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Hatsuo Ishida

Hatsuo Ishida, Tsukuba-Shi JP

Patent application numberDescriptionPublished
20090299062THERMOSETTING COMPOUND, COMPOSITION CONTAINING THE SAME, AND MOLDED ARTICLE - The object of the present invention is to provide a thermosetting compound having dielectric properties, in particular permittivity and dielectric loss, which are improved compared to prior art, a composition containing the same, and a molded article. The thermosetting compound according to the present invention is a dihydro benzoxazine compound represented by the following Formula (2),12-03-2009

Hatsuo Ishida, Shaker Heights, OH US

Patent application numberDescriptionPublished
20090062502Resin having both aromatic ketone structure and benzoxazine structure - The present invention provides a resin having both an aromatic ketone structure and a benzoxazine structure, having a repeat unit represented by following general formula (1)03-05-2009
20090069533Benzoxazine monomers, polymers and compositions - Benzoxazine monomers comprising at least one pendant group are described. (Co)Polymers comprising at least one benzoxazine monomer having at least one pendant group are also described. In a preferred embodiment, the pendant group is located in a side chain of the benzoxazine monomer or polymer. Methods for preparing the benzoxazine monomers and polymers are described. Compositions comprising the benzoxazine monomers and polymers have numerous uses including optical materials, and in electronic materials as electrically insulating materials, and as fireproof materials.03-12-2009
20090076229Imide-naphthoxazine copolymer - An imide-naphthoxazine copolymer comprising a repeating unit represented by General Formula (1) below:03-19-2009
20090240006NOVEL NAPHTHOXAZINE COMPOSITION - The present invention is intended to provide a novel naphthoxazine composition having a smaller amount of volatile components (weight reduction) upon curing, and is to provide a naphthoxazine composition characterized in that a naphthoxazine compound having a phenolic hydroxyl group in the same molecule is further added with an epoxy resin, and a molded product obtained by molding the naphthoxazine composition.09-24-2009
20090247709DIAMINE POLYMER AND RESIN COMPOSITION THEREOF - A diamine polymer comprising a repeat unit represented by the following formula (I) in which diamine is linked to form a triaza ring;10-01-2009
20090247723TELECHELIC POLYMER COMPOSITION - A telechelic polymer composition comprising a telechelic polymer having phenolic hydroxyl groups at both ends and having a weight average molecular weight in the range of 1,000 to 10,000, and a compound having a benzoxazine ring structure or a compound having a naphthoxazine ring structure.10-01-2009

Patent applications by Hatsuo Ishida, Shaker Heights, OH US

Hatsuo Ishida, Ibaraki JP

Patent application numberDescriptionPublished
20090054614METHOD FOR PRODUCING THERMOSETTING RESIN, THERMOSETTING RESIN, THERMOSETTING COMPOSITION CONTAINING SAME, MOLDED BODY, CURED BODY, AND ELECTRONIC DEVICE CONTAINING THOSE - The present invention provides a method for producing a thermosetting resin having a dihydrobenzoxazine ring structure, characterized by heating and reacting a) a multi-functional phenolic compound represented by the following general formula (I), b) a diamine compound represented by the following general formula (II) and c) an aldehyde compound:02-26-2009
20090187003THERMOSETTING RESIN, THERMOSETTING COMPOSITION CONTAINING SAME, AND MOLDED PRODUCT OBTAINED FROM SAME - An object of the invention is to provide a thermosetting resin excellent in dielectric characteristics and heat resistance, and to provide a thermosetting composition comprising the thermosetting resin, as well as a molded product, substrate material for electronic devices and so forth obtained from the thermosetting resin. The present invention provides a thermosetting resin having a dihydrobenzoxazine ring structure represented by formula (I) in a main chain thereof, a thermosetting composition comprising the thermosetting resin, as well as a molded product, substrate material for electronic devices and so forth obtained from the thermosetting resin.07-23-2009

Hatsuo Ishida, Cleveland, OH US

Patent application numberDescriptionPublished
20110288260MAIN-CHAIN BENZOXAZINE OLIGOMER COMPOSITIONS, AND METHOD FOR THE PREPARATION THEREOF - Disclosed are benzoxazine compositions where oxazine rings are part of the polymer main-chain. The benzoxazine oligomers are prepared by the reaction of a bisphenol and an aldehyde, such as formaldehyde or paraformaldehyde, with one or more diamines or polyamines, and optionally with one or more monofunctional amines or monofunctional phenols. Also disclosed are benzoxazine monomers prepared from a bisphenol, an aldehyde, such as formaldehyde or paraformaldehyde, and a monofunctional amine, which benzoxazine monomers may be optionally used as reactive diluents. Further disclosed are benzoxazine monomers are prepared from a diamine, and aldehyde, such as formaldehyde or paraformaldehyde, and a monofunctional phenol, which benzoxazine monomers may also be optionally used as reactive diluents.11-24-2011