Han-Ping

Han-Ping Chung, Fongshan City TW

Patent application number	Description	Published
20110031538	CMOS STRUCTURE WITH MULTIPLE SPACERS - A semiconductor device includes a substrate having shallow trench isolation and source/drain regions located therein, a gate stack located on the substrate between the source/drain regions, a first gate spacer on the sidewall of the gate stack, and a second gate spacer on the sidewall of the first gate spacer.	02-10-2011

Patent application number	Description	Published
20100044259	BAG FOR A PORTABLE COMPUTER - A bag for a portable computer includes: a foldable case body having opposite first and second wall portions connected integrally to and movable relative to an intermediate third wall portion; a connecting unit for interconnecting the first and second wall portions so as to maintain the case body in a folded state, where the first and second wall portions face each other such that the case body is configured with a receiving space for receiving the portable computer therein; a positioning unit for positioning respectively a main housing and a display panel of the portable computer on the first and second wall portions; and a hanging member disposed fixedly to an outer surface of the second wall portion so as to define an insertion space therebetween that permits insertion of a supporting member thereinto via an opening adjacent to the intermediate third wall portion.	02-25-2010

Patent application number	Description	Published
20110079804	POLARIZED LIGHT EMITTING DIODE DEVICE AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a polarized light emitting diode (LED) device and the method for manufacturing the same, in which the LED device comprises: a base, a light emitting diode (LED) chip, a polarizing waveguide and a packaging material. In an exemplary embodiment, the LED chip is disposed on the base and is configured with a first light-emitting surface for outputting light therefrom; and the waveguide, being comprised of a polarization layer, a reflection layer, a conversion layer and a light transmitting layer, is disposed at the optical path of the light emitted from the LED chip; and the packaging material is used for packaging the waveguide, the LED chip and the base into a package.	04-07-2011