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Haneda, JP
Akira Haneda, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20090178553 | COMPRESSOR - The compressor of the present invention has a structure in which a groove is disposed on a sealing surface of at least one of the head and the valve plate. The structure enhances contact pressure on a pressed surface, providing the gasket with preferable sealing strength. Besides, the head of the compressor has no protrusion on the edge. This eliminates worry about breakage of the head, providing high reliability and productivity. | 07-16-2009 |
Hideo Haneda, Matsumoto-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090201067 | REFERENCE VOLTAGE GENERATING CIRCUIT, INTEGRATED CIRCUIT DEVICE, AND SIGNAL PROCESSING APPARATUS - A reference voltage generating circuit that generates a reference voltage includes: a first pn junction that generates a first voltage; a second pn junction that has a different current density from the first pn junction; a first resistor that generates a first current having a positive temperature coefficient based on a voltage equivalent to a difference between a forward voltage of the first pn junction and a forward voltage of the second pn junction; a second resistor that generates a first voltage having a positive temperature coefficient based on the first current, wherein the first voltage having the positive temperature coefficient and a voltage having a negative temperature coefficient are added to generate the reference voltage; and a third resistor that generates a temperature-dependent voltage based on the first current having the positive temperature coefficient, wherein the reference voltage and the temperature-dependent voltage are outputted in parallel from first and second output nodes, respectively, and a resistance value of the first resistor and a resistance value of the third resistor are adjusted in the same proportion by a trimming signal. | 08-13-2009 |
Hideo Haneda, Matsumoto JP
| Patent application number | Description | Published |
|---|---|---|
| 20100283645 | A/D CONVERSION CIRCUIT, ELECTRONIC APPARATUS, AND A/D CONVERSION METHOD - An A/D conversion circuit includes: a sample-and-hold circuit adapted to sample and hold an input signal to output a sampled signal; a control circuit adapted to output successive approximation data; a first D/A conversion circuit adapted to perform D/A conversion on the successive approximation data to output a first D/A output signal; a second D/A conversion circuit adapted to perform D/A conversion on time-varying code data to output a second D/A output signal; and a comparison circuit adapted to perform a process of comparing the first D/A output signal, and an addition signal of the sampled signal and the second D/A output signal, and to output a comparison result signal, wherein the control circuit has a successive approximation register to which register values are set in accordance with the comparison result signal, outputs successive approximation result data after all of the register values of the successive approximation register have been determined, and subtracts the code data from the successive approximation result data to output the result as A/D conversion data of the input signal. | 11-11-2010 |
Hideo Haneda, Aichi-Ken JP
| Patent application number | Description | Published |
|---|---|---|
| 20090062989 | Seat device for vehicle - A headrest | 03-05-2009 |
Hiroyuki Haneda, Chiryu-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20120020765 | COMPONENT MOUNTING APPARATUS - In a component mounting apparatus, when one of first and second board transfer devices is performing the unloading and loading of boards, a controller operates a component placing device to mount components on a first or second board loaded by the other board transfer device. Thus, it is possible to effectively utilize the time which is taken for the unloading and the loading of either boards, for component mountings on the other board, so that the efficiency in producing boards can be enhanced. Further, since the controller executes a control so that while component mountings are performed on the first boards of M-sheets on the first board transfer device, component mountings are performed on the second boards of N-sheets on the second board transfer device, it is realized to suppress the occurrence of an intermediate stock of either boards where the first boards of the M-sheets and the second boards of the N-sheets are required. | 01-26-2012 |
