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Heitzer
Heinz-Dieter Heitzer, Heinsberg DE
| Patent application number | Description | Published |
|---|---|---|
| 20090000466 | METHOD TO ACTIVELY TRIGGER A SERVO VALVE - A method to actively trigger a servo valve of a hydraulic power steering system is disclosed herein. In the method, a present steering wheel torque is ascertained by a sensor. The method also includes the step of a desired rack-and-pinion force offset is specified. The method also includes the step of a desired steering wheel torque offset is specified. The method also includes the step of a desired shape of a power steering characteristic curve is specified. On the basis of the specified offset values, the ascertained steering wheel torque and the specified shape of the power steering characteristic curve, a setpoint is ascertained for a differential pressure at a hydraulic cylinder of the power steering system. Based on the steering wheel torque and on the setpoint for the differential pressure at the hydraulic cylinder, a setpoint is ascertained for a setting angle (φ) of a valve component. The method also includes the step of rotating an appropriate valve component of the servo valve until the setpoint of the setting angle of the valve component is reached. | 01-01-2009 |
| 20090056473 | TORQUE SENSOR FOR A STEERING WHEEL - A torque sensor for a steering wheel with a center axis has an input member, an output member, the input and output members being rotatable about the common center axis, and a spring member that is arranged in a flow of force between the input member and the output member, the spring member is configured as a flat spring member extending in a plane perpendicular to the center axis. | 03-05-2009 |
Ludwig Heitzer, Falkenfels DE
| Patent application number | Description | Published |
|---|---|---|
| 20100078822 | Electronic Device and Method of Manufacturing Same - This application relates to a method of manufacturing a semiconductor device comprising: providing multiple chips each comprising contact elements on a first main face of each of the multiple chips, and a first layer applied to each of the first main faces of the multiple chips; placing the multiple chips over a carrier with the first layers facing the carrier; applying encapsulation material to the multiple chips and the carrier to form an encapsulation workpiece embedding the multiple chips; and removing the carrier from the encapsulation workpiece. | 04-01-2010 |
| 20110204513 | Device Including an Encapsulated Semiconductor Chip and Manufacturing Method Thereof - A device includes a semiconductor chip having contact pads arranged on a first main face of the semiconductor chip. A first material has an elongation to break of greater than 35% covering the first main face of the semiconductor chip. An encapsulation body covers the semiconductor chip. A metal layer is electrically coupled to the contact pads of the semiconductor chip and extends over the encapsulation body. | 08-25-2011 |
Ludwig Heitzer, Regensburg DE
| Patent application number | Description | Published |
|---|---|---|
| 20080242057 | SEMICONDUCTOR DEVICE WITH A THINNED SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING THE THINNED SEMICONDUCTOR CHIP - A semiconductor device with a thinned semiconductor chip and a method for producing the latter is disclosed. In one embodiment, the thinned semiconductor chip has a top side with contact areas and a rear side with a rear side electrode. In this case, the rear side electrode is cohesively connected to a chip pad of a circuit carrier via an electrically conductive layer. In another embodiment, the thinned semiconductor chips of this semiconductor device according to the invention have low-microdefect edge side regions with semiconductor element structures and edge sides patterned by etching technology. | 10-02-2008 |
Michael Heitzer, Aachen DE
| Patent application number | Description | Published |
|---|---|---|
| 20120035891 | Simulation of Ejection After Mold Filling - A method, apparatus and software product for simulating the ejection of a part after mold filling and cooling in combination with phase transformation/solidification. A three dimensional computer model defining the geometry of the solution domain is provided and the boundary conditions are specified. The solution domain is enmeshed and the physical data for the materials are attached. The static equilibrium equations are solved and the effects of the ejection process on the part are computed. | 02-09-2012 |