Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Hayami

Hayami Kondo, Yamagata JP

Patent application numberDescriptionPublished
20100128891REPULSION-TYPE MAGNETIC CIRCUIT AND SPEAKER DEVICE - A repulsive-type magnetic circuit prevents deterioration of magnetic characteristic of magnets due to heat accumulation, and includes: a magnet and plural magnets arranged such that matching poles of the magnet and each of the plural magnets confront each other; a yoke; a pole piece; and a top plate. The pole piece is above the yoke. The top plate is above the pole piece. The magnet is between the yoke and the pole piece. The plural magnets are arranged between the pole piece and top plate. Joule heat generated by the voice coil is hardly propagated, as radiant heat, to one of the plural magnets on the side near the top plate. Accordingly, the temperature of the magnet on the top plate side hardly rises even if radiant heat continuously propagates to the pole piece. This prevents demagnetization of each of the plural magnets, and deterioration of the magnetic characteristics thereof.05-27-2010

Hayami Kudo, Kyoto-Shi JP

Patent application numberDescriptionPublished
20100253182SURFACE ACOUSTIC WAVE DEVICE AND MANUFACTURING METHOD THEREOF - A surface acoustic wave device causing less wear of a dicing blade and causing less drop in a dicing speed is manufactured from a mother laminate with high yield and high precision. The surface acoustic wave device is manufactured by dicing a piezoelectric wafer. The surface acoustic wave device includes a piezoelectric substrate resulting from dicing the piezoelectric wafer, IDT electrodes and pad electrodes located on a top surface of the piezoelectric substrate. A support layer having an opening opened to the IDT electrodes is provided. An outline edge of the support layer is inside an outline edge of the top surface of the piezoelectric substrate. A cover made of an insulating material is disposed on the support layer to close the opening of the support layer. In plan view, the outline edge of the cover is aligned with the outline edge of the piezoelectric substrate.10-07-2010
20100277035PIEZOELECTRIC DEVICE - A piezoelectric device includes a piezoelectric substrate, a conductive pattern which is provided on one main surface of the piezoelectric substrate and which includes an IDT electrode, a supporting layer which is arranged on the one main surface of the piezoelectric substrate so as to surround the periphery of an IDT-forming region in which the IDT electrode is provided and which has a thickness greater than that of the IDT electrode, and a cover layer which is arranged on the supporting layer and which covers the IDT-forming region. The supporting layer includes removed sections provided at a plurality of positions at least in a region close to the IDT-forming region, the removed sections being obtained by partially removing a portion of the supporting layer to be bonded to the one main surface of the piezoelectric substrate.11-04-2010
20100289600ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME - An elastic wave device has a structure that prevents flux from flowing into a hollow space of the device during mounting of the device using solder bumps. The elastic wave device includes a substrate, a vibrating portion located on a first main surface of the substrate, pads located on the first main surface of the substrate and electrically connected to electrodes of the vibrating portion, a supporting layer arranged on the first main surface of the substrate so as to enclose the vibrating portion, a sheet-shaped cover layer composed of resin including synthetic rubber and disposed on the supporting layer so as to form a hollow space around the periphery of the vibrating portion, a protective layer composed of resin having resistance to flux and disposed on a side of the cover layer remote from the supporting layer, via conductors extending through the protective layer, the cover layer, and the supporting layer and connected to the pads, and external electrodes including solder bumps, disposed at ends of the via conductors adjacent to the protective layer11-18-2010

Hayami Nakagawa, Anjo-Shi JP

Patent application numberDescriptionPublished
20080238148BODY FRAMEWORK CONSTRUCTION - A body framework construction, includes: a rear seat cross member, extending in a transverse direction of a vehicle, in a rear part of a body in a lower part of a passenger compartment; a dash cross member upper, extending in the transverse direction, in a front part of the passenger compartment; and a backbone, configured into a thin, long shape having a closed cross section, and extending in a longitudinal direction of the vehicle. A front end portion of the backbone is connected to the dash cross member upper via a gusset, and a rear end portion of the backbone is joined to the rear seat cross member. The gusset is deformed more easily than the backbone relative to a force from a front.10-02-2008
20080238150VEHICLE BODY STRUCTURE - A vehicle body structure, includes: a pair of front side members, front ends of which are joined to both ends of a front bumper via impact absorbing portions, respectively; front-side-member upper members, which are arranged above the front side members, and front ends of which are connected to the front side members, respectively; front-side-member lower members, which are arranged below the front side members, and front ends of which are connected to the front side members, respectively; and a dash cross member, which extends in a widthwise direction of a vehicle body, and to which rear ends of the front-side-member lower members are joined. The dash cross member includes wall portions with which parts of the rear ends of the front-side-member lower members can be brought in contact, on a rear side of the vehicle body.10-02-2008
20080238151PILLAR CONSTRUCTION FOR VEHICLE - An upper member of a pillar has a substantially U-shaped cross section, and includes first side walls extending substantially in a transverse direction of the vehicle at least at a lower portion. The upper member includes a connecting plate at a lower end while keeping the U-shaped cross section. A lower member includes a mounting plate opposed to the connecting plate at a lower portion being lower than an upper end, and the lower member includes second side walls extending substantially in the transverse direction at both end portions of the mounting plate in a longitudinal direction of the vehicle. The connecting plate and the mounting plate are welded to each other in a state that the connecting plate and the mounting plate are in abutment with each other, and the first side walls and the second side walls or the first and second side walls and wall members attached to the first and second side walls, are joined to each other, and the upper member and the lower member are integrally fixed to each other.10-02-2008