Patent application number | Description | Published |
20080277146 | Radiant heat printed circuit board and method of fabricating the same - Disclosed is a radiant heat printed circuit board, which has improved heat-radiating properties and reliability, and a method of fabricating the same. | 11-13-2008 |
20110266038 | PRINTED CIRCUIT BOARD ADN METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a substrate including a first circuit layer formed on one side thereof and a second circuit layer formed on the other side thereof; and a strike-type through body externally inserted in the substrate and electrically connecting the first circuit layer and the second circuit layer. The printed circuit board is advantageous in that, since a strike-type through body is externally inserted in a substrate, conventional complicated processes, such as hole forming, deburring, desmearing, electroless copper plating and electrolytic copper plating, can be omitted, thus simplifying a process of manufacturing a printed circuit board and reducing the manufacturing cost thereof. | 11-03-2011 |
20110316035 | HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed is a heat-dissipating substrate, which includes a base substrate including a metal layer, an insulating layer formed on one surface of the metal layer, and a circuit layer formed on the insulating layer, a heat sink layer formed on the other surface of the metal layer, a connector for connecting the base substrate and the heat sink layer to each other, an opening formed in a direction of thickness of the base substrate and into which the connector is inserted, and an anodized layer formed on either or both of the other surface and a lateral surface of the metal layer, and in which the metal layer and the heat sink layer are insulated from each other by means of the anodized layer, thus preventing transfer of static electricity or voltage shock to the metal layer. A method of manufacturing the heat-dissipating substrate is also provided. | 12-29-2011 |
20120001544 | LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME - Disclosed are a light emitting module and a method of manufacturing the light emitting module. The light emitting module includes: a heat radiating substrate which includes a metal substrate with through holes, an internal insulating layer formed along inner walls of the through holes, and an external insulating layer covering all outer surfaces of the metal substrate; a light emitting component unit disposed on a top surface of the heat radiating substrate; a driving circuit unit which is electrically connected to the light emitting component unit, and is mounted on the heat radiating substrate to apply a driving signal to the light emitting component unit; a passive component which is mounted on the heat radiating substrate and is electrically connected to the driving circuit unit; and circuit wiring layers which are disposed on a top and a bottom of the heat radiating substrate, respectively, and are interconnected therebetween through vias formed on the through holes with the internal insulating layer of the heat radiating substrate, and play a role of electrical interconnection of the driving circuit unit and the light emitting component unit, or the driving circuit unit and the passive component. | 01-05-2012 |
20120043875 | RADIANT HEAT SUBSTRATE AND METHOD FOR MANUFACTURING THE RADIANT HEAT SUBSTRATE, AND LUMINOUS ELEMENT PACKAGE WITH THE RADIANT HEAT SUBSTRATE - The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element. | 02-23-2012 |
20120085574 | Heat radiating substrate and method of manufacturing the same - Provided are a heat radiating substrate and a method of manufacturing the same. The heat radiating substrate includes a substrate having a via-hole, an anode oxide layer formed on the entire surface of the substrate having the via-hole through an anodizing process, a first circuit pattern formed on the substrate on which the anode oxide layer is formed, and a second circuit pattern formed at a lower part of the via-hole to be connected to the via-hole. Therefore, it is possible to simplify a circuit forming process and readily manufacture the heat radiating substrate by applying a metal anodic bonding process, without using a conventional adhesion layer and metal seed when the heat radiating substrate is manufactured. | 04-12-2012 |
20120199381 | PRINTED CIRCUIT BOARD - The present invention relates to a printed circuit board. A heat radiation coating material is applied to a portion of a circuit layer formed on an outermost portion of the printed circuit board, thereby making it possible to improve heat radiation performance of the printed circuit board. The heat radiation coating material also serves as a solder resist, thereby making it possible to insulate and protect the printed circuit board without a separate solder resist. | 08-09-2012 |
