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Henrion
Blaise Henrion, Saint-Avertin FR
| Patent application number | Description | Published |
|---|---|---|
| 20100007159 | LIFTING HOOK WITH CHAIN LENGTH REDUCER - A lifting hook that can be used to lift loads using lifting gear includes a hook-shaped part which hooks onto the load to be lifted and a chain length reducer secured to the hook. The reducer includes an orifice whose dimensions allow the links of the chain to pass through and then allow one of the links to be locked in position when the chain is taut, and elements for partially closing off the orifice which are hinged so that they can be released manually simply by pressing them so as to allow the length of the chain to be adjusted. The reducer includes a closure finger that closes off the hook-shaped part and the closing-off elements include self-locking members which hold the closure finger in the locked position on the part of the hook as long as the closing-off elements are disengaged from the orifice. | 01-14-2010 |
Carson Henrion, Ft. Collins, CO US
| Patent application number | Description | Published |
|---|---|---|
| 20120127805 | MEMORY ELEMENTS HAVING SHARED SELECTION SIGNALS - Apparatus are provided for memory elements and related computing modules. An exemplary memory element includes a first array of one or more memory cells, a second array of one or more memory cells, write selection circuitry associated with the first array, and read selection circuitry associated with the second array. The write selection circuitry and the read selection circuitry are configured to be activated concurrently. | 05-24-2012 |
| 20120131279 | MEMORY ELEMENTS FOR PERFORMING AN ALLOCATION OPERATION AND RELATED METHODS - Apparatus for memory elements and related methods for performing an allocate operation are provided. An exemplary memory element includes a plurality of way memory elements and a replacement module coupled to the plurality of way memory elements. Each way memory element is configured to selectively output data bits maintained at an input address. The replacement module is configured to enable output of the data bits maintained at the input address of a way memory element of the plurality of way memory elements for replacement in response to an allocate instruction including the input address. | 05-24-2012 |
| 20120131399 | APPARATUS AND METHODS FOR TESTING MEMORY CELLS - Apparatus and methods are provided for concurrently selecting multiple arrays of memory cells when accessing a memory element. A memory element includes a first array of one or more memory cells coupled to a first bit line node, a second array of one or more memory cells coupled to a second bit line node, access circuitry for accessing a first memory cell in the first array, a first transistor coupled between the first bit line node and the access circuitry, and a second transistor coupled between the second bit line node and the access circuitry. A controller is coupled to the first transistor and the second transistor, and the controller is configured to concurrently activate the first transistor and the second transistor to access the first memory cell in the first array. | 05-24-2012 |
Carson D. Henrion, Ft. Collins, CO US
| Patent application number | Description | Published |
|---|---|---|
| 20080270703 | Method and system for managing memory transactions for memory repair - In one embodiment, a controller for an associative memory having n ways contains circuitry for sending a request to search an indexed location in each of the n ways for a tag, wherein the tag and an index that is used to denote the indexed location form a memory address. The controller also contains circuitry, responsive to the request, for sending a set of n validity values, each validity value indicating, for a respective way, whether the indexed location is a valid location or a defective location. Additionally, the controller contains circuitry for receiving a hit signal that indicates whether a match to the tag was found at any of the indexed locations, wherein no hit is ever received for a defective location. | 10-30-2008 |
Jean-Marc Henrion, Theux BE
| Patent application number | Description | Published |
|---|---|---|
| 20100239840 | Fiber Size, Sized Reinforcements, and Articles Reinforced with Sized Reinforcements - A fiber size composition contains a modified polyolefin, a hydrophilic coupling agent, a boron-containing, fluorine-containing compound, a blend of at least two fatty acids and a compound selected from phosphorus(V) compounds and sulfur(VI) compounds, the fiber size composition being substantially free of conventional lower oxidation state antioxidants and optical brighteners. Composite materials produced from reinforcing fiber materials sized with a fiber size composition according to the invention exhibit improved properties such as, for example, increased strength and/or improved color stability. | 09-23-2010 |
Marianne Henrion, Paris FR
| Patent application number | Description | Published |
|---|---|---|
| 20120077790 | Ulipristal Acetate Tablets - The invention relates to a pharmaceutical tablet for oral administration comprising ulipristal acetate together with the following excipients: at least one diluent in an amount of 50 to 98.5 wt %, at least one binding agent in an amount of 0 to 10 wt %, at least one disintegrating agent in an amount of 0.5 to 10 wt %, and at least one lubricant in an amount of 0 to 10 wt %. | 03-29-2012 |
Yann Henrion, Fontaine FR
| Patent application number | Description | Published |
|---|---|---|
| 20110024744 | CONNECTION PAD STRUCTURE FOR AN ELECTRONIC COMPONENT - The invention relates to electronic components on thinned substrates, for example image sensors. Preferably, connection pads are connected through the thinned substrate to underlying layers and notably to a test pad by way of openings through which the metal of the pad passes. The openings are elongate openings extending along one edge of the pad of rectangular shape and a circular area of at least 50% (and preferably 65 to 75%) of the area of the pad contains no opening for connection with the underlying layers. This circular area is intended for bonding an external connection wire. The connection pads are testable from the back side by test probes and the front side may be tested (before bonding and thinning) by test probes with the same geometric configuration. | 02-03-2011 |