Patent application number | Description | Published |
20100224975 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A DUAL BOARD-ON-CHIP STRUCTURE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a first board-on-chip-structure having a first integrated circuit die mounted over a substrate and the substrate having a substrate cavity; mounting a second board-on-chip-structure over the first board-on-chip-structure, the second board-on-chip-structure having a second integrated circuit die mounted under an interposer and the interposer having an interposer cavity; connecting the first board-on-chip-structure to the second board-on-chip-structure with an internal interconnect; and encapsulating the first board-on-chip-structure, the second board-on-chip-structure, and the internal interconnect with an encapsulation. | 09-09-2010 |
20100244223 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN INTEGRAL-INTERPOSER-STRUCTURE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate having a shielding channel through a substrate first side and a substrate second side; mounting a first shielding interconnect to the shielding channel; mounting an integrated circuit over the substrate and adjacent to the first shielding interconnect; attaching a silicon interposer, having an integral-conductive-shield and a via, to the first shielding interconnect with the integral-conductive-shield over the integrated circuit; grounding the shielding channel at the substrate second side; and forming an encapsulation over the substrate covering the integrated circuit and the first shielding interconnect. | 09-30-2010 |
20100258928 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED INTEGRATED CIRCUIT AND METHOD OF MANUFACTURE THEREOF - A method of manufacture an integrated circuit packaging system includes: providing a substrate; attaching a first integrated circuit to the substrate by interconnects only along opposite sides of the first integrated circuit; and attaching a heat spreader to the substrate, the heat spreader extending over the first integrated circuit and between the opposite sides of the first integrated circuit. | 10-14-2010 |
20100301469 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER INTERCONNECTIONS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit; mounting a routing structure having a functional side above the integrated circuit; mounting a vertical interconnect to the functional side of the routing structure and the vertical interconnect extending vertically away from the routing structure; and forming an encapsulation that encapsulates the integrated circuit, the routing structure, and sides of the vertical interconnect above the routing structure, and leaves a surface of the routing structure exposed from the encapsulation, and a portion of the vertical interconnect exposed from the encapsulation above the surface of the routing structure. | 12-02-2010 |
20110037157 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a component over a side of the substrate; forming an interface module having a module via in any location for connectivity to the substrate; and mounting the entirety of the interface module over a portion of the side of the substrate next to the component. | 02-17-2011 |
20110068453 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATED VIA AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate; attaching a buffer interconnect to and over the substrate; forming an encapsulation over the substrate covering the buffer interconnect and the integrated circuit; and forming a via in the encapsulation and to the buffer interconnect. | 03-24-2011 |
20110068464 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; attaching a component over the base substrate; attaching a component interconnect to the base substrate and a perimeter of the component; mounting a stack device over the component; attaching a base exposed interconnect directly on the component and next to the component interconnect; and forming a base encapsulation over the base substrate, the component, and the component interconnect, the base exposed interconnect partially exposed from the base encapsulation. | 03-24-2011 |
20110140259 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKING INTERCONNECT AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: fabricating a base package substrate; coupling a conductive column lead frame to the base package substrate by: providing a lead frame support, patterning a conductive material on the lead frame support including forming an interconnect securing structure, and coupling the conductive material to the base package substrate; forming a base package body between the base package substrate and the conductive column lead frame; and removing the lead frame support from the conductive column lead frame for exposing the interconnect securing structure from the base package body. | 06-16-2011 |
20110215448 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit package system includes: providing a base package substrate including: forming component contacts on a component side of the base package substrate, forming system contacts on a system side of the base package substrate, and forming a reference voltage circuit between the component contacts and the system contacts; mounting a first integrated circuit die on the component contacts; mounting a lead frame on the first integrated circuit die and coupled to the component contacts; and isolating a conductive shield from the lead frame, the conductive shield coupled to the reference voltage circuit. | 09-08-2011 |
