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Harutaka
Harutaka Adachi, Ome-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20080287738 | MOTOR-DRIVEN BENDING ENDOSCOPE - A motor-driven bending endoscope includes a removal restriction mechanism which restricts removal of a trackball from a trackball mounting portion, and an operation section engaging portion which detachably engages an attachment/detachment portion with an operation section attachment portion at a time of coupling between the operation section attachment portion and the attachment/detachment portion when an operation section unit is attached to the operation section attachment portion. The operation section engaging portion and the removal restriction mechanism are interlockingly driven by an interlock drive mechanism. Thereby, there is provided a motor-driven bending endoscope which can reduce fatigue of the right hand at a time of performing a twisting operation of an insertion section, improve the recognizability of the up-and-down direction at a time of inserting the insertion section, and enhance the operational work efficiency. | 11-20-2008 |
| 20090131750 | ACTION DISPLAY SYSTEM AND ENDOSCOPE SYSTEM - An action display system includes an action instruction signal generating portion configured to generate an action instruction signal for instructing an action of an acting portion in response to an input to an input portion, an action control portion configured to control a drive portion such that the acting portion acts in accordance with the action instruction signal, the action control portion switchable between a regular mode to enable an action of the acting portion with the first and second degrees of freedom and an action disabled mode to disable an action of the acting portion with one degree of freedom, an image obtaining portion configured to obtain an image associated with an action state of the acting portion, and a display portion configured to display an index associated with the regular mode and the action disabled mode of the action control portion together with the image. | 05-21-2009 |
| 20090131753 | PULLING APPARATUS AND ENDOSCOPE SYSTEM - A pulling apparatus includes an input portion configured to be operated, a braking portion configured to apply a braking force to the input portion to generate a resistance force against to an operation to the input portion, a pulling portion configured to pull a pulling member, a pulling order generation portion configured to generate a control order signal to the pulling portion such that the pulling member is pulled by the pulling portion in accordance with an operation to the input portion, a pulling amount detecting portion configured to detect pulling amount of the pulling member, a pulling amount increase and decrease determination portion configured to determine an increase and decrease in the pulling amount detected by the pulling amount detecting portion, and a braking control portion configured to control the braking portion in accordance with a determination result obtained by the pulling amount increase and decrease determination portion. | 05-21-2009 |
| 20090247829 | ELECTRIC BENDING ENDOSCOPE - An electric bending endoscope includes an elongate insertion portion provided with a bending portion, a drive unit, and an operation unit, wherein the drive unit and the operation unit respectively include a drive unit side electric contact portion and an operation unit side electric contact portion configured to be coupled to and separated from each other by moving the drive unit and the operation unit close to and apart from each other in a coupling and separating axial direction, and the drive unit and the operation unit includes a lock mechanism configured to lock and unlock the drive unit and the operation unit to and from each other with respect to the coupling and separating axial direction. | 10-01-2009 |
Harutaka Goto, Kamakura-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090138634 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE WHICH EXECUTES DATA TRANSFER BETWEEN A PLURALITY OF DEVICES CONNECTED OVER NETWORK, AND DATA TRANSFER METHOD - A semiconductor integrated circuit device includes a first semiconductor device and a second semiconductor device, first and second buffer circuits, a data bus, and a control circuit. The semiconductor integrated circuit device executes data transmission/reception between the first and second semiconductor devices. The first and second buffer circuits store data. The data bus transmits the data between the first and second buffer circuits. The first semiconductor device reads out the transfer data into the first buffer circuit. The control circuit transfers the transfer data, which is stored in the first buffer circuit, to the second buffer circuit via the data bus. The control circuit acquires a right of use of the data bus after the first semiconductor device writes the transfer data into the first buffer circuit, and disclaims the right of use of the data bus after the transfer data is transferred to the second buffer circuit. | 05-28-2009 |
Harutaka Inoue, Hiratsuka-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20100181003 | PNEUMATIC TIRE MANUFACTURING METHOD AND PNEUMATIC TIRE - Provided are a pneumatic tire manufacturing method and a pneumatic tire capable of improving separation failure of a tire component member made of either a thermoplastic resin or a thermoplastic elastomer composition. The method and the pneumatic tire have the following configuration. A green tire is formed by radially expanding a carcass band | 07-22-2010 |
Harutaka Mekaru, Ibaraki JP
| Patent application number | Description | Published |
|---|---|---|
| 20090174118 | Method and device for nano-imprinting - A nanoimprint system according to one embodiment of the present invention is a system for performing a pattern transfer onto an object to be molded by pressing a mold against the object to be molded using a head, characterized in that the head has a flat pressing surface during pressing the mold and is slid onto the mold while pressing the mold. | 07-09-2009 |
| 20110076451 | IMPRINTING METHOD AND DEVICE UTILIZING ULTRASONIC VIBRATIONS - Disclosed is nanoimprint technology that enables the transfer of fine patterns to the surfaces of various molding materials, including general-purpose engineering plastic, in a short manufacturing process time. Embodiments of the present invention include a nanoimprint method for transferring fine patterns of a mold surface to a molding material by pressing the mold against the molding material while applying ultrasonic vibrations that propagate in the direction of application of a load, where the application of the ultrasonic vibrations and the load is started without heating said molding material to glass-transition temperature and, during at least the application of ultrasonic vibrations, said mold is fixed to the application mechanism of said ultrasonic vibrations. | 03-31-2011 |
Harutaka Taniguchi, Matsumoto-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090246910 | Semiconductor device manufacturing method - A semiconductor device manufacturing method includes the steps of preparing a semiconductor element having a first electrode, a second electrode, and a third electrode facing the first electrode and second electrode, the first electrode and second electrode being electrically separated by an insulating layer; arranging a first conductive bonding material on a first metal foil and placing the semiconductor element on the first conductive bonding material; supporting a sheet-shape second conductive bonding material by the insulating layer; arranging a first post electrode and a second post electrode above the first and second electrodes respectively with the second conductive bonding material intervening therebetween; and forming a first conductive bonding layer for bonding the first electrode and the first post electrode, a second conductive bonding layer for bonding the second electrode and the second post electrode, and a third conductive bonding layer for bonding the third electrode and the first metal foil. | 10-01-2009 |
Harutaka Yagame, Iwate JP
| Patent application number | Description | Published |
|---|---|---|
| 20100196962 | IL-6 RECEPTOR IL-6 DIRECT FUSION PROTEIN - The present invention intends to provide an IL-6R.IL-6 fusion protein and the like in which IL-6R and IL-6 are directly linked without a linker. | 08-05-2010 |