converted at least partially into longer wave radiation by a conversion element, wherein the cap is formed by a vitreous body, the conversion means being contained in the vitreous body, the refractive index of the vitreous body being higher than 1.6, preferably at least n=1.7. | 06-16-2011 |
