Patent application number | Description | Published |
20080231931 | MEMS CAVITY-COATING LAYERS AND METHODS - Devices, methods, and systems comprising a MEMS device, for example, an interferometric modulator, that comprises a cavity in which a layer coats multiple surfaces. The layer is conformal or non-conformal. In some embodiments, the layer is formed by atomic layer deposition (ALD). Preferably, the layer comprises a dielectric material. In some embodiments, the MEMS device also exhibits improved characteristics, such as improved electrical insulation between moving electrodes, reduced stiction, and/or improved mechanical properties. | 09-25-2008 |
20080311690 | ELIMINATE RELEASE ETCH ATTACK BY INTERFACE MODIFICATION IN SACRIFICIAL LAYERS - Methods of making a microelectromechanical system (MEMS) device are described. In some embodiments, the method includes forming a sacrificial layer over a substrate, treating at least a portion of the sacrificial layer to form a treated sacrificial portion, forming an overlying layer over at least a part of the treated sacrificial portion, and at least partially removing the treated sacrificial portion to form a cavity situated between the substrate and the overlying layer, the overlying layer being exposed to the cavity. | 12-18-2008 |
20090002804 | ELECTROMECHANICAL DEVICE TREATMENT WITH WATER VAPOR - Methods, devices, and systems provide MEMS devices exhibiting at least one of reduced stiction, reduced hydrophilicity, or reduced variability of certain electrical characteristics using MEMS devices treated with water vapor. The treatment is believed to form one or more passivated surfaces on the interior and/or exterior of the MEMS devices. Relatively gentle temperature and pressure conditions ensure modification of surface chemistry without excessive water absorption after removal of sacrificial material to release the MEMS devices. | 01-01-2009 |
20090071933 | ETCHING PROCESSES USED IN MEMS PRODUCTION - The efficiency of an etching process may be increased in various ways, and the cost of an etching process may be decreased. Unused etchant may be isolated and recirculated during the etching process. Etching byproducts may be collected and removed from the etching system during the etching process. Components of the etchant may be isolated and used to general additional etchant. Either or both of the etchant or the layers being etched may also be optimized for a particular etching process. | 03-19-2009 |
20100219155 | EQUIPMENT AND METHODS FOR ETCHING OF MEMS - Etching equipment and methods are disclosed herein for more efficient etching of sacrificial material from between permanent MEMS structures. An etching head includes an elongate etchant inlet structure, which may be slot-shaped or an elongate distribution of inlet holes. A substrate is supported in proximity to the etching head in a manner that defines a flow path substantially parallel to the substrate face, and permits relative motion for the etching head to scan across the substrate. | 09-02-2010 |
20100245979 | MEMS CAVITY-COATING LAYERS AND METHODS - Devices, methods, and systems comprising a MEMS device, for example, an interferometric modulator, that comprises a cavity in which a layer coats multiple surfaces. The layer is conformal or non-conformal. In some embodiments, the layer is formed by atomic layer deposition (ALD). Preferably, the layer comprises a dielectric material. In some embodiments, the MEMS device also exhibits improved characteristics, such as improved electrical insulation between moving electrodes, reduced stiction, and/or improved mechanical properties. | 09-30-2010 |
20110012219 | OPTIMIZATION OF DESICCANT USAGE IN A MEMS PACKAGE - A MEMS device may be package with a desiccant to provide a moisture-free environment. In order to avoid undesirable effects on the MEMS device, the desiccant may be selected or treated so as to be compatible with a particular MEMS device. This treatment may include baking of the desiccant to as to cause outgassing of moisture or other undesirable material. The structure of the MEMS device may also be altered to improve compatibility with particular desiccants. | 01-20-2011 |
20120194496 | APPARATUS AND METHOD FOR SUPPORTING A MECHANICAL LAYER - This disclosure provides systems, methods and apparatuses for supporting a mechanical layer. In one aspect, an electromechanical systems device includes a substrate, a mechanical layer, and a post positioned on the substrate for supporting the mechanical layer. The mechanical layer is spaced from the substrate and defines one side of a gap between the mechanical layer and the substrate, and the mechanical layer is movable in the gap between an actuated position and a relaxed position. The post includes a wing portion in contact with a portion of the mechanical layer, the wing portion positioned between the gap and the mechanical layer. The wing portion can include a plurality of layers configured to control the curvature of the mechanical layer. | 08-02-2012 |
20120206462 | MEMS CAVITY-COATING LAYERS AND METHODS - Devices, methods, and systems comprising a MEMS device, for example, an interferometric modulator, that comprises a cavity in which a layer coats multiple surfaces. The layer is conformal or non-conformal. In some embodiments, the layer is formed by atomic layer deposition (ALD). Preferably, the layer comprises a dielectric material. In some embodiments, the MEMS device also exhibits improved characteristics, such as improved electrical insulation between moving electrodes, reduced stiction, and/or improved mechanical properties. | 08-16-2012 |
20130098675 | METHOD AND APPARATUS FOR APPLICATION OF ANTI-STICTION COATING - This disclosure provides apparatus, systems and methods for manufacturing electromechanical systems (EMS) packages. One method includes making an EMS package that includes an out-gassable anti-stiction coating. The anti-stiction coating may be a solvent that is included within part of a desiccant mixture. In some implementations, the method includes sealing an EMS device into a package and then heating the package using a temperature profile that out-gasses at least a portion of a residual solvent. The method may include an incubation bake cycle to distribute anti stiction material to display elements within the EMS package. The incubation bake cycle may also more evenly distribute contaminants within the EMS package so as to reduce their effects. | 04-25-2013 |
Patent application number | Description | Published |