20110215450 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a carrier having a cavity and a carrier top side adjacent to the cavity; mounting an integrated circuit in the cavity; forming an encapsulation surrounding the integrated circuit; and attaching a conductive channel to the carrier top side, the conductive channel over the encapsulation. | 09-08-2011 |
20110220395 | CARRIER SYSTEM WITH MULTI-TIER CONDUCTIVE POSTS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of a carrier system includes: providing a carrier base; forming a recess in the carrier base with the recess around a planar surface; forming a first barrier on the planar surface; forming a second barrier on the carrier base in the recess; forming a first post on the first barrier; and forming a second post on the second barrier. | 09-15-2011 |
20110223721 | METHOD OF MANUFACTURE OF INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MULTI-TIER CONDUCTIVE INTERCONNECTS - A method of manufacture of an integrated circuit packaging system includes: providing a carrier having a planar surface and a cavity therein, a first barrier between the planar surface and a first interconnect, and a second barrier between the cavity and a second interconnect; providing a substrate; mounting an integrated circuit over the substrate; mounting the carrier to the substrate with the first interconnect and the second interconnect attached to the substrate and with the planar surface over the integrated circuit; forming an encapsulation between the substrate and the carrier covering the integrated circuit, the encapsulation having an encapsulation recess under the planar surface and over the integrated circuit; and removing a portion of the carrier to expose the encapsulation, a portion of the first barrier to form a first contact pad, and a portion of the second barrier to form a second contact pad. | 09-15-2011 |
20110298119 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit package system includes: forming a non-inverted internal stacking module including: fabricating an internal stacking module (ISM) substrate having an ISM component side and an ISM coupling side, coupling an internal stacking module integrated circuit to the ISM component side, coupling stacking structures, adjacent to the internal stacking module integrated circuit, on the ISM component side, and molding a stacking module body having a top surface that is coplanar with and exposes the stacking structures; forming a base package substrate under the non-inverted internal stacking module; coupling middle structures between the base package substrate and the ISM coupling side; and forming a base package body on the base package substrate, the middle structures, and the non-inverted internal stacking module including exposing the top surface of the stacking module body to be coplanar with the base package body. | 12-08-2011 |
20110309492 | INTEGRATED CIRCUIT SYSTEM WITH RECESSED THROUGH SILICON VIA PADS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit system includes: providing a substrate with a face surface having a via therein and a back surface having a trench therein; filling the via with a conductive pillar; forming a recessed contact pad in the trench; filling the recessed contact pad partially with solder; and forming an under-bump metal having a base surface in electrical contact with the conductive pillar, and having sides that extend away from the face surface of the substrate and further extend beyond the base surface. | 12-22-2011 |
20120068332 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POST AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a stack substrate with a component side; connecting an integrated circuit component to the component side; attaching a conductive post to the component side and adjacent the integrated circuit component, the conductive post having a protruded end above the integrated circuit component; forming a protection layer on a top and sides of the protruded end, the protection layer having a width equal to a width of the conductive post; applying a stack encapsulation over the integrated circuit component, over the stack substrate, and around a portion of the conductive post, the protection layer exposed from the stack encapsulation; and mounting a base package under the stack substrate, base package connected to the stack substrate. | 03-22-2012 |
20120086115 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER INTERCONNECTIONS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit; mounting a routing structure having a functional side above the integrated circuit; mounting a vertical interconnect to the functional side of the routing structure and the vertical interconnect extending vertically away from the routing structure; forming an encapsulation covering the integrated circuit, the routing structure, and sides of the vertical interconnect above the routing structure, and leaves a surface of the routing structure exposed from the encapsulation, and a portion of the vertical interconnect exposed from the encapsulation above the surface of the routing structure; mounting a first-external-package-component to the routing structure; and forming a first-external-package-encapsulation covering the first-external-package-component. | 04-12-2012 |
20120119393 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLEXIBLE SUBSTRATE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a foldable segment, a base segment, and a stack segment; connecting a base substrate connector directly on the base segment; connecting a stack substrate connector directly on the stack segment; mounting a base integrated circuit over the base segment with the base substrate connector outside a perimeter of the base integrated circuit; and folding the package substrate with the stack segment over the base segment and the stack substrate connector directly on the base substrate connector. | 05-17-2012 |
