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Heather D.
Heather D. Dettman, Edmonton CA
| Patent application number | Description | Published |
|---|---|---|
| 20120034683 | PETROLEUM BIOCONVERSION OF ORGANIC ACIDS TO PREVENT REFINERY CORROSION - The present invention relates to the use of microorganisms (biocatalysts), or catalysts derived from these organisms (enzymes), to improve the quality of crude oil and bitumen as an attractive alternative to current upgrading methods. The invention identifies and characterizes the microorganism species, in particular, | 02-09-2012 |
Heather D. Kiersznowski, Windsor, CT US
| Patent application number | Description | Published |
|---|---|---|
| 20090132289 | SYSTEM AND METHOD FOR FACILITATING HEALTH SAVINGS ACCOUNT PAYMENTS - Ways are provided for a health care organization (HCO) to facilitate payments from a tax-advantaged medical savings account, such as an HSA account, in conjunction with claim processing, by way of automatically debiting an HSA account and providing an integrated claim payment adjustment functionality to eliminate underpayments and/or overpayments for the HSA and health plan balances. A claim processing module reprocesses the claim to adjust the respective balances in one or more of the following ways: (a) HCO crediting the HSA account to eliminate the overpayment from the HSA, (b) HCO issuing a collection request to the health care provider to adjust for overpayment of the HCO balance, (c) HCO issuing a second payment to the health care provider to adjust for the underpayment of the HCO balance, and (d) HCO rebalancing the member and HCO-responsible portions of the claim. | 05-21-2009 |
Heather D. Leifeste, Goleta, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20110042772 | Composite Semiconductor Structure Formed Using Atomic Bonding and Adapted to Alter the Rate of Thermal Expansion of a Substrate - In certain embodiments, a method includes forming a composite semiconductor structure for altering a rate of thermal expansion of a first substrate. The composite semiconductor structure is formed by atomically bonding a first surface of a thermal matching substrate to a first surface of the first substrate, and atomically bonding a second surface of the thermal matching substrate to a first surface of a balancing substrate. The thermal matching substrate is adapted to alter the rate of thermal expansion of the first substrate and the balancing substrate is adapted to substantially prevent warping of the composite semiconductor structure. | 02-24-2011 |