Patent application number | Description | Published |
20100128347 | POLARIZING CUBE AND METHOD OF FABRICATING THE SAME - A polarizing cube includes a pair of identical and symmetric triangular prisms which sandwich a thin optical composite plate containing a planner array of reflective straight wires spaced apart in parallel as a built-in wire grid polarizer. All of its subcomponents and the polarizing cube itself are physically and optically symmetrical to one of its diagonal planes so as to provide improved integration and robustness for projection display application. The cubic configuration of the disclosed polarizer can be readily produced through common means and sequences typically used in semiconductor wafer fabrication processes, including photolithographic patterning, gap dielectric filling and planarization, and wafer thinning, bonding and cutting among others. | 05-27-2010 |
20100134886 | INTEGRATED PLANAR POLARIZING DEVICE AND METHODS OF FABRICATION - The embodiments of the present invention provide an integrated planar polarizing device and methods of fabrication. The device, in the order of incidence along an optical path of an incident light beam from back position to front position, comprises a planar array of micro mirrors, a quarter wave retarder film and a reflective polarization plate. The micro mirrors are regularly spaced-apart in an identical tilted angle α relative to a base plane. The quarter wave retarder film is positioned between the micro mirrors and the reflective polarization plate. The reflective polarization plate is in parallel to the base plane and is adapted to transmit and polarize a first polarized light of the incident light beam in a first polarization state, and to reflect and polarize a second polarized light of the incident light beam in a second polarization, The micro mirrors are adapted to reflect the second polarized light passing and polarized through the quarter wave retarder film first time to pass and be polarized through the quarter wave retarder film second time, thereby converting the second polarized light to be a third polarized light in the first polarization state which can transmit the reflective polarization plate. The planar array of micro mirrors, the quarter wave retarder film and the reflective polarization plate are embedded in a transparent medium. The embodiments of the present invention could improve in device integration and simplification in assembly robustness. | 06-03-2010 |
20100171928 | SINGLE-IMAGER PROJECTION ENGINE ASSEMBLY - A single-imager projection engine assembly includes a light source, a reflective polarization modulation imager, a reflective quarter wave composite plate, a projection lens system, and a PBS assembly which includes a first polarization beam splitting film and a second polarization beam splitting film in a V-notch pairing configuration. The first polarization beam splitting film reflects the illumination light in first polarization state to the reflective polarization modulation imager, while the second polarization beam splitting film and the reflective quarter wave composite plate in conjunction convert the illumination light in second polarization state passing through the first polarization beam splitting film to first polarization state and reflects the converted to the reflective polarization modulation imager. Combined illumination is modulated, polarization rotated and reflected by the reflective polarization modulation imager back to the PBS assembly for projection through the projection lens. | 07-08-2010 |
20100182572 | POLARIZER ASSEMBLY AND A REFLECTIVE MODULATION-IMAGER PROJECTION SYSTEM - The present application relates to a polarizer assembly and a reflective modulation-imager projection system. The polarizer assembly comprises a light source, a polarization beam splitter assembly, a first reflective quarter wave composite plate and a second reflective quarter wave composite plate. The light source is used for inducing a first polarized light and a second polarized light in a first direction. The polarization beam splitter assembly comprises a first polarization beam splitting film and a second polarization beam splitting film. The first polarization beam splitting film is used for reflecting the first polarized light as a first polarization reflected light in a second direction while transmitting the second polarized light. The second polarization beam splitting film is used for transmitting the second polarized light. The first reflective quarter wave composite plate is used for reflecting, while polarization rotating as a third polarized light. The second polarization beam splitting film receives and reflects the third polarized light as a second polarization reflected light in the first polarization state. The second reflective quarter wave composite plate is used for respectively reflecting, while polarization rotating, the first polarization reflected light and the second polarization reflected light as a first output light and a second output light in the second polarization state in opposition to the second direction. The utilization ratio of the illumination lights could be increased. | 07-22-2010 |
