Hartner
Brian Hartner, New York, NY US
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20120174428 | PRE-PRINTED NEWSPRINT SHEETS FOR DRYING SHOES - A method for drying shoes comprising the steps of: providing a pair of wet shoes with insole; utilizing a plurality of newsprint sheets; crumpling up the newsprint sheets; stuffing the crumpled newsprint sheets into the wet shoes; setting the wet shoes aside for a specific amount of time, so that the crumpled newsprint sheets will absorb the moisture from within the wet shoes; removing the wet crumpled newsprint sheets out of the dry shoes; and disposing the wet crumpled newsprint sheets in a proper manner. | 07-12-2012 |
Damian Hartner, New York, NY US
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20120174428 | PRE-PRINTED NEWSPRINT SHEETS FOR DRYING SHOES - A method for drying shoes comprising the steps of: providing a pair of wet shoes with insole; utilizing a plurality of newsprint sheets; crumpling up the newsprint sheets; stuffing the crumpled newsprint sheets into the wet shoes; setting the wet shoes aside for a specific amount of time, so that the crumpled newsprint sheets will absorb the moisture from within the wet shoes; removing the wet crumpled newsprint sheets out of the dry shoes; and disposing the wet crumpled newsprint sheets in a proper manner. | 07-12-2012 |
Franz Hartner, Graz AT
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20100196913 | Mutant AOX1 Promoters | 08-05-2010 |
Franz Hartner, Kundl AT
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20160031970 | FERMENTATION PROCESS FOR ANTIBODY PRODUCTION - A feedback control mechanism for a fermentation of yeast cells to make recombinant proteins uses a respiratory quotient measurement which adjusts the levels of oxygenation and/or fermentable sugar feed. The feedback control mechanism permits well controlled cultures that produce good amounts of product while avoiding toxic accumulation of ethanol. Additionally, recombinant proteins so produced have excellent qualitative properties, such as excellent homogeneity and proper inter-subunit assembly. | 02-04-2016 |
20160039911 | TEMPERATURE SHIFT FOR HIGH YIELD EXPRESSION OF POLYPEPTIDES IN YEAST AND OTHER TRANSFORMED CELLS - Methods for producing heterologous proteins are disclosed. In particular, the present disclosure provides improved methods of producing desired proteins, including multi-subunit proteins such as antibodies, with a higher yield and improved purity. In exemplary embodiments, the transformed cells are a yeast, e.g., methylotrophic yeast such as | 02-11-2016 |
Frederick Hartner, Branchburg, NJ US
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20090203922 | Process for Synthesizing 2-Phenyl-1H-Phenanthro[9,10-d]Imidazole Derivative - The present invention describes an efficient and economical process for the preparation of a 2,3-disubstituted 2-phenyl-1h-phenantrho[9,10-d]imidazole derivative that is useful for the large scale production of material for preclinical and clinical use. The process of the present invention represents a convergent approach to generate the 2,3-disubstituted 2-phenyl-1h-phenantrho[9,10-d]imidazole derivative in high overall yield. The compound made by the process of the invention is an inhibitor of the microsomal prostaglandin E synthase-1 (mPGES-1) enzyme and is therefore useful to treat pain and/or inflammation from a variety of diseases or conditions, such as osteoarthritis, rheumatoid arthritis and acute or chronic pain. | 08-13-2009 |
Frederick W. Hartner, Somerville, NJ US
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20090054662 | Process for synthesizing a substituted pyrazole - The present invention relates to substituted pyrazoles, compositions containing such compounds and methods of treatment. The compounds are glucagon receptor antagonists and thus are useful for treating, preventing or delaying the onset of type 2 diabetes mellitus. | 02-26-2009 |
20090105479 | 4-Oxo-1-3-Substituted Phenyl-1,4-Dihydro-1,8-Napthyridene-3-Carboxamide Phosphodiesterase-4 Inhibitor and a Method of Preparing Same - The invention is directed to a compound of the structural formula (22) (22) crystal form of structural formulae (21) and its free acid, pharmaceutical compositions comprising these compounds and methods of preparing and using these compounds. | 04-23-2009 |
Gerhard Hartner, Bad Wimsbach AT
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20090239772 | Method of producing a friction lining - The invention relates to a method of producing a friction lining whereby a friction paper is displaced with a latex based on an elastomer and fibers of the friction paper are then bonded one another due to precipitation of the elastomer out of the latex. A non-surface active protective colloid is added to the latex as a suspension agent before applying it to the friction paper. | 09-24-2009 |
20100059326 | Friction lamella - The invention relates to a friction lamella ( | 03-11-2010 |
20120160629 | METHOD FOR PRODUCING A FRICTION ELEMENT - The invention relates to a method for producing a friction element ( | 06-28-2012 |
20140190783 | METHOD FOR PRODUCING A FRICTION ELEMENT - The invention relates to a method for producing a friction element ( | 07-10-2014 |
Helmut Hartner, Dirmstein DE
