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Heeseok
Heeseok Kim, Seoul KR
| Patent application number | Description | Published |
|---|---|---|
| 20110216900 | METHODS OF ENCRYPTION AND DECRYPTION AND ENCRYPTION SYSTEMS USING THE SAME - Provided is a decryption method of an encryption algorithm. In the decryption method, a secret key can be received. A plurality of Montgomery multiplications can be repeated on a cipher text until a modular exponentiation of the secret key. When the repeated Montgomery multiplications are performed, an order of the plurality of Montgomery multiplications or an order of operands can be arbitrarily changed. | 09-08-2011 |
Heeseok Lee, Yongin-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100102428 | SEMICONDUCTOR PACKAGE - A semiconductor package that includes a first semiconductor device mounted on a package substrate and includes an inactive surface having a cavity and an active surface opposite to the inactive surface, a second semiconductor device that is disposed on the active surface and electrically connected to the first semiconductor device, and a third semiconductor device that is disposed on the inactive surface in the cavity and electrically connected to the first semiconductor device. The first semiconductor device includes at least one first through electrode electrically connecting the first semiconductor device to the third semiconductor device through the first semiconductor device. | 04-29-2010 |
| 20110018119 | Semiconductor packages including heat slugs - A semiconductor package may include at least one semiconductor chip mounted on a substrate, a molding layer adapted to mold the at least one semiconductor chip, a heat slug, on the molding layer, having a structure in which a dielectric is provided between conductors, and a through mold via electrically connecting the heat slug to the substrate. | 01-27-2011 |
| 20110141712 | PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE HAVING THE SAME - A package substrate includes a main body having an upper surface and a lower surface opposite to the upper surface, a plurality of external terminals attached to the lower surface, and a plurality of grooves formed in regions of the lower surface to which the plurality of external terminals is not attached. The semiconductor package includes a package substrate, a semiconductor chip mounted on the upper surface of the semiconductor substrate, and a board providing a region mounted with the package substrate and being mounted with a plurality of mounting elements which are vertically aligned with the plurality of grooves and are inserted into the plurality of grooves. | 06-16-2011 |
Heeseok Moon, Suwon-City KR
| Patent application number | Description | Published |
|---|---|---|
| 20110042009 | PLASMA ETCHING DEVICE - A plasma etching device is provided. The device includes a chamber, a cathode assembly, and an integral cathode liner. The chamber provides a plasma reaction space. The cathode assembly is positioned at an inner and central part of the chamber and supports a substrate. The integral cathode liner has a plurality of first vents and second vents formed at two levels and spaced apart respectively such that the uniformity of a gas flow and exhaust flow within the chamber is maintained, and is outer inserted to the cathode assembly and coupled at its lower end part to an inner surface of the chamber. | 02-24-2011 |
| 20110049111 | COLOR SYSTEM FOR ETCHING GAS - A control system for etching gas is provided. The control system includes a mass flow control unit, a flow rate control unit, and a tuning gas control unit. The mass flow control unit controls a mass flow of an etching gas input to a chamber. The flow rate control unit distributes the etching gas to an upper gas injector and a side gas injector connected with the mass flow control unit and installed in the chamber. The tuning gas control unit distributes and supplies a supplementary gas and tuning gas controlling an ion density and distribution of plasma within the chamber, to the mass flow control unit and the flow rate control unit. | 03-03-2011 |
Heeseok Moon, Pyeongtaek-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090129997 | PLASMA CHEMICAL REACTOR - A plasma chemical reactor includes a chamber for providing a plasma reaction space, and a cathode assembly coupled at one side to a wall surface of the chamber and supporting a substrate at the other side such that the substrate is positioned at a center inside the chamber, and installed to enable height adjustment such that the substrate can maintain a horizontal state. | 05-21-2009 |
Heeseok Yang, Gumi-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100096979 | METHOD OF MANUFACTURING METAL OXIDE ELECTRODE AND ORGANIC LIGHT EMITTING DIODE DISPLAY USING THE SAME - A method of manufacturing a metal oxide electrode and an organic light emitting diode (OLED) display using the same are provided. The method includes providing a substrate inside a chamber, providing Al | 04-22-2010 |