20100195186 | TWDM ELEMENT, IMAGER, AND METHOD FOR TEMPORALLY AND SPATIALLY MODULATING BY USING THE SAME - A tri wavelength diffracting modulation (TWDM) element, a TWDM imager, and methods of temporally and spatially modulating by using the same are disclosed. The TWDM element includes first and second sets of movable reflective rigid plates under independent electrical actuation, provides four different spatial configurations for reflecting and selectively diffracting incident radiation of three distinguished wavelengths. The TWDM imager is formed with a plurality of the TWDM elements in a regularly spaced planar array configuration on a planar substrate. Incident visible light is spatially modulated by the TWDM imager, either in a time sequential mode or via spatial combination with help of an aligned color filter array. | 08-05-2010 |
20100245771 | POLARIZATION CONVERSION ASSEMBLY AND SINGLE-IMAGER MICRO PROJECTION ENGINE - A single-imager micro projection engine includes a reflective polarization modulation imager, a projection lens system and a polarization conversion assembly integrating a light source with a planar polarization beam splitter and a reflective quarter wave composite plate in parallel. The polarization conversion assembly lets through first polarization portion of illumination light in first polarization state from the light source for illuminating a first half facing area on the reflective polarization modulation imager, while reflecting second portion in second polarization state perpendicular to first polarization state towards the reflective quarter wave composite plate. The reflective quarter wave composite plate reflects, while 90-degree polarization rotating from second polarization state to first, the received second portion back to the planar polarization beam splitter. The reflected and polarization-rotated second portion also in first polarization state transmits through the planar polarization beam splitter and illuminates a second half facing area on the reflective polarization modulation imager. Modulated and 90-degree polarization-rotated images produced by both the first and second half facing areas of the reflective polarization imager are reflected by the planar polarization beam splitter towards the projection lens towards an external projection screen. | 09-30-2010 |
20100296060 | INTEGRATED MICRODISPLAY PROJECTION AND IMAGING SYSTEM - An integrated microdisplay projection and imaging system includes: a focus-adjustable lens system, a planar polarization beam splitter, a reflective polarization modulation imager and an imaging sensor with a post polarizer in orthogonal polarization orientation to the planar polarization beam splitter, as well as a lighting module. Placed on two separate sides of the planar polarization beam splitter, the reflective polarization modulation imager and the imaging sensor have substantially equal-length optical passes through the planar polarization beam splitter to the focus-adjustable lens system, and thus the focus-adjustable lens system provides a unified means for adjusting focus with both the reflective polarization modulation imager and the imaging sensor, relative to an external object such a projection screen or an imaging object. | 11-25-2010 |
20100301430 | MEMS DEVICE AND METHOD OF FABRICATING THE SAME - A micro electrical-mechanical system (MEMS) device comprises a suspended thin film microstructure which includes an anchoring portion adhered to the top surface of the substrate and a suspended portion above the top surface of the substrate. Having a base plane configured in parallel to the substrate, the suspended portion further includes a first recess portion spaced at a first vertical clearance with the substrate, the first vertical clearance being configured differentially smaller than a base clearance of the suspended portion outside the first recess portion. The method for processing a MEMS device includes: depositing a first carbon film, etch-removing a first sacrificial pre-removal portion and an anchor portion of the first carbon film, depositing a second carbon film conformally topping the first carbon film and the substrate, etch-removing the anchor portion of the second carbon film, depositing and patterning the suspended thin film microstructure onto the first carbon film, the second carbon film and the substrate, removing the first carbon film and the second carbon film to release the suspended thin film microstructure above the substrate by selective gaseous oxidation or nitridation preferably enhanced via plasma. | 12-02-2010 |