20130139383 | Printed Circuit Board and Method Of Manufacturing The Same - Disclosed herein is a printed circuit board, including: a substrate including a first circuit layer formed on one side thereof and a second circuit layer formed on the other side thereof; and a strike-type through body externally inserted in the substrate and electrically connecting the first circuit layer and the second circuit layer. The printed circuit board is advantageous in that, since a strike-type through body is externally inserted in a substrate, conventional complicated processes, such as hole forming, deburring, desmearing, electroless copper plating and electrolytic copper plating, can be omitted, thus simplifying a process of manufacturing a printed circuit board and reducing the manufacturing cost thereof. | 06-06-2013 |
20130160978 | HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a heat dissipating substrate and a method of manufacturing the same. The heat dissipating substrate includes: a substrate that is formed of a metal material, wherein at least one via hole is formed in the substrate; an insulating layer formed on a surface of the substrate; a coating layer that is formed on an inner wall surface of the via hole and is formed of a conductive or non-conductive material; a plurality of metal patterns that are formed on the insulating layer and are electrically separated from one another; a metal layer that is extended from the metal patterns to be formed on the coating layer formed on the inner wall surface of the via hole; and a filling material that is formed of a non-conductive material and is filled between the metal layers in the via hole. | 06-27-2013 |
20150017477 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - The present invention relates to a printed circuit board, which includes a metal circuit layer electrically connected to an electronic component, a solder layer formed on an upper surface of the metal circuit layer, an intermetallic compound layer formed between the solder layer and the metal circuit layer, and a chunk portion formed in the intermetallic compound layer according to the thickness of the metal circuit layer, wherein the thickness of the metal circuit layer is 20 to 50 μm, and a manufacturing method thereof. | 01-15-2015 |
Patent application number | Description | Published |
20140078570 | TUNABLE PHOTONIC CRYSTAL COLOR FILTERS AND COLOR IMAGE DISPLAY DEVICES - Tunable photonic crystal color filters, and color image display devices including the same, include a first electrode, a second electrode facing the first electrode, a medium between the first electrode and the second electrode, nano particles distributed in the medium in a lattice structure and charged, and an ion spread preventing layer over a surface of at least one of the first electrode and the second electrode. | 03-20-2014 |
20140124369 | METHODS OF FABRICATING PHOTONIC CRYSTAL - Provided are a method of fabricating a photonic crystal having a desired photonic bandgap, and a method of fabricating a color filter, including providing a photonic crystal solution in which a plurality of colloidal particles that are electrically charged are dispersed, mixing a photopolymerizable monomer mixture in the photonic crystal solution to form a photopolymerizable monomer-crystal mixture, applying an electric field to the photopolymerizable monomer-crystal mixture to electrically control intervals between the plurality of colloidal particles, and irradiating ultraviolet light to the photopolymerizable monomer-crystal mixture to photopolymerize the monomer mixture to form the photonic crystal or the color filter. | 05-08-2014 |
20150162548 | ORGANIC PHOTOELECTRONIC DEVICE AND IMAGE SENSOR - Disclosed are an organic photoelectronic device including a first electrode and a second electrode facing each other and an active layer interposed between the first electrode and the second electrode, wherein the active layer includes a p-type semiconductor compound represented by the formula C | 06-11-2015 |
20150188064 | ORGANIC PHOTOELECTRONIC DEVICE AND IMAGE SENSOR - Disclosed are an organic photoelectronic device including a first light-transmitting electrode, an active layer positioned on one side of the first light-transmitting electrode, and a second light-transmitting electrode positioned on one side of the active layer, wherein the first light-transmitting electrode and the second light-transmitting electrode independently comprise at least one of indium tin oxide (ITO), indium zinc oxide (IZO), tin oxide (SnO), aluminum tin oxide (ATO), aluminum zinc oxide (AZO), and fluorine-doped tin oxide (FTO). Also disclosed is an image sensor including the organic photoelectronic device. | 07-02-2015 |