20120241925 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURE THEREOF - A method of manufacturing of an integrated circuit packaging system includes: providing a base substrate; mounting a first die over the base substrate; mounting a second die over the first die; attaching an interposer substrate over the first die with an attachment adhesive therebetween, the interposer substrate having a central cavity and the second die within the central cavity; attaching a lateral interconnect to a second active side away from the first die of the second die and to the interposer substrate; and encapsulating the first die and the second die. | 09-27-2012 |
20120306102 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a base package carrier; mounting an interposer over the base package carrier; forming a base package encapsulation over the base package carrier and the interposer with the base package encapsulation having a cavity for exposing the interposer; and forming a support recess in the base package encapsulation between a non-horizontal edge of the base package encapsulation and the cavity. | 12-06-2012 |
20120319263 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTRA SUBSTRATE DIE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate having a through hole; mounting an integrated circuit in the through hole, the integrated circuit having an inactive side and a vertical side; connecting a first interconnect in direct contact with the integrated circuit and the substrate; applying a wire-in-film adhesive around and above the integrated circuit leaving a portion of the vertical side and the inactive side exposed and covering a portion of the first interconnect; and mounting a chip above the integrated circuit and in direct contact with the wire-in-film adhesive. | 12-20-2012 |
20120319295 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PADS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a circuit structure having a circuit active side and a cavity from the circuit active side; mounting an integrated circuit device in the cavity; forming a base encapsulation, having a base first side facing away from the circuit active side, on the circuit active side, around the integrated circuit device, and in the cavity; forming a first conductive pin, having a first pin height, in the base encapsulation and traversing from the circuit active side to the base first side; forming a second conductive pin, having a second pin height equivalent to the first pin height, in the base encapsulation and traversing from the integrated circuit device to the base first side; and removing a portion of the circuit structure to form a circuit non-active side and expose the integrated circuit device and a base second side. | 12-20-2012 |
20130056863 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STIFFENER AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a stiffener, having a stiffener opening completely through the stiffener, on the substrate; molding an encapsulation on the substrate and directly on an outer upper periphery surface of the stiffener and exposing an inner upper periphery surface of the stiffener, the encapsulation exposing a portion of the substrate; mounting an integrated circuit over the substrate and within the perimeter of the stiffener; and attaching a lid plate on the inner upper periphery surface of the stiffener and over the integrated circuit, the lid plate extending above an encapsulation top side. | 03-07-2013 |
20130056864 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED THERMAL HEAT SHIELD AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: mounting a bottom integrated circuit on a bottom substrate having a peripheral thermal via connected to a peripheral thermal interconnect; mounting an inner heat shield, having a top planar portion, over the bottom integrated circuit with the inner heat shield connected to the peripheral thermal via; mounting a top integrated circuit over the inner heat shield; and forming a package encapsulation over the bottom integrated circuit, the inner heat shield, and the top integrated circuit with the top planar portion exposed only at each corners of a package topside of the package encapsulation. | 03-07-2013 |
20130075927 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; attaching a base integrated circuit on the base substrate; forming a base encapsulation, having a base encapsulation top side, on the base substrate and around the base integrated circuit; forming a base conductive via, having a base via head, through the base encapsulation and attached to the base substrate adjacent to the base integrated circuit, the base via head exposed from and coplanar with the base encapsulation top side; mounting an interposer structure over the base encapsulation with the interposer structure connected to the base via head; and forming an upper encapsulation on the base encapsulation top side and partially surrounding the interposer structure with a side of the interposer structure facing away from the base encapsulation exposed. | 03-28-2013 |
20130334697 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH THROUGH SILICON VIA AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a bottom integrated circuit having bottom through silicon vias with a bottom via pitch; mounting outer interconnects over the bottom integrated circuit; and mounting a top integrated circuit between the outer interconnects, the top integrated circuit having top through silicon vias with a top via pitch less than the bottom via pitch. | 12-19-2013 |