Patent application number | Description | Published |
20090038493 | Printing in a medium - A method for transferring a pattern from an elastic stamp to a substrate in the presence of a third medium is described. A proximity contact is achieved between the stamp and the substrate. A layer of the third medium between the stamp and the substrate is controlled to a predetermined thickness. Stamps for carrying out this method are also described. | 02-12-2009 |
20090272285 | THREE-DIMENSIONAL STRUCTURES AND METHODS OF FABRICATING THE SAME USING A PRINTING PLATE - Methods of fabricating three-dimensional structures comprise: contacting a printing plate face with a suspension comprising particles to arrange the particles at predefined positions on the printing plate face, the predefined positions comprising a first position laterally adjacent to a second position; positioning the printing plate with the printing plate face turned toward a substrate and the first position aligned to a protrusion on the substrate; contacting the protrusion with a first layer of particles disposed at the first position of the printing plate to transfer the first layer of particles to a protrusion surface; moving the printing plate laterally to align the second position to the protrusion; and contacting the first layer of particles disposed on the protrusion surface with a second layer of particles disposed at the second position of the printing plate to transfer the second layer of particles to on top of the first layer of particles. | 11-05-2009 |
20090278213 | ELECTRODE ARRAYS AND METHODS OF FABRICATING THE SAME USING PRINTING PLATES TO ARRANGE PARTICLES IN AN ARRAY - Electrode arrays and methods of fabricating the same using a printing plate to arrange conductive particles in alignment with an array of electrodes are provided. In one embodiment, a semiconductor device comprises: a semiconductor topography comprising an array of electrodes disposed upon a semiconductor substrate; a dielectric layer residing upon the semiconductor topography; and at least one conductive particle disposed in or on the dielectric layer in alignment with at least one of the array of electrodes. | 11-12-2009 |
20110027499 | RADIATION-ASSISTED NANOPARTICLE PRINTING - A method of nanoparticle printing including: contacting a printing plate with a target substrate, while the printing plate is contacting the target substrate, illuminating nanoparticies on the printing plate with intense flashes of LASER light, or subjecting the nanoparticles to microwave radiation, such that energy is selectively transferred into the particles, increasing a local temperature of the particles which causes an increased interaction of the particles with the target substrate and produces a strong junction and removes the particles from the printing plate; and peeling off the printing plate from the target substrate. | 02-03-2011 |
20110244192 | THREE-DIMENSIONAL STRUCTURES AND METHODS OF FABRICATING THE SAME USING A PRINTING PLATE - Methods of fabricating three-dimensional structures comprise: contacting a printing plate face with a suspension comprising particles to arrange the particles at predefined positions on the printing plate face, the predefined positions comprising a first position laterally adjacent to a second position; positioning the printing plate with the printing plate face turned toward a substrate and the first position aligned to a protrusion on the substrate; contacting the protrusion with a first layer of particles disposed at the first position of the printing plate to transfer the first layer of particles to a protrusion surface; moving the printing plate laterally to align the second position to the protrusion; and contacting the first layer of particles disposed on the protrusion surface with a second layer of particles disposed at the second position of the printing plate to transfer the second layer of particles to on top of the first layer of particles. | 10-06-2011 |
20120282771 | ELECTRODE ARRAYS AND METHODS OF FABRICATING THE SAME USING PRINTING PLATES TO ARRANGE PARTICLES IN AN ARRAY - Electrode arrays and methods of fabricating the same using a printing plate to arrange conductive particles in alignment with an array of electrodes are provided. In one embodiment, a semiconductor device comprises: a semiconductor topography comprising an array of electrodes disposed upon a semiconductor substrate; a dielectric layer residing upon the semiconductor topography; and at least one conductive particle disposed in or on the dielectric layer in alignment with at least one of the array of electrodes. | 11-08-2012 |
20120328773 | ACCURATE DEPOSITION OF NANO-OBJECTS ON A SURFACE - The invention notably concerns a method for depositing nano-objects on a surface. The method includes: providing a substrate with surface patterns on one face thereof; providing a transfer layer on said face of the substrate; functionalizing areas on a surface of the transfer layer parallel to said face of the substrate, at locations defined with respect to said surface patterns, such as to exhibit enhanced binding interactions with nano-objects; depositing nano-objects and letting them get captured at the functionalized areas; and thinning down the transfer layer by energetic stimulation to decompose the polymer into evaporating units, until the nano-objects reach the surface of the substrate. The invention also provides a semiconductor device which includes a substrate and nano-objects accurately disposed on the substrate | 12-27-2012 |
20130009287 | ACCURATE DEPOSITION OF NANO-OBJECTS ON A SURFACE - The invention notably concerns a method for depositing nano-objects on a surface. The method includes: providing a substrate with surface patterns on one face thereof; providing a transfer layer on said face of the substrate; functionalizing areas on a surface of the transfer layer parallel to said face of the substrate, at locations defined with respect to said surface patterns, such as to exhibit enhanced binding interactions with nano-objects; depositing nano-objects and letting them get captured at the functionalized areas; and thinning down the transfer layer by energetic stimulation to decompose the polymer into evaporating units, until the nano-objects reach the surface of the substrate. The invention also provides a semiconductor device which includes a substrate and nano-objects accurately disposed on the substrate. | 01-10-2013 |