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Heng, MY
Boon Liang Heng, Kuala Lumpur MY
| Patent application number | Description | Published |
|---|---|---|
| 20090002010 | Active thermal control using a burn-in socket heating element - In one embodiment, the present invention includes a burn-socket for insertion into a test board, where the burn-in socket is coupled to receive a semiconductor device under test (DUT). The burn-in socket includes a substrate to support the semiconductor DUT, which includes a heating element embedded in a layer of the substrate. Other embodiments are described and claimed. | 01-01-2009 |
Chai Wei Heng, Melaka MY
| Patent application number | Description | Published |
|---|---|---|
| 20090001536 | Electronic Component and a Method of Fabricating an Electronic Component - An electronic component includes a lead frame assembly, an insert, a semiconductor chip and an encapsulation compound. The lead frame assembly includes a mounting hole, a die pad, a plurality of bonding fingers and a plurality of lead fingers. The insert includes a hollow center and is provided at the mounting hole of the lead frame assembly. The semiconductor chip is arranged on the die pad and includes contact areas on its surface. A plurality of electrical contacts respectively links the contact areas of the semiconductor chip to the bonding fingers of the lead frame assembly. An encapsulating compound encloses the insert, the semiconductor chip, and the electrical contacts, however, leaves the hollow center of the insert uncovered. | 01-01-2009 |
| 20090212446 | Semiconductor Device - A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion. | 08-27-2009 |
Chin Ngiap Heng, Penang Island MY
| Patent application number | Description | Published |
|---|---|---|
| 20100142746 | EARPHONE - An earphone has a casing that consists of a base housing ( | 06-10-2010 |
Wey Chien Heng, Shah Alam MY
| Patent application number | Description | Published |
|---|---|---|
| 20110267257 | METHOD AND APPARATUS FOR DISPLAYING AN IMAGE ON A COMMUNICATION DEVICE - A method and apparatus for displaying an image on a communication device are provided. The communication device is formed of a housing ( | 11-03-2011 |
Yang Hong Heng, Muar MY
| Patent application number | Description | Published |
|---|---|---|
| 20090051017 | Lead Frame with Non-Conductive Connective Bar - An electronic component includes a lead frame, a semiconductor chip and an encapsulating body. The lead frame includes a heat spreader area, a plurality of conductive lead fingers, at least one non-conductive tie bar, and a metal joint. The metal joint connects the at least one non-conductive tie bar to the heat spreader area. The semiconductor chip is provided on a die pad located on the heat spreader area. The encapsulating body covers at least part of the semiconductor chip, at least part of the at least one non-conductive tie bar and part of the lead frame. | 02-26-2009 |
| 20090140403 | ELECTRONIC DEVICE - Embodiments provide an electronic device including a leadframe, a chip attached to the leadframe, and encapsulation material disposed over a portion of the leadframe. The leadframe includes a first main face opposite a second main face and a plurality of edges extending between the first and second main faces. At least one of the plurality of edges includes a first profiled element and a second profiled element different than the first profiled element. The encapsulation material is disposed over the chip and the plurality of edges of the leadframe. | 06-04-2009 |
| 20090315172 | Semiconductor chip assembly - A semiconductor chip assembly includes a semiconductor chip and a pyrolytic graphite element that is an electrode that is electrically connected to and provides electrical conduction of current from the chip during operation of the chip. | 12-24-2009 |
Yang Hong Heng, Melaka MY
| Patent application number | Description | Published |
|---|---|---|
| 20100193920 | SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD OF ENCAPSULATING - A semiconductor device is disclosed having a leadframe comprising a first chip island and a second chip island. Each chip island of the leadframe has a first face and a second face. A first chip is attached to the first face of the first chip island and a second chip attached to the first face of the second chip island. A layer of encapsulation material forming an encapsulation material layer covers the second faces of the first and second chip islands where the thickness of the encapsulation material layer along the second face of the first chip island is different from the thickness of the encapsulation material layer along the second face of the second chip island. | 08-05-2010 |
Yang Hong Heng, Muar Johor MY
| Patent application number | Description | Published |
|---|---|---|
| 20080308952 | Method for Reliably Positioning Solder on a Die Pad for Attaching a Semiconductor Chip to the Die Pad and Molding Die for Solder Dispensing Apparatus - The rotational orientation of a die pad about its longitudinal axis is determined. The desired rotational orientation of a semiconductor chip to be attached to the die pad is determined. A molding die is provided which comprises a body with a cavity disposed in a bottom surface. The rotational orientation of the body of the molding die about its longitudinal axis is determined. The cavity is positioned in the body of the molding die with a rotational orientation such that the cavity is rotated with respect to the molding die by an angle corresponding to the desired rotational orientation of the semiconductor chip with respect to the die pad. | 12-18-2008 |
| 20090001535 | Semiconductor Module for a Switched-Mode Power Supply and Method for Its Assembly - Semiconductor module for a Switched-Mode Power Supply comprises at least one semiconductor power switch, a control semiconductor chip and a leadframe comprising a die pad and a plurality of leads disposed on one side of the die pad. The die pad comprises at least two mechanically isolated regions wherein the semiconductor power switch is mounted on a first region of the die pad and the control semiconductor chip is mounted on a second region of the die pad. Plastic housing material electrically isolates the first region and the second region of the die pad and electrically isolates the semiconductor power switch from the control semiconductor chip. | 01-01-2009 |