| Patent application number | Description | Published |
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| 20100136846 | Communications Jacks Having Contact Wire Configurations that Provide Crosstalk Compensation - Communications jacks include a housing having a plug aperture that is configured to receive a mating plug that is inserted along a horizontal plug axis and a vertically-oriented wiring board that is mounted substantially normal to the horizontal plug axis. First through fourth contact wires are mounted in the vertically-oriented wiring board, with the first and second contact wires forming a first differential pair of contact wires and the third and fourth contact wires forming a second differential pair of contact wires. At least a portion of the first differential pair of contact wires is positioned between the contact wires of the second differential pair of contact wires, and deflectable portions of the third and fourth contact wires include a crossover. Additionally, the fixed portions of the third and fourth contacts are spaced further apart vertically than are the fixed portions of the first and second contacts. | 06-03-2010 |
| 20110136372 | Communications Patching and Connector Systems Having Multi-Stage Near-End Alien Crosstalk Compensation Circuits - Communications patching devices include first and second connectors mounted immediately adjacent to each other. The first connector includes a first output terminal and a second output terminal that are connected to respective first and second conductive paths, and the second connector includes a third output terminal and a fourth output terminal that are connected to respective third and fourth conductive paths. The first and second conductive paths form a first differential pair of conductive paths and the first and second output terminals form a first differential pair of output terminals. The third and fourth conductive paths form a second differential pair of conductive paths, and the third and fourth output terminals form a second differential pair of output terminals. The output terminals are arranged such that a first signal coupling level from the first output terminal to the third output terminal in response to a communication signal that is transmitted through the first differential pair of output terminals exceeds a second signal coupling level from the first output terminal to the fourth output terminal in response to the communication signal. A first capacitor is provided between the first conductive path and the fourth conductive path and a second capacitor is provided between at least one of the first conductive path and the third conductive path or between the second conductive path and the fourth conductive path. | 06-09-2011 |
| 20110237116 | Communications Patching and Connector Systems Having Multi-Stage Near-End Alien Crosstalk Compensation Circuits - Communications patching devices include first and second connectors mounted immediately adjacent to each other. The first connector includes a first output terminal and a second output terminal that are connected to respective first and second conductive paths, and the second connector includes a third output terminal and a fourth output terminal that are connected to respective third and fourth conductive paths. The first and second conductive paths form a first differential pair of conductive paths and the first and second output terminals form a first differential pair of output terminals. The third and fourth conductive paths form a second differential pair of conductive paths, and the third and fourth output terminals form a second differential pair of output terminals. The output terminals are arranged such that a first signal coupling level from the first output terminal to the third output terminal in response to a communication signal that is transmitted through the first differential pair of output terminals exceeds a second signal coupling level from the first output terminal to the fourth output terminal in response to the communication signal. A first capacitor is provided between the first conductive path and the fourth conductive path and a second capacitor is provided between at least one of the first conductive path and the third conductive path or between the second conductive path and the fourth conductive path. | 09-29-2011 |
| Patent application number | Description | Published |
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| 20100133723 | METHOD FOR PRODUCING MOLDINGS - A method for producing moldings, in particular briquettes, from fine-grained to medium-grained mixed material using organic binders. In a first stage, the mixed material is heated to a temperature necessary for the molding operation. In a second, atmospherically separate stage, mixing of the mixed material with binder is performed, as well as downstream steps of the process. The method allows hazardous emissions to be avoided. | 06-03-2010 |
| 20110030507 | PROCESS AND APPARATUS FOR PRODUCING LIQUID PIG IRON OR LIQUID PRIMARY STEEL PRODUCTS - A process and an apparatus for producing liquid pig iron or liquid primary steel products from charge materials formed by iron ores and additions. The charge materials are subjected to a further reduction in a reducing zone ( | 02-10-2011 |
| 20110179910 | PROCESS FOR PRODUCING AGGLOMERATES OF FINELY PARTICULATE IRON CARRIERS - A process for producing agglomerates from fine-grained iron carriers and at least one binder as a charge material for a metallurgical process is shown. In at least one further agglomeration step, the agglomerates are coated with a layer, comprising iron carriers and at least one binder, and heated in such a way that the binder is cured in the region of the surface of the agglomerates. In a process for producing liquid pig iron or liquid primary steel products from charge materials and possibly additions and agglomerates, the agglomerates are preheated in a reducing zone, which has a preheating stage, in such a way that the agglomerates completely harden in the preheating stage. | 07-28-2011 |