Hiroyuki Haneda, Nagoya-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110302776 | ELECTRONIC-CIRCUIT ASSEMBLING PROCESS AND ELECTRONIC-CIRCUIT ASSEMBLING SYSTEM - An electronic-circuit assembling process to be carried out in an electronic-circuit assembling system, for assembling an electronic circuit, by mounting electronic circuit components supplied from a component supplier, onto a circuit board, wherein the electronic circuit components includes at least one of different-property components having respective different electrical properties. The process includes: (a) a different-property-component-related information obtaining step of obtaining a different-property-component-related information including (a-i) a property-related information that enables recognition of the electrical property of the different-property component supplied from the component supplier and (a-ii) a different-property-component supply position that is a position of the component supplier supplying the different-property component, such that the different-property-component-related information is obtained by detecting the property-related information and/or the different-property-component supply position; (b) a mounting step of mounting, based on information related to the different-property-component supply position, the electronic circuit components including the different-property component, onto the circuit board; and (c) a property-related information providing step of providing the circuit board with the property-related information of the different-property component mounted on the circuit board. | 12-15-2011 |
Kazuyuki Haneda, Ichihara-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20080200097 | POLISHING METHOD AND POLISHING APPARATUS - The polishing method of a disk-shaped substrate for polishing an outer circumference | 08-21-2008 |
| 20080223402 | DISK-SHAPED SUBSTRATE MANUFACTURING METHOD AND WASHING APPARATUS - The disk-shaped substrate manufacturing method is provided with: scrub-washing a first surface and a second surface of a disk-shaped substrate by respectively using a first porous roller and a second porous roller that have a cylindrical shape and are rotationally driven. The process of the scrub-washing determines a distance between axes of the first porous roller and the second porous roller that sandwich the disk-shaped substrate in between, and performs scrub-washing while the determined distance between the axes is under control. | 09-18-2008 |
| 20080233841 | DISK-SHAPED SUBSTRATE MANUFACTURING METHOD - The disk-shaped substrate manufacturing method is provided with: generating an air stream downward from an upper area during grinding a disk-shaped substrate in a grinding apparatus; arranging the grinding apparatus on an upper floor face of a floor and arranging water on a lower floor face of the floor, the upper floor face being made of a board having penetration holes or a mesh member, and the lower floor face supporting the upper floor face so as to be located above the lower floor face with a distance; and guiding dust made by the grinding apparatus to the water by use of the air stream. | 09-25-2008 |
| 20110030424 | METHOD OF MANUFACTURING SUBSTRATE FOR MAGNETIC RECORDING MEDIUM - A method of manufacturing a substrate for a magnetic recording medium that is capable of manufacturing a magnetic recording medium substrate having no warping and superior surface smoothness at a high level of productivity and at low cost. The method of manufacturing a substrate for a magnetic recording medium according to the present invention includes a thin glass sheet formation step of heating and softening a sheet-like glass base material ( | 02-10-2011 |
Kazuyuki Haneda, Chiba JP
| Patent application number | Description | Published |
|---|---|---|
| 20090148724 | Glass Substrate for Magnetic Recording Medium and Magnetic Recording Medium - A glass substrate for a magnetic recording medium, having a chamfer face between the surface of the substrate for forming thereon a film comprising a magnetic layer, and the outer peripheral end face (straight face) of the substrate, wherein an R face having a curvature of 0.013 to 0.080 mm is provided between the data face and the chamfer face of the glass substrate. | 06-11-2009 |
Masaki Haneda, Yokohama JP
| Patent application number | Description | Published |
|---|---|---|
| 20120032281 | SEMICONDUCTOR DEVICE PRODUCTION METHOD AND SEMICONDUCTOR DEVICE - A semiconductor device production method includes: forming an insulating film on a semiconductor substrate, forming a concave portion in the insulating film, forming a gate insulating film at bottom of the concave portion, the bottom being on the semiconductor substrate; covering an inner wall surface of the concave portion and a top face of the insulating film with a first gate electrode film that is made of an electrically conductive material containing a first metal; covering the first gate electrode film with a covering film of a material having a second melting point higher than a first melting point of the electrically conductive material, leaving part of the side face of the concave portion uncovered; and performing heat treatment following the covering film formation to allow the first gate electrode film to reflow. | 02-09-2012 |
Masaki Haneda, Kawasaki JP
| Patent application number | Description | Published |