20100311209 | METHOD O ENCAPSULATING A WAFER LEVEL MICRODEVICE - The present invention discloses a method of encapsulating a wafer level microdevice, which includes: fabricating a microdevice on top side of a first silicon wafer; depositing a first capping carbon film on the top side of the first silicon wafer; implementing a backside fabricating process of wafer from bottom side of the first silicon wafer by carrying the top side of the first silicon wafer through the first capping carbon film; removing the first capping carbon film by selective gaseous reaction with carbon; and encapsulating an encapsulation wafer onto the top side of the first silicon wafer. The present invention deposits and removes the first capping carbon film by means of chemical technology, thereby protecting the microdevice on the top side of the first wafer during implementing the backside fabricating process of wafer. The top side does not need to be protected through the encapsulation wafer before implementing the backside fabricating process of wafer, which makes the wafer thinner and convenient to be handled. | 12-09-2010 |
20100314669 | CAPACITIVE MEMS SWITCH AND METHOD OF FABRICATING THE SAME - The present invention discloses a capacitive MEMS switch on top of a semiconductor substrate containing a CMOS driving circuitry. The capacitive MEMS switch disclosed includes: 1) a semiconductor substrate containing a driving circuitry inside, and first and second conductors as well as a bottom electrode on top; 2) a suspended composite beam above and anchored onto the semiconductor substrate, containing a top electrode aligned to the bottom electrode with a first vertical distance, a top conductor, capped by a dielectric layer, having a first and second contact tips aligned with the first and second bottom conductors with a second vertical distance differentially smaller than the first vertical distance. The electrostatic attraction generated between the top electrode and the bottom electrode pulls the first and second contact tips in physical contact with and electrically connects the first and second bottom conductors through the top conductor. | 12-16-2010 |
20100315579 | COLORED LIQUID CRYSTAL DISPLAY - A colored liquid crystal display includes a transparent substrate, a transparent conductive layer, a planar liquid crystal cell, and a backplane substrate in sequence of receiving an incident light. The backplane substrate includes a first conductive reflector, a second conductive reflector and a third conductive reflector, tiled in a planar arrangement perpendicular to the incident light and electrically connected to a driving circuitry in the backplane substrate. The driving circuitry electrically drives the first conductive reflector, the second conductive reflector and the third conductive reflector individually as well as the transparent conductive layer to form spatially colored reflective light modulation. | 12-16-2010 |
20100321598 | INTEGRATED SINGLE PANEL PROJECTION ENGINE - The present invention discloses an integrated single-panel projection engine ( | 12-23-2010 |
20100328590 | BACK SUBSTRATE AND REFLECTIVE LIQUID CRYSTAL DISPLAY - A back substrate and a reflective liquid crystal display are disclosed. The back substrate comprises: a first substrate; a reflective electrode layer, formed on the first substrate, at least comprising a first reflective electrode, a second reflective electrode and a third reflective electrode which are electrically isolated; wherein the first reflective electrode is an electrode of reflecting light of a first spectrum band of incident light, the second reflective electrode is an electrode of reflecting light of a second spectrum band of the incident light, and the third reflective electrode is an electrode of reflecting light of a third spectrum band of the incident light. The structures of the back substrate and the reflective liquid crystal display are simplified, the problems associated with inter-pixel color blur and degradation of optical efficiency owing to inaccurate alignment of pixelated color filter array film and the pixelated reflective electrodes, and electrical field drop from thick dielectric color filters can be solved. | 12-30-2010 |
20110005319 | CAPACITIVE MEMS GYROSCOPE AND METHOD OF MAKING THE SAME - A capacitive MEMS gyroscope and a method of making the same are disclosed. The capacitive MEMS gyroscope comprises a semiconductor substrate and a suspended composite wheel. The semiconductor substrate comprises: a read-out circuitry; at least one bottom electrode disposed on top of the semiconductor substrate, centered to a rotation axis and electrically connected to the read-out circuitry; at least one contact pad disposed on the top of the semiconductor substrate, electrically to the read-out circuitry; the composite wheel, partially made of dielectric film and configured in suspension above and in parallel to the semiconductor substrate and centered to the rotation axis, comprises: at least one top electrode disposed on the composite wheel, aligned vertically with one of the bottom electrode, electrically to the read-out circuitry; at least one circumferential spring centered to the rotation axis, bridging the composite wheel and the semiconductor substrate and consisting of at least one top electrode which electrically connects the top electrode to the contact pad on the semiconductor substrate. The gyroscope of the present invention formed by depositing and photolithographically patterning has miniaturized size, low tolerance scope and high sensing accuracy, as well as low fabrication costs owing to special bulk MEMS fabrication device unnecessary. | 01-13-2011 |