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20160046036 | COMPOSITION OF A TIMBER FORMULATION COMPRISING Cu SALTS AND ORGANIC CYCLIC INGREDIENTS FOR THE PRESERVATION OF TIMBER FOR DECKS - This invention relates to a composition, a process for producing a composition, a timber formulation, a process for producing a timber formulation, a construction comprising the timber formulation and a use of the construction comprising the timber formulation are herein disclosed. The composition can include a Cu-salt, a first cyclic organic compound comprising a B heteroatom and at least one further B-free cyclic organic compound. The composition and timber formulation herein disclosed are designed as wood preservatives and may be used as part of a timber preserving treatment. | 02-18-2016 |
Johannes Hartner, Laakirchen AT
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20090257905 | Compacting Tool - The invention relates to a tool ( | 10-15-2009 |
Rene Hartner, San Jose, CA US
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20140272576 | METHODS AND APPARATUS FOR HIGH CAPACITY ANODES FOR LITHIUM BATTERIES - An electrode is provided for an electrochemical lithium battery cell. The electrode includes a bulk material that has a plurality of voids dispersed substantially throughout the bulk material. The bulk material is silicon. Numerous other aspects are provided. | 09-18-2014 |
Renee Hartner, San Jose, CA US
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20140272577 | METHODS AND APPARATUS FOR HIGH CAPACITY ANODES FOR LITHIUM BATTERIES - An electrode is provided for an electrochemical lithium battery cell. The electrode includes multiple silicon sheets, each silicon sheet including multiple apertures, each aperture extending all or partly through a thickness of the silicon sheet. Numerous other aspects are provided. | 09-18-2014 |
Walter Hartner, Bad Abach DE
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20150177373 | WIRELESS COMMUNICATION SYSTEM, A RADAR SYSTEM AND A METHOD FOR DETERMINING A POSITION INFORMATION OF AN OBJECT - A wireless communication system includes a first semiconductor module and a second semiconductor module. The first semiconductor module includes a semiconductor die connected to an antenna structure. The semiconductor die of the first semiconductor module and the antenna structure of the first semiconductor module are arranged within a common package. The semiconductor die of the first semiconductor module includes a transmitter module configured to transmit the wireless communication signal through the antenna structure of the first semiconductor module. The second semiconductor module includes a semiconductor die connected to an antenna structure. The semiconductor die of the second semiconductor module includes a receiver module configured to receive the wireless communication signal through the antenna structure of the second semiconductor module from the first semiconductor module. | 06-25-2015 |
Walter Hartner, Bad Abbach DE
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20140035127 | CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE - A method for manufacturing a chip package is provided. The method includes: forming an electrically insulating material over a chip side; selectively removing at least part of the electrically insulating material thereby forming a trench in the electrically insulating material, depositing electrically conductive material in the trench wherein the electrically conductive material is electrically connected to at least one contact pad formed over the chip side; forming an electrically conductive structure over the electrically insulating material, wherein at least part of the electrically conductive structure is in direct physical and electrical connection with the electrically conductive material; and depositing a joining structure over the electrically conductive structure. | 02-06-2014 |
20140035154 | CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE - A chip package is provided, the chip package including: a chip including at least one contact pad formed on a chip front side; an encapsulation material at least partially surrounding the chip and covering the at least one contact pad; and at least one electrical interconnect formed through the encapsulation material, wherein the at least one electrical interconnect is configured to electrically redirect the at least one contact pad from a chip package first side at the chip front side to at least one solder structure formed over a chip package second side at a chip back side. | 02-06-2014 |
20140110840 | Semiconductor Packages with Integrated Antenna and Method of Forming Thereof - In one embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A chip is disposed in the substrate. The chip includes a plurality of contact pads at the first major surface. A first antenna structure is disposed at the first major surface. A reflector is disposed at the second major surface. | 04-24-2014 |
20140110858 | EMBEDDED CHIP PACKAGES AND METHODS FOR MANUFACTURING AN EMBEDDED CHIP PACKAGE - A method for manufacturing an embedded chip package is provided. The method may include: forming electrically conductive lines over a substrate; placing the substrate next to a chip arrangement comprising a chip, the chip comprising one or more contact pads, wherein one or more of the electrically conductive lines are arranged proximate to a side wall of the chip; and forming one or more electrical interconnects over the chip arrangement to electrically connect at least one electrically conductive line to at least one contact pad. | 04-24-2014 |