20090009444 | MEMS DEVICES HAVING IMPROVED UNIFORMITY AND METHODS FOR MAKING THEM - Disclosed is a microelectromechanical system (MEMS) device and method of manufacturing the same. In one aspect, MEMS such as an interferometric modulator include one or more elongated interior posts and support rails supporting a deformable reflective layer, where the elongated interior posts are entirely within an interferometric cavity and aligned parallel with the support rails. In another aspect, the interferometric modulator includes one or more elongated etch release holes formed in the deformable reflective layer and aligned parallel with channels formed in the deformable reflective layer defining parallel strips of the deformable reflective layer. | 01-08-2009 |
20090065764 | Methods and devices for forming nanostructure monolayers and devices including such monolayers - Methods for forming or patterning nanostructure arrays are provided. The methods involve formation of arrays on coatings comprising nanostructure association groups, patterning using resist, and/or use of devices that facilitate array formation. Related devices for forming nanostructure arrays are also provided, as are devices including nanostructure arrays (e.g., memory devices). | 03-12-2009 |
20100155786 | Methods and devices for forming nanostructure monolayers and devices including such monolayers - Methods for forming or patterning nanostructure arrays are provided. The methods involve formation of arrays on coatings comprising nanostructure association groups, formation of arrays in spin-on-dielectrics, solvent annealing after nanostructure deposition, patterning using resist, and/or use of devices that facilitate array formation. Related devices for forming nanostructure arrays are also provided, as are devices including nanostructure arrays (e.g., memory devices). Methods for protecting nanostructures from fusion during high temperature processing are also provided. | 06-24-2010 |
Patent application number | Description | Published |
20110105185 | Interferometric modulation devices having triangular subpixels - At least some subpixels in an interferometric modulator display are formed in a triangular shape. Such triangular subpixels may be formed and/or addressed in a variety of manners. At least some individual triangular subpixels may be separately addressable. However, a plurality of triangular subpixels may be addressable as a group, e.g., as a group of 2, 3, 4 or more. A single pixel may include varying numbers of triangular subpixels. For example, a single pixel may include 3, 6, 9, 12, 15, 18, 21 or some other number of triangular subpixels. Alternatively, a single pixel may include 4, 8, 12, 16, 20, or some other number of triangular subpixels. A single pixel may include triangular subpixels that are configured to be separately addressable and/or triangular subpixels are configured to be addressable as a group. | 05-05-2011 |
20120019894 | Interferometric modulation devices having triangular subpixels - At least some subpixels in an interferometric modulator display are formed in a triangular shape. Such triangular subpixels may be formed and/or addressed in a variety of manners. At least some individual triangular subpixels may be separately addressable. However, a plurality of triangular subpixels may be addressable as a group, e.g., as a group of 2, 3, 4 or more. A single pixel may include varying numbers of triangular subpixels. For example, a single pixel may include 3, 6, 9, 12, 15, 18, 21 or some other number of triangular subpixels. Alternatively, a single pixel may include 4, 8, 12, 16, 20, or some other number of triangular subpixels. A single pixel may include triangular subpixels that are configured to be separately addressable and/or triangular subpixels are configured to be addressable as a group. | 01-26-2012 |
Patent application number | Description | Published |
20110209408 | APPARATUS FOR SIMULTANEOUS LOUVER OPERATION ON ARCHED SHUTTERS - An arched shutter configured for automated, simultaneous control of a plurality of louvers, the arched shutter comprises the plurality of louvers, a frame, a portion of which forms an arch, a base, wherein the plurality of louvers are installed between the base and the portion of the frame that forms an arch via a plurality of rod arms, a motor configured to drive one of the plurality of rod arms and therefore one of the plurality of louvers, and a plurality of linking apparatus connecting the plurality of louvers such that all of the plurality of louvers operate when the one louver is driven by the motor. | 09-01-2011 |
20110213500 | ENVIRONMENTAL CONTROL SYSTEM COMPRISING MOTORIZED SHUTTER - An arched shutter configured for automated, simultaneous control of a plurality of louvers, the arched shutter comprises the plurality of louvers, a frame, a portion of which forms an arch, a base, wherein the plurality of louvers are installed between the base and the portion of the frame that forms an arch via a plurality of rod arms, a motor configured to drive one of the plurality of rod arms and therefore one of the plurality of louvers, and a plurality of linking apparatus connecting the plurality of louvers such that all of the plurality of louvers operate when the one louver is driven by the motor. | 09-01-2011 |
20110269389 | SYSTEMS AND METHODS FOR A MOTORIZED VENT COVERING IN AN ENVIRONMENT CONTROL SYSTEM - A motorized vent covering for an air vent of the environment control system, the motorized vent covering comprising an air flow restrictor for controlling air flow through the vent; and an actuator, the actuator including a motor configured to drive the air flow restrictor to control the flow of air from the vent, and a controller in communication with the motor, the controller configured to provide operating instructions to the motor to open or close the air flow restrictor to adjust the flow of air through the air vent. | 11-03-2011 |
20110270446 | SYSTEMS AND METHODS FOR AN ENVIRONMENTAL CONTROL SYSTEM INCLUDING A MOTORIZED VENT COVERING - A motorized vent covering for an air vent of the environment control system, the motorized vent covering comprising an air flow restrictor for controlling air flow through the vent; and an actuator, the actuator including a motor configured to drive the air flow restrictor to control the flow of air from the vent, and a controller in communication with the motor, the controller configured to provide operating instructions to the motor to open or close the air flow restrictor to adjust the flow of air through the air vent. | 11-03-2011 |