20110007249 | REFLECTIVE COLOR FILTER LIQUID CRYSTAL DISPLAY - A reflective color filter liquid crystal display, in the reverse order of receiving incident light, includes a backplane substrate, a reflective electrode layer, a planar liquid crystal cell, a transparent protective dielectric layer and a transparent plate. The transparent plate is adapted for receiving and transmitting the incident light. The planar liquid crystal cell is sandwiched between the reflective electrode layer and the transparent conductive film. The reflective electrode layer further includes a first band reflective electrode, a second band reflective electrode and a third band reflective electrode in a regularly tiled planar arrangement. | 01-13-2011 |
20110007382 | COLORED ELECTROPHORETIC DISPLAY - A colored electrophoretic display includes a transparent substrate, a transparent conductive layer, a planar electrophoretic cell, and a backplane substrate in sequence of receiving an incident light. The backplane substrate includes a first block reflective electrode, a second block reflective electrode and a third block reflective electrode, tiled in a planar arrangement perpendicular to the incident light and electrically connected to a driving circuitry in the backplane substrate. The driving circuitry electrically drives the first block reflective electrode, the second block reflective electrode and the third block reflective electrode individually as well as the transparent conductive layer to form spatially colored reflective light modulation. | 01-13-2011 |
20110025957 | LIQUID CRYSTAL ON SILICON IMAGER - The present invention relates to a liquid crystal on silicon imager. The imager includes a backplane substrate, a reflective polarization electrode array, a planar liquid crystal cell, a transparent conductive film and a transparent plate. The reflective polarization electrode array is placed onto the backplane substrate, consists of a plurality of reflective polarization electrodes, and a pattern of each of the reflective polarization electrodes is configured in a planar arrangement having regularly spaced and electrically isolated gaps in parallel to each other. The planar liquid crystal cell is placed above the reflective polarization electrode array. The transparent conductive film is placed above the planar liquid crystal cell. The transparent plate is placed on the transparent conductive film and facing incident light. Through embedding the reflective polarization electrodes, only one polarization portion could be reflected back, while the residual polarization portion is let pass but not reflected back as desired, thereby decreasing the loss in contract ratio of the imager. | 02-03-2011 |
20110053321 | METHOD OF FABRICATING AND ENCAPSULATING MEMS DEVICES - A method of fabricating and encapsulating MEMS devices is disclosed, using least two carbon films as the dual sacrificial layers sandwiching a MEMS structural film which is anchored onto a substrate and covered by an encapsulating film containing a plurality of thru-film sacrificial release holes. The dual sacrificial carbon films are selectively removed via plasma-enhanced oxygen or nitrogen ashing through the thru-film sacrificial release holes for releasing the MEMS structural film inside a cavity formed between the encapsulating film and the substrate. The thru-film sacrificial release holes, preferably with a relative high asperity ratio, are then sealed off by depositing a hole-sealing film in a physical vapor deposition process or a chemical vapor deposition process or combination. | 03-03-2011 |
20110069264 | LIQUID CRYSTAL IMAGER AND METHOD OF MAKING SAME - The disclosed LCOS device comprises a transparent composite plate, a planar liquid crystal cell, a base plate which contains an active matrix driving circuitry. In the basic embodiment, the planar liquid crystal cell comprises a conductive seal ring which encloses liquid crystal filling and connects the transparent conductive layer underneath the transparent composite plate with the base plate and the active matrix driving circuitry. In the extended embodiment, the base plate further incorporates a set of thru-substrate via and backside bond pads. The set of thru-substrate via electrically connect a set of input-output pads of the active matrix driving circuitry to the bottom bond pads underneath the base plate. In addition, the conductive seal ring electrically connects the transparent conductive film placed underneath the transparent front plane plate, preferably made of glass, to the active matrix driving circuitry on the base plate. Electrostatically charged between the transparent conductive coating and an electrode array layer including a planar array of reflective pixel electrodes on top of the base plate, planar liquid crystal cell is operated to produce spatial light modulation to incident illumination. The method of wafer level process and packaging of the disclosed LCOS imagers is further disclosed. | 03-24-2011 |