20140320231 | Integrated-Circuit Module with Waveguide Transition Element - An integrated-circuit module includes a package molding compound layer, a radio-frequency (RF) integrated circuit embedded within the package molding compound layer and having an RF port, a waveguide transition structure embedded within the package molding compound layer, and a redistribution layer. The waveguide transition structure includes a transmission line interface section, a waveguide interface section configured for coupling to a rectangular waveguide housing, and a transformer section configured to provide a mode transition between the transmission line interface section and the waveguide interface section. The redistribution layer includes at least one insulating layer and at least one metallization layer, extending between the RF integrated circuit and the waveguide transition structure across a surface of the package molding compound layer. The first redistribution layer includes an RF transmission line conductively connected between the RF port of the RF integrated circuit and the transmission line interface section of the waveguide transition structure. | 10-30-2014 |
20160043455 | Microwave Chip Package Device - A microwave device includes a semiconductor package comprising a microwave semiconductor chip and a waveguide part associated with the semiconductor package. The waveguide part is configured to transfer a microwave waveguide signal. It includes one or more pieces. The microwave device further includes a transformer element configured to transform a microwave signal from the microwave semiconductor chip into the microwave waveguide signal or to transform the microwave waveguide signal into a microwave signal for the microwave semiconductor chip. | 02-11-2016 |
Walter Hartner, Bad Abbach-Peising DE
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20110233721 | SEMICONDUCTOR COMPONENT AND METHODS FOR PRODUCING A SEMICONDUCTOR COMPONENT - A semiconductor component includes a semiconductor body, in which are formed: a substrate of a first conduction type, a buried semiconductor layer of a second conduction type arranged on the substrate, and a functional unit semiconductor layer of a third conduction type arranged on the buried semiconductor layer, in which at least two semiconductor functional units arranged laterally alongside one another are provided. The buried semiconductor layer is part of at least one semiconductor functional unit, the semiconductor functional units being electrically insulated from one another by an isolation structure which permeates the functional unit semiconductor layer, the buried semiconductor layer, and the substrate. The isolation structure includes at least one trench and an electrically conductive contact to the substrate, the contact to the substrate being electrically insulated from the functional unit semiconductor layer and the buried layer by the at least one trench. | 09-29-2011 |
20110256688 | SEMICONDUCTOR COMPONENT AND METHODS FOR PRODUCING A SEMICONDUCTOR COMPONENT - A semiconductor component includes a semiconductor body, in which are formed: a substrate of a first conduction type, a buried semiconductor layer of a second conduction type arranged on the substrate, and a functional unit semiconductor layer of a third conduction type arranged on the buried semiconductor layer, in which at least two semiconductor functional units arranged laterally alongside one another are provided. The buried semiconductor layer is part of at least one semiconductor functional unit, the semiconductor functional units being electrically insulated from one another by an isolation structure which permeates the functional unit semiconductor layer, the buried semiconductor layer, and the substrate. The isolation structure includes at least one trench and an electrically conductive contact to the substrate, the contact to the substrate being electrically insulated from the functional unit semiconductor layer and the buried layer by the at least one trench. | 10-20-2011 |
20140141608 | SEMICONDUCTOR COMPONENT AND METHODS FOR PRODUCING A SEMICONDUCTOR COMPONENT - A method for producing a semiconductor component with a semiconductor body includes providing a substrate of a first conductivity type. A buried semiconductor layer of a second conductivity type is provided on the substrate. A functional unit semiconductor layer is provided on the buried semiconductor layer. At least one trench, which reaches into the substrate, is formed in the semiconductor body. An insulating layer is formed, which covers inner walls of the trench and electrically insulates the trench interior from the functional unit semiconductor layer and the buried semiconductor layer, the insulating layer having at least one opening in the region of the trench bottom. The at least one trench is filled with an electrically conductive semiconductor material of the first conductivity type, wherein the electrically conductive semiconductor material forms an electrical contact from a surface of the semiconductor body to the substrate. | 05-22-2014 |