|---|---|---|
| 20090121355 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes a semiconductor substrate, an oxygen-containing insulating film disposed above the above-described semiconductor substrate, a concave portion disposed in the above-described insulating film, a copper-containing first film disposed on an inner wall of the above-described concave portion, a copper-containing second film disposed above the above-described first film and filled in the above-described concave portion, and a manganese-containing oxide layer disposed between the above-described first film and the above-described second film. Furthermore, a copper interconnection is formed on the above-described structure by an electroplating method and, subsequently, a short-time heat treatment is conducted at a temperature of 80° C. to 120° C. | 05-14-2009 |
| 20090146309 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device has a first insulating film formed over a semiconductor substrate, a first opening formed in the first insulating film, a first manganese oxide film formed along an inner wall of the first opening, a first copper wiring embedded in the first opening, and a second manganese oxide film formed on the first copper wiring including carbon. | 06-11-2009 |
| 20090269925 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A process for producing a semiconductor device, comprising the wiring region forming step of forming a wiring region on a semiconductor substrate; the copper wiring layer forming step of forming a copper wiring layer on the formed wiring region by electrolytic plating technique, wherein the copper wiring layer is formed by passing a current of application pattern determined from the relationship between application pattern of current passed at electrolytic plating and impurity content characteristic in the formed copper wiring layer so that the impurity content in the formed copper wiring layer becomes desired one; and the wiring forming step of polishing the formed copper wiring layer into a wiring. | 10-29-2009 |
| 20090317925 | EVALUATION METHOD OF SEMICONDUCTOR DEVICE - A technology for analyzing and evaluating of a change of impurity content distribution at the heat treatment of electrodeposited copper film. There is provided a method of evaluating a semiconductor device, comprising providing an electrodeposited copper film formed while causing the deposition current to transit between the first state of current density and the second state of current density so as to attain a desired impurity content distribution and carrying out analysis and evaluation of any impurity diffusion from a change of impurity content distribution in the electrodeposited copper film between before and after heat treatment. | 12-24-2009 |
| 20090321937 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME - A semiconductor device includes an insulating film including oxygen formed over a semiconductor substrate, a recess formed in the insulating film, a refractory metal film formed on the inner wall of the recess, a metal film including copper, manganese, and nitrogen formed on the refractory metal film, and a copper film formed on the metal film to fill in the recess. | 12-31-2009 |
| 20100009530 | SEMICONDUCTOR DEVICE FABRICATION METHOD - A semiconductor device fabrication method including the steps of: forming an interlayer insulating film on a substrate; forming an opening in the interlayer insulating film; forming an alloy layer containing manganese and copper to cover the inner surface of the opening; forming a first copper layer of a material containing primarily copper on the alloy layer to fill the opening; forming, on the first copper layer, a second copper layer of a material containing primarily copper and a higher concentration of oxygen, carbon or nitrogen than the first copper layer; heating the substrate on which the second copper layer has been formed; and removing the second copper layer. | 01-14-2010 |
| 20110183515 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device has a first insulating film formed over a semiconductor substrate, a first opening formed in the first insulating film, a first manganese oxide film formed along an inner wall of the first opening, a first copper wiring embedded in the first opening, and a second manganese oxide film formed on the first copper wiring including carbon. | 07-28-2011 |