20110141545 | TRI WAVELENGTH INTERFERENCE MODULATOR AND A METHOD FOR MODULATION - The present invention relates to a tri wavelength interference modulator (TWIM) and a method of tri wavelength interference modulation. The tri wavelength interference modulator includes: a stationary substrate with a bottom electrode plate formed on top of the stationary substrate; a first electrode plate comprising a first suspended beam suspended in parallel above the stationary substrate and a first connection electrically connected onto the stationary substrate; and a second electrode plate comprising a second suspended beam suspended in parallel above the first electrode plate and a second connection electrically connected onto the stationary substrate. The inference modulator and the method for inference modulation are suitable to projection system. | 06-16-2011 |
20110237009 | LCOS DISPLAY UNIT AND METHOD FOR FORMING THE SAME - An embodiment of the present invention discloses a Liquid Crystal on Silicon (LCOS) display unit, in which a Metal-Insulator-Metal (MIM) capacitor consisting of a micromirror layer, a insulation layer and a light shielding layer is formed by grounding the light shielding layer on a pixel switch circuit layer. Therefore the pixel switch circuit and the capacitor are in vertical distribution, that is, the switch circuit and the capacitor both have an allowable design area of the size of one pixel. Another embodiment of the present invention provides a method for forming a Liquid Crystal on Silicon (LCOS) display unit. | 09-29-2011 |
20120009794 | Method for Planarization of Wafer and Method for Formation of Isolation Structure in Top Metal Layer - The invention discloses a planarization method for a wafer having a surface layer with a recess, comprises: forming an etching-resist layer on the surface layer to fill the entire recess; etching the etching-resist layer and the surface layer, till the surface layer outside the recess is flush to or lower than the bottom of the recess, the etching speed of the surface layer being higher than that of the etching-resist layer; removing the etching-resist layer; and etching the surface layer to a predetermined depth. The method can avoid concentric ring recesses on the surface of the wafer resulted from a chemical mechanical polishing (CMP) process in the prior art, and can be used to obtain a wafer surface suitable for optical applications. | 01-12-2012 |
20120268805 | TRI WAVELENGTH DIFFRACTION MODULATOR AND A METHOD FOR MODULATION - The present invention relates to a tri wavelength diffraction modulator (TWDM) and a method of tri wavelength diffraction modulation. The tri wavelength diffraction modulator includes: a stationary substrate with a bottom electrode plate formed on top of the stationary substrate; a first electrode plate comprising a first suspended beam suspended in parallel above the stationary substrate and a first connection anchored onto the stationary substrate; and a second electrode plate comprising a second suspended beam suspended in parallel above the first electrode plate and a second connection anchored onto the stationary substrate. The diffraction modulator and the method for diffraction modulation are suitable to projection system. | 10-25-2012 |
20140367753 | CMOS DEVICE WITH DOUBLE-SIDED TERMINALS AND METHOD OF MAKING THE SAME - A transistor device includes a semiconductor substrate having a first surface and a second surface opposite the first surface, a gate structure disposed on the first surface and configured to form a channel region, and source and drain regions disposed on opposite sides of the channel region. The device also includes a source terminal and a drain terminal disposed on the second surface. The source and drain terminals are connected to the respective source and drain regions. The transistor device further include a body terminal disposed. on the second. surface and configured to connect the highest or lowest voltage supply to the semiconductor substrate. | 12-18-2014 |
20140367777 | DOUBLE-SIDE PROCESS SILICON MOS AND PASSIVE DEVICES FOR RF FRONT-END MODULES - A method for forming integrated circuit includes providing a first semiconductor substrate having a front surface and a back surface that is opposite to the front surface. One or more first trenches are in the first semiconductor substrate from the front surface side, the first trenches being characterized by a first depth. One or more second trenches are formed in the first semiconductor substrate from the front surface side, the second trenches being characterized by a second depth which greater than the first depth. A horizontal isolation layer is formed parallel to the front surface and at a third depth from the front surface. The method also includes forming a first recessed region extending in the first semiconductor substrate from the back surface side to the horizontal isolation layer that results in a thinned semiconductor region having a thickness substantially equal to the third depth. The method further includes forming a bulk dielectric layer covering the back surface side of the first semiconductor substrate. | 12-18-2014 |