| Patent application number | Description | Published |
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| 20090017565 | MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A probe is contacted to a test pad, without destroying the circuit formed in the chip at the time of a probe test. Therefore, a load jig, a pressing tool, an elastomer, an adhesion ring, and a plunger are made into one by fixation with a nut and a bolt. The elastic force of the spring installed between the spring retaining jig and the load jig acts so that the member used as these one may be depressed toward pad PD. The thrust transmitted from the spring in a plunger to a thin films sheet is used only for the extension of a thin films sheet. | 01-15-2009 |
| 20090130785 | MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - As the thickness of the card holder for preventing warping of a multilayered wiring substrate | 05-21-2009 |
| 20100277192 | MANUFACTORING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A probe is contacted to a test pad, without destroying the circuit formed in the chip at the time of a probe test. Therefore, a load jig, a pressing tool, an elastomer, an adhesion ring, and a plunger are made into one by fixation with a nut and a bolt. The elastic force of the spring installed between the spring retaining jig and the load jig acts so that the member used as these one may be depressed toward pad PD. The thrust transmitted from the spring in a plunger to a thin films sheet is used only for the extension of a thin films sheet. | 11-04-2010 |
| 20100279502 | METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD OF MANUFACTURING A THIN FILM PROBE SHEET FOR USING THE SAME - A probe having a sufficient height is manufactured by selectively depositing, over the main surface of a wafer, a copper film in a region in which a metal film is to be formed and a region which will be outside an adhesion ring when a probe card is fabricated; forming the metal film, polyimide film, interconnect, another polyimide film, another interconnect and a further polyimide film; and then removing the wafer and copper film. According to the present invention, when probe testing is performed using a prober (thin film probe) having the probe formed in the above-described manner while utilizing the manufacturing technology of semiconductor integrated circuit devices, it is possible to prevent breakage of the prober and a wafer to be tested. | 11-04-2010 |
| Patent application number | Description | Published |
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| 20090048054 | CONTINUOUSLY VARIABLE TRANSMISSION - In a continuously variable transmission (“CVT”) using a toroidal-race continuously variable ratio device and a planetary gear mechanism, the rotation of the input shaft ( | 02-19-2009 |
| 20090115177 | Airbag and Airbag Apparatus - The area of panels used in an airbag that inflates so that a recess extends in the vertical direction between a left chamber and a right chamber. The airbag | 05-07-2009 |
| 20090256331 | Vehicle - By bending and stretching a link mechanism, both left and right wheels of a vehicle can be inclined toward inside of cornering to generate a camber thrust as a lateral force, i.e. an increase in cornering force. Further, by bending and stretching the link mechanism, the passenger compartment can be inclined in accordance with inclination of a connecting link, and thus the center of gravity of the vehicle can be moved toward its inner wheel during cornering. By preventing lifting of the inner wheel during cornering, cornering performance is improved. Because the passenger compartment is inclined toward the inner wheel during cornering, centrifugal force is less likely to be felt by the occupant. | 10-15-2009 |
| 20100168993 | VEHICLE - The disclosed vehicle includes:
| 07-01-2010 |
| 20100217491 | CAMBER ANGLE CONTROLLING DEVICE - A camber angle applying device is controlled to adjust the camber angle of wheels to a predetermined value. Therefore, the characteristics (or a high gripping property) of a high gripping force and the characteristic (or a low rolling resistance) of a small rolling resistance can be separately used as the performance of the wheels. By utilizing the high gripping property of the wheels, therefore, a vehicle is enabled to reduce its energy consumption, while retaining its running characteristics (such as a turning performance, an accelerating performance or a braking performance), by utilizing the rolling resistance of the wheels. Moreover, the camber angle applying device is controlled to reduce the rolling resistance of the wheels, so that the energy loss to occur in the wheels during running can be reduced to further reduce the energy consumption of the vehicle. | 08-26-2010 |
| 20110298200 | CHECK VALVE FOR AIRBAG AND AIRBAG DEVICE - Provided are a check valve for an airbag and an airbag device that can improve the reproducibility of the flow path blocking function while reducing the resistance upon inflation and deployment of the airbag and that can be applied to a place where a flow path is divided into a plurality of flow paths. A first embodiment of an airbag device according to the present invention has an airbag that is normally folded and that is inflated and deployed in an emergency, and an inflator that supplies gas to the airbag. The airbag has a plurality of inflation chambers, a duct portion disposed so as to connect the plurality of inflation chambers, and a check valve for an airbag having a tubular portion sewn to the duct portion, and tongue-shaped portions formed at the tip of the tubular portion. | 12-08-2011 |
| Patent application number | Description | Published |
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| 20100303334 | PATTERN INSPECTION APPARATUS AND METHOD - A fine pattern, such as a semiconductor integrated circuit (LSI), a liquid crystal panel, and a photomask (reticle) for the semiconductor or the liquid crystal panel, which are fabricated based on data for fabricating the fine pattern such as design data is inspected by a pattern inspection apparatus. The pattern inspection apparatus for inspecting a pattern to-be-inspected uses an image of the pattern to-be-inspected and data for fabricating the pattern to-be-inspected. The pattern inspection apparatus includes a reference pattern generation device configured to generate a reference pattern represented by one or more lines from the data, an image generation device configured to generate the image of the pattern to-be-inspected, a detecting device configured to detect an edge of the image of the pattern to-be-inspected, and an inspection device configured to inspect the pattern to-be-inspected by comparing edges of the image of the pattern to-be-inspected with the one or more lines of the reference pattern. | 12-02-2010 |
| 20110235895 | PATTERN INSPECTION APPARATUS AND METHOD - A pattern inspection apparatus is used for inspecting a fine pattern, such as a semiconductor integrated circuit (LSI), a liquid crystal panel, and a photomask (reticle) for the semiconductor or the liquid crystal panel, which are fabricated based on data for fabricating the fine pattern such as design data. The pattern inspection apparatus includes a reference pattern generation device configured to generate a reference pattern represented by one or more lines, comprising one of a line segment and a curve, from the data, an image generation device configured to generate the image of the pattern to-be-inspected, a detecting device configured to detect an edge of the image of the pattern to-be-inspected, and an inspection device configured to inspect the pattern to-be-inspected by comparing the edge of the image of the pattern to-be-inspected with the one or more lines of the reference pattern. | 09-29-2011 |