Naoya Haneda, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20090190695 | DECODING DEVICE AND METHOD, RECEIVING DEVICE AND METHOD, AND PROGRAM - Disclosed herein is a decoding device that decodes demodulated data obtained by demodulating a quadrature modulated signal arising from digital modulation of a carrier and detects synchronization, the decoding device including, a decoder configured to decode first demodulated data that is the demodulated data obtained by demodulating the quadrature modulated signal and is composed of in-phase axis data and quadrature axis data, and decode second demodulated data obtained by interchanging the in-phase axis data and the quadrature axis data of the first demodulated data, and a synchronization detector configured to detect a boundary between predetermined information symbol sequences from first decoded data obtained by decoding the first demodulated data and detect the boundary from second decoded data obtained by decoding the second demodulated data, the synchronization detector selecting and outputting one of the first decoded data and the second decoded data based on a result of the detection of the boundary. | 07-30-2009 |
Shigeru Haneda, Hitachinaka JP
| Patent application number | Description | Published |
|---|---|---|
| 20110260558 | STAGE DRIVE DEVICE - A stage comprises a linear guide rail ( | 10-27-2011 |
Shigeru Haneda, Yokohama-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090008653 | LIGHT EMITTING DEVICE - A light emitting device includes an active layer including atoms A of a matrix semiconductor having a tetrahedral structure, a heteroatom D substituted for the atom A in a lattice site, and a heteroatom Z inserted into an interstitial site positioned closest to the heteroatom D, the heteroatom D having a valence electron number differing by +1 or −1 from that of the atom A, and the heteroatom Z having an electron configuration of a closed shell structure through charge compensation with the heteroatom D, and an n-electrode and a p-electrode adapted to supply a current to the active layer. | 01-08-2009 |
Shigeya Haneda, Inuyama JP
| Patent application number | Description | Published |
|---|---|---|
| 20100177995 | SLIDE MEMBER - In a slide member in which an overlay is provided on a slide receiving surface of a base member, the overlay is formed by attaching a mixed solid lubricant on the slide receiving surface of the base member. The mixed solid lubricant is made by mixing a large amount of hydrogen containing solid lubricant which contains a large amount of hydrogen, and a small amount of hydrogen containing solid lubricant which contains a smaller hydrogen amount than the large amount of hydrogen containing lubricant. Thereby, a lubricant absence region where the solid lubricant is absent in a thickness direction is formed on the slide receiving surface of the base member after sliding, and an oxidized portion where the base member is oxidized is formed in the lubricant absence region. | 07-15-2010 |
Shinichi Haneda, Anjo-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20120025545 | Bumper reinforcement and bumper device for vehicle - A bumper reinforcement having end portions in a width direction of a vehicle, includes a main wall extending in a first direction perpendicular to the width direction, first and second walls protruding from the main wall in the first direction to extend toward an interior side of the vehicle in a longitudinal direction of the vehicle, flanges protruding from respective ends of the first and second walls along the first direction, the main wall, the first and second walls, and the flanges being integrally formed with one another, and gradually narrowing portions formed, in the width direction, at end portions of each of the first and second walls, wherein respective protruding lengths of the first and second walls in the longitudinal direction gradually decrease from an intermediate portion of the bumper reinforcement to the end portions of the bumper reinforcement in the width direction to form the gradually narrowing portions. | 02-02-2012 |
| 20120025546 | Bumper device for vehicle - A bumper device for a vehicle, includes a bumper reinforcement extending in a width direction of the vehicle, a connecting member extending in a longitudinal direction of the vehicle and connected to an end portion of the bumper reinforcement, the connecting member including a bottom wall portion that is in contact with the bumper reinforcement, a fitting bore formed in either one of the bottom wall portion and a contact wall portion of the bumper reinforcement, an insertion portion formed at the other one of the bottom wall portion and the contact wall portion and inserted in the fitting bore, and a flange extending from an edge of the insertion portion, wherein the one of the bottom wall portion and the contact wall portion, including the fitting bore is supported by the flange and the other one of the bottom wall portion and the contact wall portion, including the flange. | 02-02-2012 |
