Patent application number | Description | Published |
20080282485 | Navy Blue and Black Mixtures, Method for the Production Thereof, and Their Use for Dying Material Containing Hydroxy Groups - Mixtures of vat dyes for hue-stable dyeings in navy to black shades comprising C.I . Vat Black 9 and at least one of C.I. Vat Blue 18, C.I. Vat Blue 19, C.I . Vat Blue 22, C.I. Vat Blue 6 and also halogenated 16,17-diethyidibenzanthrone derivatives, C.I. Vat Violet 13, C.I. Vat Black 20, and optionally C.I. Vat Black 65, processes for their production by mechanical mixing of the components and their use for hue-stable dyeing and printing of cellulosic material. | 11-20-2008 |
20100155257 | Aqueous, alkaline, cyanide-free bath for the galvanic deposition of zinc alloy coatings - An aqueous, alkaline, cyanide-free electrolyte bath for deposition of zinc alloy layers on substrate surfaces is described, which contains cationic pyridinium compounds as brighteners and polyamines as complexing agents. The electrolyte bath is suitable for electroplating bright and even zinc alloy coatings. | 06-24-2010 |
20100236936 | Aqueous,alkaline,cyanide-free bath for the galvanic deposition of zinc and zinc alloy coatings - The invention relates to an aqueous, alkaline cyanide-free electrolyte bath for de-positing zinc and zinc alloy coatings on substrate surfaces comprising (a) a source for zinc ions and optionally a source for further metal ions, (b) hydroxide ions, (c) a polymer of general formula I which is soluble in the bath and (d) at least one pyridinium compound of general formula II or III. The electrolyte bath is suitable for the galvanic deposition of bright and even zinc and zinc alloy coatings. | 09-23-2010 |
20100300890 | PYROPHOSPHATE-BASED BATH FOR PLATING OF TIN ALLOY LAYERS - An aqueous cyanide-free electrolyte bath for plating of tin alloy layers on substrate surfaces comprising (i) a tin ion source and a source for another alloy element, characterised in that it further contains (ii) N-methyl pyrrolidone is described. | 12-02-2010 |
20100326838 | PYROPHOSPHATE-CONTAINING BATH FOR CYANIDE-FREE DEPOSITION OF COPPER-TIN ALLOYS - A pyrophosphate-containing bath for the cyanide-free deposition of copper alloys on substrate surfaces, comprising a reaction product of a secondary monoamine with a diglycidyl ether, is described. The electrolyte bath is suitable for the galvanic deposition of glossy white, even and uniform copper-tin alloy coatings. | 12-30-2010 |
20110011746 | Aqueous, Acid Bath and Method for the Electrolytic Deposition of Copper - To generate a very uniform copper deposit in particular in blind micro vias (BMVs) and trenches, an aqueous, acid bath for the electrolytic deposition of copper is provided, said bath containing at least one copper ion source, at least one acid ion source, at least one brightener compound and at least one leveler compound, wherein at least one leveler compound is selected from the group comprising synthetically produced non-functionalized peptides and synthetically produced functionalized peptides and synthetically produced functionalized amino acids. | 01-20-2011 |
20110094583 | ELECTROPLATING ADDITIVE FOR THE DEPOSITION OF METAL, A BINARY, TERNARY, QUATERNARY OR PENTANARY ALLOY OF ELEMENTS OF GROUP 11 (IB)-GROUP 13 (IIIA)-GROUP 16 (VIA) - The invention relates to electroplating additives for the deposition of a group IB metal/binary or ternary group IB-group IIIA/ternary, quaternary or pentanary group IB-group IIIA-group VIA alloy on substrates useful for thin film solar cells. The additives have the general formula (A): | 04-28-2011 |
20120160698 | POLYMERS HAVING TERMINAL AMINO GROUPS AND USE THEREOF AS ADDITIVES FOR ZINC AND ZINC ALLOY ELECTRODEPOSITION BATHS - Additives for electrolyte baths for the electrodeposition of zinc or zinc alloy layer are described. The additives are polymers with terminal amino groups. These polymers are obtainable by reaction of at least one diamino compound (having two tertiary amino groups) with at least one di(pseudo)halogen compound, wherein the diamino compound is used in stoichiometric excess. The additives effect, in particular, a very little formation of bubbles and only few burnings as well as a uniform distribution of layer thickness in the electrodeposition of zinc or zinc alloy layers. | 06-28-2012 |
20140076461 | SOLUTION AND PROCESS FOR THE PRE-TREATMENT OF COPPER SURFACES USING AN N-ALKOXYLATED ADHESION-PROMOTING COMPOUND - The invention concerns a solution for pretreating copper surfaces, and a method for pre-treating copper surfaces allowing the formation of a tight bond to plastic substrates. The solution comprises: a) hydrogen peroxide, b) at least one acid, and c) at least one nitrogen-containing, five-membered, heterocyclic compound, and d) additionally at least one nitrogen containing, adhesion-promoting compound, said compound comprising, or consisting of, lactams, non-quaternary fatty amines, amides and polyamides, connected at one or more of its nitrogen atoms with at least one residue of formula (I). | 03-20-2014 |
20140124376 | PYROPHOSPHATE-CONTAINING BATH FOR CYANIDE-FREE DEPOSITION OF COPPER-TIN ALLOYS - A pyrophosphate-containing bath for the cyanide-free deposition of copper alloys on substrate surfaces, comprising a reaction product of a secondary monoamine with a diglycidyl ether, is described. The electrolyte bath is suitable for the galvanic deposition of glossy white, even and uniform copper-tin alloy coatings. | 05-08-2014 |
20140377471 | ALKALINE PLATING BATH FOR ELECTROLESS DEPOSITION OF COBALT ALLOYS - The present invention relates to aqueous, alkaline plating bath compositions for electroless deposition of ternary and quaternary cobalt alloys Co—M—P, Co—M—B and Co—M—B—P, wherein M is selected from the group consisting of Mn, Zr, Re, Mo, Ta and W which comprise a propargyl derivative as the stabilising agent. The cobalt alloy layers derived there from are useful as barrier layers and cap layers in electronic devices such as semiconducting devices, printed circuit boards, and IC substrates. | 12-25-2014 |