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Henrichs, US

Joseph Reid Henrichs, Lee'S Summit, MO US

Patent application numberDescriptionPublished
20080205461Optical phase conjugation laser diode - A phase-conjugating resonator that includes a semiconductor laser diode apparatus that comprises a phase-conjugating array of retro-reflecting hexagon apertured hexahedral shaped corner-cube prisms, an electrically and/or optically pumped gain-region, a distributed bragg reflecting mirror-stack, a gaussian mode providing hemispherical shaped laser-emission-output metalized mirror. Wherein, optical phase conjugation is used to neutralize the phase perturbating contribution of spontaneous-emission, acoustic phonons, quantum-noise, gain-saturation, diffraction, and other intracavity aberrations and distortions that typically destabilize any stimulated-emission made to undergo amplifying oscillation within the inventions phase-conjugating resonator. Resulting in stablized high-power laser-emission-output into a single low-order fundamental transverse cavity mode and reversal of intra-cavity chirp that provides for high-speed internal modulation capable of transmitting data at around 20-Gigabits/ps. 08-28-2008
20080305560Method for eliminating defects from semiconductor materials - Using a helium cryostat, the temperature for a substrate wafer(s) is reduced to 2.2 Kelvin over a period of twenty-four hours. Next, a soak segment will hold the temperature of the substrate wafer at 2.2 Kelvins for a period of ninety-six hours. At these low temperatures, alloys such as GaAs, InP, and GaP will form dipole molecular moments, which will re-align along lines of internal magnetic force as molecular bonds condense. Next the substrate wafer's temperature is ramped up to room temperature over a period of twenty-four hours. Next, the temperature of the substrate wafer is ramped up to assure that the temperature gradients made to occur within the wafer are kept low. Typically, a temper ramp up temperature will range between 300° F. to 1100° F. and depends upon the single crystal material used to construct the substrate wafer. Next, the substrate wafer undergoes a temper hold segment, which assures that the entire substrate wafer has had the benefit of the tempering temperature. A typical temper hold segment is around 3 hours and depends upon the material, thickness, and diameter size of the substrate wafer.12-11-2008
20090162948METHOD FOR ELIMINATING DEFECTS FROM SEMICONDUCTOR MATERIALS - Using a helium cryostat, the temperature for a substrate wafer(s) is reduced to 2.2 Kelvin over a period of twenty-four hours. Next, a soak segment will hold the temperature of the substrate wafer at 2.2 Kelvins for a period of ninety-six hours. At these low temperatures, alloys such as GaAs, InP, and GaP will form dipole molecular moments, which will re-align along lines of internal magnetic force as molecular bonds condense. Next the substrate wafer's temperature is ramped up to room temperature over a period of twenty-four hours. Next, the temperature of the substrate wafer is ramped up to assure that the temperature gradients made to occur within the wafer are kept low. Typically, a temper ramp up temperature will range between 300° F. to 1100° F. and depends upon the single crystal material used to construct the substrate wafer. Next, the substrate wafer undergoes a temper hold segment, which assures that the entire substrate wafer has had the benefit of the tempering temperature. A typical temper hold segment is around 3 hours and depends upon the material, thickness, and diameter size of the substrate wafer.06-25-2009
20090273839Method for constructing a phase conjugate mirror - A method that provides for a phase conjugate mirror 11-05-2009
20100279446OPTICAL PHASE CONJUGATION LASER DIODE - A phase-conjugating resonator that includes a semiconductor laser diode apparatus that comprises a phase-conjugating array of retro-reflecting hexagon apertured hexahedral shaped corner-cube prisms, an electrically and/or optically pumped gain-region, a distributed bragg reflecting mirror-stack, a gaussian mode providing hemispherical shaped laser-emission-output metalized mirror. Wherein, optical phase conjugation is used to neutralize the phase perturbating contribution of spontaneous-emission, acoustic phonons, quantum-noise, gain-saturation, diffraction, and other intracavity aberrations and distortions that typically destabilize any stimulated-emission made to undergo amplifying oscillation within the inventions phase-conjugating resonator. Resulting in stablized high-power laser-emission-output into a single low-order fundamental transverse cavity mode and reversal of intra-cavity chirp that provides for high-speed internal modulation capable of transmitting data at around 20-Gigabits/ps.11-04-2010

Patent applications by Joseph Reid Henrichs, Lee'S Summit, MO US

Paul Henrichs, Sioux Falls, SD US

Patent application numberDescriptionPublished
20100191545METHODS AND PROCESSES TO TRANSFER PRECONFIGURED SYSTEMS TO REMOTE ENVIRONMENTS - Certain example embodiments provide systems, methods, processes, and/or apparatus to create and deploy preconfigured healthcare information systems to remote locations. A process to deploy a preconfigured system includes configuring a data management system installed within a virtualized environment with settings common to a plurality of network environments. The process also includes creating a portable system image on a secured media at a first location, wherein the portable system image includes an image of the first virtualized environment having the data management system installed. The process further includes transferring the portable system image to a second location. In addition, the process includes restoring the system image onto a second virtualized environment at the second location. The process also includes configuring the data management system to be communicatively coupled to at least one of an information system or a workstation at the second location.07-29-2010

Sven Henrichs, San Jose, CA US

Patent application numberDescriptionPublished
20080318137Lithography masks for improved line-end patterning - In one embodiment, a mask for use in semiconductor processing comprises a first region formed from a first material that is primarily opaque, a second region formed from a second material that is primarily transmissive, and a third region in which at least a portion of the second material is removed to generate a phase shift in radiation applied to the mask.12-25-2008
20090098469Process for fabrication of alternating phase shift masks - Design rules are described for a phase alternating shift mask for minimum chrome width and maximum segment length, where an embodiment employs during a cleaning process of the mask a megasonic power of 50 Watts at 1 MHz, and 30 Watts at 3 MHz. Some embodiments utilize an dry etch Carbon Tetrafluoride and Dioxygen based process. Other embodiments are described and claimed.04-16-2009