| 20120025547 | Impact absorbing device for vehicle and bumper device for vehicle - An impact absorbing device for a vehicle includes an impact-absorbing portion including an inner wall surface extending smoothly in an axial direction and configured to compressively deform in the axial direction for absorbing an impact energy, a first attaching portion closing an opening end of the impact-absorbing portion closer to a bumper reinforcement and configured to be attached to the bumper reinforcement, a second attaching portion extending from an opening end of the impact-absorbing portion closer to the side member and configured to be attached to a side member, a readily deformable portion provided at the impact-absorbing portion and formed by forming a plate thickness to be thinner in a partial range of the impact-absorbing portion in the axial direction, and an initial peak load restraining portion provided at the first attaching portion and set to be away from the bumper reinforcement in the axial direction, which are integrally formed. | 02-02-2012 |
Takushiro Haneda, Ome-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090153589 | MOBILE RADIO TERMINAL APPARATUS - Control unit executes automatic scrolling display processing of allowing an explanation of an item corresponding to a focus, of listed items displayed in a list display area of display unit, to be automatically scrolled in a scrolling display area of the display unit. When the control unit repeats this processing at predetermined number of times N, the control unit stops the processing. | 06-18-2009 |
Tomoaki Haneda, Kawasaki JP
| Patent application number | Description | Published |
|---|---|---|
| 20080232064 | COOLING SYSTEM FOR INFORMATION DEVICE - To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers each composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air currents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are disposed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack. | 09-25-2008 |
| 20110317357 | COOLING SYSTEM FOR INFORMATION DEVICE - To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers earch composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air curents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are dispossed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack. | 12-29-2011 |
Toru Haneda, Kamisu-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110195999 | NOVEL ANTIFUNGAL AGENT CONTAINING HETEROCYCLIC COMPOUND - The present invention provides an antifungal agent represented by the formula: | 08-11-2011 |
Toru Haneda, Ushiki-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110118470 | NITROGEN-CONTAINING AROMATIC DERIVATIVES - Compounds represented by the following general formula: | 05-19-2011 |
Toru Haneda, Ushiku-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20100197911 | Nitrogen-Containing Aromatic Derivatives - Compounds represented by the following general formula: | 08-05-2010 |
Toru Haneda, Ibaraki JP
| Patent application number | Description | Published |
|---|---|---|
| 20090062348 | Antifungal Agent Containing Pyridine Derivative - The present invention provides an antifungal agent that has superior antifungal action and is also superior in terms of physical properties, safety and metabolic stability. The present invention discloses a compound represented by the formula (I): | 03-05-2009 |
| 20090269352 | ANTITUMOR AGENT COMPRISING SULFONAMIDE-CONTAINING HETEROCYCLIC COMPOUND COMBINED WITH AN ANGIOGENESIS INHIBITOR - The present invention provides a composition and a kit for treating tumors, which permits a sulfonamide-containing heterocyclic compound to exhibit its angiogenesis inhibitory activity and antitumor activity more effectively. According to the present invention, the sulfonamide-containing heterocyclic compound can be used in treating cancers more effectively by combination with a VEGF inhibitor/FGF inhibitor. | 10-29-2009 |
| 20100267754 | INTEGRIN EXPRESSION INHIBITOR - The present invention provides an integrin expression inhibitor, and an agent for treating arterial sclerosis, psoriasis, cancer, retinal angiogenesis, diabetic retinopathy or inflammatory diseases, an anticoagulant, or a cancer metastasis suppressor on the basis of an integrin inhibitory action. Namely, it provides an integrin expression inhibitor comprising, as an active ingredient, a sulfonamide compound represented by the following formula (I), a pharmacologically acceptable salt thereof or a hydrate of them, | 10-21-2010 |
Tsuyoshi Haneda, Tokyo-To JP
| Patent application number | Description | Published |
|---|---|---|
| 20100105901 | SYNTHESIS METHOD OF POLYMER COMPLEX CRYSTAL - Disclosed is a synthesis method for synthesizing in a short time and selectively a microcrystal of a polymer complex having three three-dimensionally and regularly arranged channels. | 04-29-2010 |
Yuya Haneda, Chino JP
| Patent application number | Description | Published |
|---|---|---|
| 20110157284 | RECORDING METHOD - A recording method includes: printing a recording pattern onto an electronic component with a photocuring liquid having the property of accelerating curing when irradiated with light; irradiating light onto liquid that constitutes the recording pattern after the printing of the recording pattern; and thinning the film that constitutes the recording pattern after the irradiating of the light. | 06-30-2011 |