20150303378 | COMPOUND AND ORGANIC PHOTOELECTRONIC DEVICE AND IMAGE SENSOR - A compound may be represented by Chemical Formula 1, an organic photoelectronic device may include a first electrode and a second electrode facing each other with an active layer that includes the compound represented by Chemical Formula 1 between the first electrode and the second electrode, and an image sensor may include the organic photoelectronic device. | 10-22-2015 |
20160043318 | ORGANIC PHOTOELECTRONIC DEVICE AND IMAGE SENSOR AND ELECTRONIC DEVICE - An organic photoelectronic device includes a first electrode and a second electrode facing each other, and an active layer between the first electrode and the second electrode and including a first compound represented by Chemical Formula 1 or 2, and a ratio between a FWHM of a light absorption curve depending on a wavelength of the first compound in a solution state and in a thin film state satisfies the following Relationship Equation 1: FWHM2/FWHM1<2.5. In the Relationship Equation 1, FWHM1 is a FWHM of the light absorption curve depending on a wavelength in a solution state, and FWHM2 is a FWHM of the light absorption curve depending on a wavelength in a thin film state. | 02-11-2016 |
20160064456 | PHOTOELECTRIC CONVERSION DEVICE AND IMAGE SENSOR HAVING THE SAME - A photoelectric conversion device of an image sensor includes a first transparent electrode layer, an active layer, and a second transparent electrode layer, which are sequentially stacked. A light having a wavelength of about 440 nm-480 nm is absorbed within a depth of about ⅕ of an entire thickness of the active layer from both the top and bottom surfaces of the active layer. | 03-03-2016 |
20160065913 | STACKED IMAGE SENSOR - A stacked image sensor includes a substrate including a first photoelectric conversion device, a second photoelectric conversion device and a first color signal storing device disposed between the first photoelectric conversion device and the second photoelectric conversion device. A second color filter and a third color filter are disposed at positions corresponding to the first photoelectric conversion device and the second photoelectric conversion device on the substrate. A conductive connecting member is disposed between the second color filter and the third color filter. A first color sensing photoelectric conversion device is disposed on the second color filter, the third color filter, and the conductive connecting member. The cross-sectional area of conductive connecting member is at least greater than the cross-sectional area of the first color signal storing device. | 03-03-2016 |
Patent application number | Description | Published |
20130325809 | METHOD FOR CONTENTS BACKUP AND AN ELECTRONIC DEVICE THEREOF - A method of operating an electronic device includes selecting contents to be backed up on the basis of a usage pattern of the contents, generating backup data of the contents, and transmitting the backup data to a backup server. A priority is assigned for determining whether to a backup of the contents should occur on the basis of the usage pattern of the contents. A backup target is selected according to at least one of the per-contents usage frequency and the priority. | 12-05-2013 |
20150061971 | METHOD AND SYSTEM FOR PRESENTING CONTENT - A system and method for presenting content through a plurality of electronic devices are provided. The method includes presenting content through a plurality of electronic devices comprising at least a first electronic device and a second electronic device, wherein the presenting of the content comprises displaying a first portion of the content through the first electronic device and displaying a second portion of the content through the second electronic device, identifying an input for at least one of the plurality of electronic devices while the content is being displayed, setting the plurality of electronic devices as a first group comprising the first electronic device and a second group comprising the second electronic device, based on at least the input, and independently presenting the content through the first group and the second group, based on the setting. | 03-05-2015 |
20150067521 | METHOD AND APPARATUS FOR PRESENTING CONTENT USING ELECTRONIC DEVICES - A method of selecting at least one device from among a plurality of electronic devices having first and second electronic devices, based on at least one of information about the plurality of electronic devices and a user input for at least one of the electronic devices is provided. The method includes presenting content through the plurality of electronic devices such that a first portion of the content is displayed through the first electronic device and a second portion of the content is displayed through the second electronic device. Also, this method includes performing a particular function associated with presentation of the content through the selected at least one device. Various other embodiments are possible. | 03-05-2015 |
