| Patent application number | Description | Published |
|---|
| 20090159200 | SPACER ELEMENT AND METHOD FOR MANUFACTURING A SPACER ELEMENT - A spacer wafer ( | 06-25-2009 |
| 20110013292 | WAFER STACK, INTEGRATED OPTICAL DEVICE AND METHOD FOR FABRICATING THE SAME - In a method for fabricating an integrated optical device by creating a wafer stack by stacking at least a top wafer carrying as functional elements a plurality of lenses on at least one further wafer including further functional elements, and separating the wafer stack into a plurality of integrated optical devices, wherein corresponding functional elements of the top and further wafer are aligned with each other and define a plurality of main optical axes, a method for providing a sunshade plate as part of an integrated optical device ( | 01-20-2011 |
| 20110024030 | MANUFACTURING OPTICAL ELEMENTS - A method includes the steps of: providing a substrate; providing a tool having, on a replication side, a plurality of replication sections, each replication section defining a surface structure of one of an optical element(s), the tool further including at least one contact spacer portion, the contact spacer portion protruding, on the replication side, further than an outermost feature of the replication sections; aligning the tool with a feature of the substrate and bringing the tool and a first side of the substrate together, with replication material between the tool and the substrate, the contact spacer portion contacting the first side of the substrate, and thereby causing the spacer portion to adhere to the first side of the substrate, thereby producing a substrate-tool-assembly; dislocating the substrate-tool-assembly to a hardening station; causing the replication material to harden at the hardening station; and separating the tool from the substrate with the hardened replication material adhering to the substrate. | 02-03-2011 |
| 20110031510 | ENCAPSULATED LENS STACK - A wafer scale package includes two or more substrates (wafers) that are stacked in an axial direction and a plurality of replicated optical elements. An optical device includes one or more optical elements. The wafer scale package and the device include one or more cavities that house the optical elements, while the end faces of the package or the device are planar and do not have replicated optical elements thereon. The number of double sided substrates is reduced, and design and manufacture of the optical device is improved. | 02-10-2011 |
| 20110032409 | OPTICAL MODULE FOR A CAMERA DEVICE, BAFFLE SUBSTRATE, WAFER SCALE PACKAGE, AND MANUFACTURING METHODS THEREFOR - An optical module for a camera device, the camera device including an image capturing element arranged on a base substrate portion, and has a top lens element and optionally further lens elements for imaging an object on the image capturing element, and further a baffle defining a predetermined field of view of the image capturing element. The baffle includes a generally transparent baffle substrate portion having a front surface and a rear surface, a generally non-transparent first layer with a plurality of first openings on the front surface and a generally non-transparent second layer with a plurality of second openings on the rear surface. The top lens element is arranged on the front and/or the rear surface of the baffle substrate, which leads to a reduced number layers/substrates in the module and to a reduced number of reflections on material-air interfaces, for example. The baffle has an improved ability to suppress unwanted light and enables protection of the inner part of the device as well as manufacture on wafer scale. | 02-10-2011 |
| 20110039048 | SPACER ELEMENT AND METHOD FOR MANUFACTURING A SPACER ELEMENT - A spacer wafer for a wafer stack includes a spacer body with a first surface and a second surface, and is intended to be sandwiched between a first wafer and a second wafer. That is, the spacer is to keep a first wafer placed against the first surface and a second wafer placed against the second surface at a constant distance from each other. The spacer provides openings arranged such that functional elements of the first wafer and of the second wafer can be aligned with the openings. The spacer is formed from a forming tool by means of a shape replication process and is preferably made of a material hardened by curing. At least one of the first and second surface includes edges separating the surface from the openings, and the thickness of the spacer wafer at the edges exceeds the thickness of the spacer wafer at surface locations around the edges. | 02-17-2011 |
| 20110043923 | MANUFACTURING OPTICAL ELEMENTS - A method of replicating at least one optical element is provided, the method including the steps of: providing a substrate with two large sides and at least one pre-defined replication site defined by a through hole or blind holes at corresponding locations on both large sides of the substrate; and adding, by replication, a replicated structure to the substrate, the replicated structure adhering to the substrate and having, at the replication site, replication material in the through hole or in the two blind holes, respectively and a first replicated surface and a second replicated surface, the first and second replication surfaces facing towards opposite sides. | 02-24-2011 |
| 20110050979 | OPTICAL MODULE, WAFER SCALE PACKAGE, AND METHOD FOR MANUFACTURING THOSE - An optical module for an electro-optical device with a functional element, in particular for a camera device, and to an electro-optical device with such a module. The optical module includes a lens substrate portion with at least one lens element, and a spacer. The spacer serves to keep the lens substrate at a well defined axial distance from a base substrate portion of the fully assembled electro-optical device. In order to ensure improved performance of the functional element, an EMC shield is provided. The spacer is at least in parts electrically conductive and thus forms the EMC shield or a part thereof. A method of manufacturing a plurality of such modules on a wafer scale is also provided. | 03-03-2011 |
