Patent application number | Description | Published |
20090206422 | Micromechanical diaphragm sensor having a double diaphragm - A method for producing a micromechanical diaphragm sensor, and a micromechanical diaphragm sensor produced with the method. The micromechanical diaphragm sensor has at least one first diaphragm as well as a second diaphragm, which is disposed essentially on top of the first diaphragm. Furthermore, the micromechanical diaphragm sensor has a first cavity and a second cavity, which is essentially disposed above the first cavity. | 08-20-2009 |
20090314085 | MICROMECHANICAL ACCELERATION SENSOR HAVING AN OPEN SEISMIC MASS - A micromechanical acceleration sensor having a substrate, a suspension, a seismic mass, and stationary capacitive electrodes, in which the seismic mass is suspended over the substrate with the help of the suspension, the seismic mass has a mass center of gravity, the suspension has at least two anchors on the substrate, the two anchors are situated on opposite sides of the mass center of gravity, the distance between the two anchors being small compared to a horizontal extension of the seismic mass, the two anchors determine a central axis, the seismic mass have recesses which are situated on opposite sides of the central axis and are laterally open outward on the sides facing away from the central axis, and the stationary electrodes at least engage in the recesses of the seismic mass. | 12-24-2009 |
20110030475 | SENSOR ELEMENT AND METHOD FOR OPERATING A SENSOR ELEMENT - A sensor element, in particular a multichannel acceleration sensor having a substrate and a seismic mass, the sensor element having a detecting element for detecting a deflection of the seismic mass relative to the substrate, and the sensor element having an excitation element for exciting a deflection of the seismic mass perpendicular to the main extension plane. | 02-10-2011 |
20120129291 | METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT - A method for producing a micromechanical component is described. The method includes providing a substrate having a layer system including an insulating material situated on the substrate, a conductive layer section and a protective layer structure connected to the conductive layer section, which borders a section of the insulating material. The method furthermore includes carrying out an isotropic etching process for removing a part of the insulating material, the conductive layer section and the protective layer structure preventing the removal of the bordered section of the insulating material; and a structural element being developed, which includes the conductive layer section, the protective layer structure and the bordered section of the insulating material. | 05-24-2012 |
20120133002 | Method for producing MEMS structures, and MEMS structure - A method for producing microelectromechanical structures in a substrate includes: arranging at least one metal-plated layer on a main surface of the substrate in a structure pattern; leaving substrate webs open beneath a structure pattern region by introducing first trenches into the substrate perpendicular to a surface normal of the main surface in a region surrounding the structure pattern; coating the walls of the first trenches perpendicular to the surface normal of the main surface with a passivation layer; and introducing cavity structures into the substrate at the base of the first trenches in a region beneath the structure pattern region. | 05-31-2012 |
20140117471 | Micromechanical component having a bond joint - A micromechanical component includes a substrate and a first oxide layer on the substrate, the first oxide layer having an aperture. The component further includes a conductive functional layer, which is provided on the first oxide layer in the region of the aperture, and a metal layer, which is provided on the functional layer, for producing a bond joint. A second oxide layer is provided on lateral faces of the functional layer for insulating the functional layer. | 05-01-2014 |
20150200775 | SYSTEM AND METHOD FOR CRYPTOGRAPHIC KEY IDENTIFICATION - A method for determining a cyrptographic key for a MEMS device includes identifying physical properties for the device. A feature vector having a plurality of values is determined. Each of the values correspond to different physical properties. The cryptographic key is determined from the feature vector. The cryptographic key can be determined using a fuzzy extractor. The cryptographic key can be determined using different feature vectors corresponding to different channels in a device or different MEMS structures in the device. | 07-16-2015 |
20150232331 | LAYER STRUCTURE FOR A MICROMECHANICAL COMPONENT - A layer structure for a micromechanical component, having:
| 08-20-2015 |