Patent application number | Description | Published |
20100237499 | SEMICONDUCTOR DEVICE, AND STACKED STRUCTURE, PACKAGE, MODULE, AND ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME - Semiconductor devices, as well as stacked structures, packages, modules, and electronic apparatus including the semiconductor device, and methods of fabricating the same. The semiconductor device includes a circuit layer on a substrate, a metal interconnection layer on the circuit layer, the metal interconnection layer having a copper interconnection and a protection layer, a first and a second through silicon via plugs vertically penetrating the circuit layer, a first via pad on the first through silicon via plug, and a second via pad on the second through silicon via plug, wherein the first via pad is electrically connected to the copper interconnection, and wherein the second via pad is electrically insulated from the copper interconnection. | 09-23-2010 |
20100297597 | CHILDREN'S EDUCATIONAL MAT - The present invention is suggested to improve the user input method when operating learning machines and game machines. The suggestion is intended to operate a system through a mat in order to overcome the limits of previous methods using a mouse, a stylus pen, a keyboard, etc., in user input methods. Compared with the previous methods, the method using the mat provides a variety of operation methods. In particular, curiosity can be stimulated in infants and children through physical activities and provides physical exercise. Furthermore, the emotional quotient of infants and children can be increased and the function as dynamic play equipment can be improved. Therefore, it is expected that the benefits of learning and exercise can be increased. In addition, it is expected to prevent the injury of infants and children and reduce noise in an apartment by enabling the infants and the children to play or study on the mat. The present technology is able to prominently affect the physical growths of kids or disabled persons. The invention includes: a mat ( | 11-25-2010 |
20110195392 | LEARNING MAT FOR CHILDREN USING TOY - The present invention relates to a learning mat for children using a toy that is capable of performing learning through the toy having a shape of a character, which induces a child's curiosity while learning and further ensures dynamic physical activities of the child while the learning. The learning mat includes: a mat | 08-11-2011 |
20130321277 | ELECTRONIC APPARATUS, KEY INPUTTING METHOD AND COMPUTER-READABLE MEDIUM - An electronic apparatus includes a key pad unit which is disposed on the key board and displays a plurality of divided button areas, a mode determination unit which determines an operation mode of the key pad unit, and a control unit which controls the key pad unit to display information regarding a plurality of keys corresponding to the determined operation mode on the plurality of button areas. | 12-05-2013 |
20140096047 | ELECTRONIC APPARATUS, METHOD OF EXECUTING APPLICATION, AND COMPUTER READABLE RECORDING MEDIUM - An electronic apparatus includes a storage unit which stores a plurality of applications, a management unit which manages a list of applications that have been already selected from among the plurality of applications stored in the storage unit, a user interface which applies transparency to a shortcut region which includes an icon corresponding to each application included in the list, and displays the transparent shortcut region, and a controller which, if one of the displayed icons is selected, drives an application corresponding to the selected icon. | 04-03-2014 |
20150103494 | PRINTED CIRCUIT BOARDS HAVING METAL LAYERS AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME - Printed circuit boards are provided. The printed circuit board includes an insulation layer, an interconnection portion and a metal layer. The insulation layer has a flat plate shape and includes a top surface and a bottom surface. The interconnection portion is disposed on at least one of the top and bottom surfaces of the insulation layer. The interconnection portion includes a plurality of interconnection patterns. The metal layer covers the plurality of interconnection patterns of the interconnection portion. Related semiconductor packages are also provided. | 04-16-2015 |
20150262841 | METHOD OF MANUFACTURING CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE - A method of manufacturing a circuit board may include: preparing a circuit board body including an insulating layer having a first surface and a second surface opposite to the first surface and a first conductive thin film layer disposed on the first surface of the insulating layer and having a convex portion which is disposed on a first surface of the first conductive thin film layer and is embedded in the insulating layer; removing the convex portion to form a cavity corresponding to the convex portion in the insulating layer; and forming one or more first wiring patterns on the first surface of the insulating layer by removing first portions of the first conductive thin film layer. The one or more first wiring patterns correspond to second portions of the first conductive thin film layer not removed. | 09-17-2015 |
20150333018 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package may include a package substrate, an MRAM chip, a first magnetic shielding film and a second magnetic shielding film. The MRAM chip may be arranged over the package substrate. The MRAM chip may be electrically connected with the package substrate. The first magnetic shielding film may attach the MRAM chip to the package substrate. The first magnetic shielding film may shield magnetic interference between the MRAM chip and the package substrate. The second magnetic shielding film may be arranged over the MRAM chip to shield magnetic interference at an upper region over the MRAM chip. Thus, the magnetic shielding layer may be arranged between the bonding pads of the MRAM chip so that magnetic interference between the bonding pads may be suppressed. | 11-19-2015 |