Patent application number | Description | Published |
20080294875 | PARALLEL PROCESSOR FOR EFFICIENT PROCESSING OF MOBILE MULTIMEDIA - Provided is a parallel processor for supporting a floating-point operation. The parallel processor has a flexible structure for easy development of a parallel algorithm involving multimedia computing, requires low hardware cost, and consumes low power. To support floating-point operations, the parallel processor uses floating-point accumulators and a flag for floating-point multiplication. Using the parallel processor, it is possible to process a geometric transformation operation in a 3-dimensional (3D) graphics process at low cost. Also, the cost of a bus width for instructions can be minimized by a partitioned Single-Instruction Multiple-Data (SIMD) method and a method of conditionally executing instructions. | 11-27-2008 |
20100156680 | METHOD OF DRIVING BIT STREAM PROCESSOR - Provided is a bit stream processor using a reduced table lookup. The bit stream processor includes a bit stream exclusive register in a general purpose register in order to process data of a variable length effectively. Additionally, the bit stream processor an instruction of a table lookup method to which a prefix method is applied and a bit stream exclusive instruction in order to reduce an entire memory size. | 06-24-2010 |
20100162016 | LOW POWER CONSUMPTION PROCESSOR - Provided is a low power consumption processor. The processor includes: a plurality of blocks; a memory storing instructions that control each of the plurality of blocks; and a multi power controller generates a signal that activates at least one of the plurality of blocks according to an address storing the instruction, and provides a normal power voltage or a reduction power voltage in response to the activation signal. | 06-24-2010 |
Patent application number | Description | Published |
20080203488 | CMOS semiconductor device and method of fabricating the same - Example embodiments provide a complementary metal-oxide semiconductor (CMOS) semiconductor device and a method of fabricating the CMOS semiconductor device. The CMOS semiconductor device may include gates in the nMOS and pMOS areas, polycrystalline silicon (poly-Si) capping layers, metal nitride layers underneath the poly-Si capping layers, and a gate insulating layer underneath the gate. The metal nitride layers of the nMOS and pMOS areas may be formed of the same type of material and may have different work functions. Since a metal gate is formed of identical types of metal nitride layers, a process may be simplified, yield may be increased, and a higher-performance CMOS semiconductor device may be obtained. | 08-28-2008 |
20090072719 | Passivation film and electronic display device including the passivation film - Example embodiments relate to a passivation film for protecting an electronic device. The passivation film may include a myelin layer. The myelin layer may have a thickness of about 100 Å to 10 μm. The passivation film may further include an inorganic film. Example embodiments also relate to an electronic display device including a substrate, an organic light-emitting device (OLED) disposed on the substrate, and a myelin layer disposed on the organic light-emitting device. A plurality of myelin layers and a plurality of inorganic films may be alternately stacked on the organic light-emitting device in lieu of a single myelin layer. | 03-19-2009 |
20090173927 | Storage node, phase change memory device and methods of manufacturing and operating the same - Provided are a storage node, phase change memory device and methods of manufacturing and operating the same. The storage node may include an electrode, a phase change layer, and an anti-diffusion layer between the electrode and the phase change layer and including a silicide compound. The phase change memory device may include the storage node and a switching device connected to the storage node. | 07-09-2009 |
20100006820 | SILICA NANOWIRE COMPRISING SILICON NANODOTS AND METHOD OF PREPARING THE SAME - Provided are a silica nanowire that includes silicon nanodots and a method of preparing the same. The silica nanowire has excellent capacitance characteristics and improved light absorption ability, and thus can be effectively used in a variety of fields, such as various semiconductor devices including CTF memory, image sensors, photodetectors, light emitting diodes, laser diodes, and the like. | 01-14-2010 |