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Heintel

James Heintel, Kent, OH US

Patent application numberDescriptionPublished
20110067001CONTROL/MONITOR AUTOMATION FOR ASICS AND PROGRAMMABLE LOGIC - Systems and methods for automated control/monitoring code development for ASICs and PLDs are provided. Control/monitor structures associated with a module may be inputted into a standard specification file. One or more default configurations for each control/monitor structure may also be inputted into the specification file. Fields of the specification file may be automatically populated or updated in response to user input in another field, and input and consistency errors may be automatically detected and/or corrected. After a request to build a module is received, one or more source or header output files may be automatically generated using information from the specification file. Automatically generated documentation may also be inserted into the output files, and links may be generated to and from hardware specifications and programmer's manuals.03-17-2011

Markus Heintel, Muenchen DE

Patent application numberDescriptionPublished
20080244201METHOD FOR DIGITAL STORAGE OF DATA ON A DATA MEMORY WITH LIMITED AVAILABLE STORAGE SPACE - The most important data in a first memory of a data processing system are stored in a limited second data memory given upon a transfer thereof. The demarcation between important (and still storable) data on the one hand and less important (and therefore no longer storable) data is made dependent on the available storage volume (SV) of the target data memory. This achieves that an optimal amount of the most important data can be stored on the target data memory.10-02-2008
20080320264CHIP CARD PROTECTED AGAINST COPYING AND METHOD FOR PRODUCTION THEREOF - A chip card is protected against copying by having a data memory for storage of data that are protected, at least in a sub-region of the data memory, against alteration by users or attackers outside of a privileged group. Members of this group can write an individual identifier for this chip card into this protected memory region once, and can write a digital signature of this identifier to an arbitrary memory region of the data memory. The digital signature can be generated with the use of a secret key for which an associated public key exists with which it can be checked whether the digital signature was generated from the individual identifier with the use of a secret key.12-25-2008

Willi Heintel, Aalen DE

Patent application numberDescriptionPublished
20080204689Optical module with minimized overrun of the optical element - There is provided an optical module for microlithography. The optical module includes an optical element and a retaining device for holding the optical element. The optical element has (a) a main extension plane, in which it defines a radial direction R and a circumferential direction U, and (b) a free optical diameter and an overrun in the region of its outer periphery. The retaining device contacts the optical element in the region of the overrun, and is formed and/or contacts the optical element in such a manner that the overrun ratio, calculated from the overrun related to a minimum overrun necessary for the production of the optical element, is at most 1.5.08-28-2008
20080239270OPTICAL ELEMENT MODULE - An optical element module comprising a plurality of module components is provided. The module components comprise an optical element, an optical element holder and a contact element. The optical element has a first coefficient of thermal expansion. The optical element holder holds the optical element via the first contact element and has a second coefficient of thermal expansion, the second coefficient of thermal expansion being different from the first coefficient of thermal expansion. At least one of the module components is adapted to provide at least a reduction of forces introduced into the optical element upon a thermally induced position change in the relative position between the optical element and the optical element holder, the position change resulting from a temperature situation variation in a temperature situation of the plurality of module components.10-02-2008
20090147229Optical element unit and method of supporting an optical element - There is provided an optical element unit comprising an optical element, a connector element, and an optical element holder. The optical element has a plane of main extension as well as an outer circumference and defines a radial direction. The connector element connects the optical element and the optical element holder, the connector element having a first connector part connected to the optical element at the outer circumference and a second connector part connected to the optical element holder. The first connector part and the second connector part are connected via at least one coupling part, the coupling part being compliant in the radial direction and substantially preventing rotation between the first connector part and the second connector part in a plane substantially parallel to the plane of main extension.06-11-2009
20100065252CONNECTING ARRANGEMENT FOR AN OPTICAL DEVICE - The disclosure relates to a connecting arrangement for an optical device, such as in microlithography. The connecting arrangement includes a first body, a second body and a connecting device. The first body contacts the second body in a laminar manner in a contact region. The connecting device is connected to the second body and contacts the first body via at least one contact unit. The connecting device is configured to generate a predefinable contact force in the contact region between the first body and the second body. The contact unit includes a plurality of separate contact elements. Each contact element is connected to the second body via a spring unit which can be elastically deformed to generate a contribution to the contact force03-18-2010
20110063590OPTICAL ELEMENT MODULE - An optical element module comprising a plurality of module components is provided. The module components comprise an optical element, an optical element holder and a contact element. The optical element has a first coefficient of thermal expansion. The optical element holder holds the optical element via the first contact element and has a second coefficient of thermal expansion, the second coefficient of thermal expansion being different from the first coefficient of thermal expansion. At least one of the module components is adapted to provide at least a reduction of forces introduced into the optical element upon a thermally induced position change in the relative position between the optical element and the optical element holder, the position change resulting from a temperature situation variation in a temperature situation of the plurality of module components.03-17-2011

Patent applications by Willi Heintel, Aalen DE