| Patent application number | Description | Published |
|---|
| 20080305433 | POSITIVE RESIST COMPOSITION AND METHOD OF PATTERN FORMATION WITH THE SAME - A positive resist composition comprising: (A) a resin which comes to have an enhanced solubility in an alkaline developing solution by an action of an acid; (B) a compound which generates an acid upon irradiation with actinic rays or a radiation; (C) a fluorine-containing compound containing at least one group selected from the groups (x) to (z); and (F) a solvent, and a method of pattern formation with the composition: (x) an alkali-soluble group; (y) a group which decomposes by an action of an alkaline developing solution to enhance a solubility in an alkaline developing solution; and (z) a group which decomposes by an action of an acid. | 12-11-2008 |
| 20090048421 | FILM FORMING COMPOSITION, FILM, AND ELECTRONIC DEVICE - A film forming composition is provided that includes a compound represented by Formula (1) below and/or a polymer polymerized using at least a compound represented by Formula (1) below | 02-19-2009 |
| 20090076204 | INSULATING FILM FORMING COMPOSITION AND ELECTRONIC DEVICE - An insulating film forming composition includes: (A) at least one organic polymer; (B) a solvent; and (C) at least one organic silicone compound represented by any of the following formulas (C-1) to (C-3) as defined in the specification: | 03-19-2009 |
| 20090118458 | INSULATING FILM-FORMING COMPOSITION - It is an object of the present invention to provide a composition capable of forming an insulating film which is endowed with a low dielectric constant, heat resistance, chemical resistance and a high mechanical strength that enables the insulating film to withstand CMP, and which, when an inorganic insulating film layer is provided thereon as an overlying layer, has a high adherence thereto. The composition for forming an insulating film contains polyphenylene, wherein the polyphenylene in an insulating film formed from the composition has a number of carbon atoms (C) and a number of oxygen atoms (O) which together satisfy a condition O/(C+O)≧0.050. With the composition, the above object is attained. | 05-07-2009 |
| 20090123880 | PATTERN FORMING METHOD - A pattern forming method which uses a positive resist composition comprises: (A) a silicon-free resin capable of increasing its solubility in an alkaline developer under action of an acid; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (C) a silicon-containing resin having at least one group selected from the group of consisting (X) an alkali-soluble group, (XI) a group capable of decomposing under action of an alkaline developer and increasing solubility of the resin (C) in an alkaline developer, and (XII) a group capable of decomposing under action of an acid and increasing solubility of the resin (C) in an alkaline developer, and (D) a solvent, the method comprising: (i) a step of applying the positive resist composition to a substrate to form a resist coating, (ii) a step of exposing the resist coating to light via an immersion liquid, (iii) a step of removing the immersion liquid remaining on the resist coating, (iv) a step of heating the resist coating, and (v) a step of developing the resist coating. | 05-14-2009 |
| 20090221779 | FILM FORMING COMPOSITION, INSULATING FILM, AND ELECTRONIC DEVICE - A film forming composition is provided that includes a compound represented by Formula (1) below and/or a polymer polymerized using at least a compound represented by Formula (1) below | 09-03-2009 |
| 20100310991 | POSITIVE RESIST COMPOSITION FOR IMMERSION EXPOSURE AND PATTERN-FORMING METHOD USING THE SAME - A positive resist composition for immersion exposure comprises: (A) a resin capable of increasing its solubility in an alkali developer by an action of an acid, and (B) a compound capable of generating an acid upon irradiation with actinic ray or radiation, wherein the acid satisfies conditions of V≧230 and V/S≦0.93 taking van der Waals volume of the acid as V (Å | 12-09-2010 |
| 20110076622 | POSITIVE RESIST COMPOSITION FOR IMMERSION EXPOSURE AND PATTERN-FORMING METHOD USING THE SAME - A positive resist composition for immersion exposure comprises: (A) a resin containing at least one repeating unit having a fluorine atom and increasing a solubility of the resin in an alkali developer by an action of an acid; and (B) a compound capable of generating an acid upon irradiation with one of an actinic ray and radiation. | 03-31-2011 |
