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Hawks, US
Dan Hawks, Pella, IA US
| Patent application number | Description | Published |
|---|---|---|
| 20090000155 | Cutting Element Supported on a Chain - In a chain excavator including an excavation chain with links routed around a drive sprocket and an end idler with a base plate mounted to a link for supporting excavation implements, a stabilizing element extends rearwardly from directly behind the excavation implement in order to contact and be supported by its trailing base plate. | 01-01-2009 |
Daniel Harlan Hawks, University City, MO US
| Patent application number | Description | Published |
|---|---|---|
| 20090144584 | System and method for performance monitoring and repair of computers - A system and method for monitoring computer performance and repairing and/or optimizing system configurations. During these idle times, the present process executes a sequence of background system analyses that can trigger associated optimization, maintenance, or repair actions based on a comparison of current computer states and baseline optimal health data. If other tasks are initiated by a user of the system, while the present invention is performing any of its actions, the monitoring and repair program terminates itself and releases full control back to the user and operating system. | 06-04-2009 |
David Hawks, Woodbury, MN US
| Patent application number | Description | Published |
|---|---|---|
| 20100305630 | HOUSING - A first housing | 12-02-2010 |
Doug Hawks, Escondido, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090315162 | Micro-Modules with Molded Passive Components, Systems Using the Same, and Methods of Making the Same - Semiconductor die packages, methods of making said packages, and systems using said packages are disclosed. An exemplary package comprises at least one semiconductor die disposed on one surface of a leadframe and electrically coupled to at least one conductive region of the leadframe, and at least one passive electrical component disposed on the other surface of a leadframe and electrically coupled to at least one conductive region of the leadframe. Molding material is disposed over the at least one passive electrical component to provide a molded passive component. | 12-24-2009 |
| 20090315163 | Semiconductor Die Packages with Stacked Flexible Modules Having Passive Components, Systems Using the Same, and Methods of Making the Same - Disclosed are semiconductor die packages comprising flexible modules having passive components, with the flexible modules and one or more semiconductor dice disposed in a stacked relationship, systems using the same, and methods of making the same. In one exemplary package embodiment, one or more semiconductor dice are disposed on a leadframe that is disposed in a stacked relationship with the flexible module. In another embodiment, one or more semiconductor dice are attached to a surface of a flexible module. | 12-24-2009 |
Douglas Hawks, Escondido, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20110147917 | INTEGRATED CIRCUIT PACKAGE WITH EMBEDDED COMPONENTS - This document discusses, among other things, a semiconductor die package having a first and a second discrete components embedded into a dielectric substrate. An integrated circuit (IC) die is surface mounted on a first side of the dielectric substrate. The semiconductor die package includes a plurality of conductive regions on the second side of the dielectric substrate for mounting the semiconductor die package. A plurality of through hole vias couple the IC die to the first and second discrete components and the plurality of conductive regions. | 06-23-2011 |
Douglas Alan Hawks, Escondido, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090212391 | Micromodules Including Integrated Thin Film Inductors and Methods of Making the Same - Micromodules and methods of making them are disclosed. An exemplary micromodule includes a substrate having a thin film inductor, and a bumped die mounted on the substrate and over the thin film inductor. | 08-27-2009 |
| 20110030206 | MICROMODULES INCLUDING INTEGRATED THIN FILM INDUCTORS AND METHODS OF MAKING THE SAME - Micromodules and methods of making them are disclosed. An exemplary micromodule includes a substrate having a thin film inductor, and a bumped die mounted on the substrate and over the thin film inductor. | 02-10-2011 |
| 20110121413 | MICROELECTROMECHANICAL SYSTEMS MICROPHONE PACKAGING SYSTEMS - This document discusses, among other things, a conductive frame, a silicon die coupled to the conductive frame, the silicon die including a vibratory diaphragm, the die having a silicon die top opposite a silicon die bottom, with a silicon die port extending through the silicon die to the vibratory diaphragm, with a silicon die terminal in electrical communication with the conductive frame and an insulator affixed to the conductive frame and the silicon die, with the insulator extending through interstices in the conductive frame to a conductive frame bottom of the conductive frame, and around an exterior of the silicon die to the silicon die top, with the insulator physically affixed to the silicon die and to the conductive frame, with the silicon die port exposed and with a conductive frame terminal disposed at the conductive frame bottom in electrical communication with the silicon die terminal. | 05-26-2011 |
Jeff Hawks, Lincoln, NE US
| Patent application number | Description | Published |
|---|---|---|
| 20090054909 | METHODS AND SYSTEMS OF ACTUATION IN ROBOTIC DEVICES - The embodiments disclosed herein relate to various medical device components, including components that can be incorporated into robotic and/or in vivo medical devices. Certain embodiments include various actuation system embodiments, including fluid actuation systems, drive train actuation systems, and motorless actuation systems. Additional embodiments include a reversibly lockable tube that can provide access for a medical device to a patient's cavity and further provides a reversible rigidity or stability during operation of the device. Further embodiments include various operational components for medical devices, including medical device arm mechanisms that have both axial and rotational movement while maintaining a relatively compact structure. medical device winch components, medical device biopsy/stapler/clamp mechanisms, and medical device adjustable focus mechanisms. | 02-26-2009 |
Johnathan N. Hawks, High Point, NC US
| Patent application number | Description | Published |
|---|---|---|
| 20110000921 | Reservoir Baffle Arrangement for a Vehicle Fuel Tank - A baffle arrangement for a vehicle fuel tank includes first and second wall portions, each having an inner end and an outer end and formed as a spiral of about 270 degrees. The first wall portion and second wall portion are positioned with the respective inner ends in opposed spaced relation to define a central reservoir, and with the respective outer ends spaced from the other wall portion to form inlets on opposite sides, the portions between the inner ends and outer ends defining passageways to the central reservoir. | 01-06-2011 |
Robert Daniel Hawks, Pella, IA US
| Patent application number | Description | Published |
|---|---|---|
| 20090260264 | TRENCHER ATTACHMENT - The present disclosure provides a system and method of creating trenches of various widths, including widths that are substantially greater than the width of the boom head or even the chassis. According to the trencher system of the present disclosure, the boom is designed so that it can be easily configured to create a trench of a first width and subsequently create a trench of a second width that is different than the first width. | 10-22-2009 |
Ronald L. Hawks, Raleigh, NC US
| Patent application number | Description | Published |
|---|---|---|
| 20100000406 | APPARATUS AND METHOD FOR CONTROLLING MERCURY POLLUTION FROM A CEMENT PLANT - A method and apparatus for reducing discharges into the atmosphere of mercury pollutants associated with dry process, precalciner cement manufacturing is shown. Raw feed meal used in cement production is heated in a special heating chamber to drive off volatile mercury pollutants, such as elemental mercury and mercury oxides. Preferably, the feed meal is heated to a temperature of at least 175° C. The gases that are driven off flow are then cooled to condense the mercury pollutants causing them to be adsorbed on carbon particles injected into the gas flow. The carbon particles containing the condensed mercury pollutants are then filtered out of gas flow, for example, using a fabric filter. The gas flow may be burned to destroy other volatile pollutants such as hydrocarbons and/or ammonia. | 01-07-2010 |