| Patent application number | Description | Published |
|---|
| 20100224975 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A DUAL BOARD-ON-CHIP STRUCTURE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a first board-on-chip-structure having a first integrated circuit die mounted over a substrate and the substrate having a substrate cavity; mounting a second board-on-chip-structure over the first board-on-chip-structure, the second board-on-chip-structure having a second integrated circuit die mounted under an interposer and the interposer having an interposer cavity; connecting the first board-on-chip-structure to the second board-on-chip-structure with an internal interconnect; and encapsulating the first board-on-chip-structure, the second board-on-chip-structure, and the internal interconnect with an encapsulation. | 09-09-2010 |
| 20100244223 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN INTEGRAL-INTERPOSER-STRUCTURE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate having a shielding channel through a substrate first side and a substrate second side; mounting a first shielding interconnect to the shielding channel; mounting an integrated circuit over the substrate and adjacent to the first shielding interconnect; attaching a silicon interposer, having an integral-conductive-shield and a via, to the first shielding interconnect with the integral-conductive-shield over the integrated circuit; grounding the shielding channel at the substrate second side; and forming an encapsulation over the substrate covering the integrated circuit and the first shielding interconnect. | 09-30-2010 |
| 20100258928 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED INTEGRATED CIRCUIT AND METHOD OF MANUFACTURE THEREOF - A method of manufacture an integrated circuit packaging system includes: providing a substrate; attaching a first integrated circuit to the substrate by interconnects only along opposite sides of the first integrated circuit; and attaching a heat spreader to the substrate, the heat spreader extending over the first integrated circuit and between the opposite sides of the first integrated circuit. | 10-14-2010 |
| 20100301469 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER INTERCONNECTIONS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit; mounting a routing structure having a functional side above the integrated circuit; mounting a vertical interconnect to the functional side of the routing structure and the vertical interconnect extending vertically away from the routing structure; and forming an encapsulation that encapsulates the integrated circuit, the routing structure, and sides of the vertical interconnect above the routing structure, and leaves a surface of the routing structure exposed from the encapsulation, and a portion of the vertical interconnect exposed from the encapsulation above the surface of the routing structure. | 12-02-2010 |
| 20110037157 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a component over a side of the substrate; forming an interface module having a module via in any location for connectivity to the substrate; and mounting the entirety of the interface module over a portion of the side of the substrate next to the component. | 02-17-2011 |
| 20110068453 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATED VIA AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate; attaching a buffer interconnect to and over the substrate; forming an encapsulation over the substrate covering the buffer interconnect and the integrated circuit; and forming a via in the encapsulation and to the buffer interconnect. | 03-24-2011 |
| 20110068464 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; attaching a component over the base substrate; attaching a component interconnect to the base substrate and a perimeter of the component; mounting a stack device over the component; attaching a base exposed interconnect directly on the component and next to the component interconnect; and forming a base encapsulation over the base substrate, the component, and the component interconnect, the base exposed interconnect partially exposed from the base encapsulation. | 03-24-2011 |
| 20110140259 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKING INTERCONNECT AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: fabricating a base package substrate; coupling a conductive column lead frame to the base package substrate by: providing a lead frame support, patterning a conductive material on the lead frame support including forming an interconnect securing structure, and coupling the conductive material to the base package substrate; forming a base package body between the base package substrate and the conductive column lead frame; and removing the lead frame support from the conductive column lead frame for exposing the interconnect securing structure from the base package body. | 06-16-2011 |
