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Heirich
Alan B. Heirich, Half Moon Bay, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20120102507 | STREAMING PROGRAMMING GENERATOR - A device receives input that includes definitions of components of a computational pipeline, where the components include one or more buffers, one or more kernels, and one or more stages within a control graph. The device generates, based on the input, kernel signatures for a graphics processor, where the kernel signatures compile into an executable streaming program for the computational pipeline. The device also generates, based on the input, host-side runtime code to execute the streaming program. | 04-26-2012 |
Alan Bryant Heirich, Half Moon Bay, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100238172 | CONE-CULLED SOFT SHADOWS - Soft shadows in computer graphics images are created by rendering the scene from the camera viewpoint and at least one light viewpoint. The positions of scene fragments and light fragments in the scene are stored. For each scene fragment, a frustum is defined between the position of the scene fragment and the light source. Light fragments are evaluated with respect to the frustum to select light fragments blocking light between the light source and the scene fragment. A color or monochromatic shading value is determined for each scene fragment that indicates the amount of light blocked or transmitted by the light fragments. The shading values are then used to alter scene fragments accordingly. Computer graphics images with soft shadows can be created entirely by a graphics processing subsystem or by a graphics processing subsystem in conjunction with a central processing unit using a pipelined, deferred shading approach. | 09-23-2010 |
Alan Bryant Heirich, Foster City, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090219288 | INTERACTIVE DEBUGGING AND MONITORING OF SHADER PROGRAMS EXECUTING ON A GRAPHICS PROCESSOR - A development application leverages the programmability of shader execution units in the graphics processing subsystem to make graphics processing subsystem state data accessible to applications executed outside the graphics processing subsystem. The development application modifies shaders to include state output instructions adapted to direct a shader execution unit to copy graphics processing subsystem state data to a location in the computer system that is accessible to applications executed outside of the graphics processing subsystem. Following the execution of the state output instructions, the shader execution unit can be halted or can continue executing the shader. The development application can modify the shader to include state restoration instructions adapted to direct the shader execution unit to set state data of the graphics processing subsystem to previous or new values. The development application can dynamically modify shaders with state output and restoration instructions to update state data of the graphics processing subsystem. | 09-03-2009 |
Doug Heirich, Palo Alto, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20130050943 | ELECTRONIC DEVICE ENCLOSURES AND HEATSINK STRUCTURES WITH THERMAL MANAGEMENT FEATURES - An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis. | 02-28-2013 |
Douglas L. Heirich, Palo Alto, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090034189 | RISER CARD HOUSING - A housing for accommodating one or more riser cards is disclosed. The one or more riser cards include a first riser card. The first riser card may be configured to carry at least a first component. The housing may include a first inlet side configured to allow first air to flow into the housing for cooling the first component. The housing may also include an outlet side configured to allow at least a first portion of the first air to flow away from the housing. The housing may be configured to be disposed inside an enclosure of an electronic device. At least one of the first inlet side and the outlet side may include a first guiding structure configured to guide movement of the first riser card relative to the housing. | 02-05-2009 |
| 20090141444 | APPARATUS FOR AIR COOLING OF AN ELECTRONIC DEVICE - An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode. | 06-04-2009 |
| 20100138056 | APPARATUS FOR AIR COOLING OF AN ELECTRONIC DEVICE - An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode. | 06-03-2010 |
| 20100246133 | METHOD AND APPARATUS FOR DISTRIBUTING A THERMAL INTERFACE MATERIAL - Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip. | 09-30-2010 |
| 20110228482 | METHOD AND APPARATUS FOR DISTRIBUTING A THERMAL INTERFACE MATERIAL - Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip. | 09-22-2011 |
Douglas L. Heirich, Santa Clara, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090316359 | HEAT-TRANSFER MECHANISM INCLUDING A LIQUID-METAL THERMAL COUPLING - Embodiments of a heat-transfer mechanism are described. This heat-transfer mechanism includes a first heatpipe having a first end and a second end, and a second heatpipe having a third end and a fourth end. Moreover, a heatpipe coupler is thermally coupled to the second end of the first heatpipe and the third end of the second heatpipe. This heatpipe coupler includes a housing surrounding a cavity and a liquid metal contained within the cavity, thereby providing a thermal path from the first end of the first heatpipe, which is configured to couple to a condenser, to the fourth end of the second heatpipe, which is configured to couple to an evaporator. | 12-24-2009 |