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Hee Min
Hee Min Lee, Seoul KR
| Patent application number | Description | Published |
|---|---|---|
| 20100102279 | RADIATION SHIELDING MEMBERS INCLUDING NANO-PARTICLES AS A RADIATION SHIELDING MATERIAL AND METHOD FOR PREPARING THE SAME - Disclosed is a radiation shielding member having improved radiation absorption performance, including 80.0˜99.0 wt % of a polymer matrix or metal matrix and 1.0˜20.0 wt % of a radiation shielding material in the form of nano-particles having a size of 10˜900 nm as a result of pulverization, wherein the radiation shielding material is homogeneously dispersed in the matrix through powder mixing or melt mixing after treatment with a surfactant which is the same material as the matrix or which has high affinity for the matrix. A preparation method thereof is also provided. This radiation shielding member including the nano-particles as the shielding material further increases the collision probability of the shielding material with radiation, compared to conventional shielding members including micro-particles, thus reducing the mean free path of radiation in the shielding member, thereby exhibiting superior radiation shielding effects. At the same density, the shielding member has reduced thickness and volume and is thus lightweight. The porosity of the shielding member is minimized, thereby preventing the deterioration of shielding effects and properties of the shielding member and realizing applicability in spent fuel managing transport/storage environments and the like. | 04-29-2010 |
Hee Min Shin, Chungcheongbuk-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20100092718 | WAFER MOUNT TAPE, WAFER PROCESSING APPARATUS AND METHOD OF USING THE SAME FOR USE IN THINNING WAFERS - A wafer mount tape, a wafer processing apparatus and an associated method of using the wafer mount tape for use in wafer thinning operations is presented. The wafer mount tape includes a tape body, a first adhesive member and a second adhesive member. The tape body has a first region, a second region and a third region. The first region of the tape body is for being disposed onto a wafer. The second region of the tape body is defined along a periphery of the first region. The third region of the tape body is defined along a periphery of the second region. The first adhesive member is disposed at the first region. The second adhesive member is disposed at the third region. | 04-15-2010 |
| 20110189928 | WAFER MOUNT TAPE, WAFER PROCESSING APPARATUS AND METHOD OF USING THE SAME FOR USE IN THINNING WAFERS - A wafer mount tape, a wafer processing apparatus and an associated method of using the wafer mount tape for use in wafer thinning operations is presented. The wafer mount tape includes a tape body, a first adhesive member and a second adhesive member. The tape body has a first region, a second region and a third region. The first region of the tape body is for being disposed onto a wafer. The second region of the tape body is defined along a periphery of the first region. The third region of the tape body is defined along a periphery of the second region. The first adhesive is member is disposed at the first region. The second adhesive member is disposed at the third region. | 08-04-2011 |
Hee Min Shin, Cheongju-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110272798 | CHIP UNIT AND STACK PACKAGE HAVING THE SAME - A chip unit includes: a first semiconductor chip and a second semiconductor chip disposed such that their surfaces for forming first bonding pads and second bonding pads face each other; first and second connection members disposed on the surfaces of the first and second semiconductor chips for forming the first and second bonding pads, and having redistribution lines which have one ends connected with the first and second bonding pads and the other ends projecting beyond one edges of the first and second semiconductor chips and films; an adhesive member interposed between the first connection members and the second connection members; and via patterns passing through the adhesive member and connecting projecting portions of the redistribution lines of the first and second connection members with each other. | 11-10-2011 |
| 20110272820 | STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A stacked semiconductor package includes a semiconductor package module including a plurality of semiconductor packages each of which has a first surface, a second surface facing away from the first surface, side surfaces connecting the first surface and the second surface and through-holes formed on the side surfaces to pass through the first surface and the second surface and which are stacked such that their through-holes vertically connect with one another, and adhesive members which are formed between the semiconductor packages and attach the semiconductor packages to one another, a main substrate supporting the semiconductor package module and formed, on a third surface thereof facing the semiconductor package module, with main connection pads which are aligned with the through-holes, and conductive connection members formed in the through-holes and electrically connecting the semiconductor packages with the main connection pads. | 11-10-2011 |