Han-Hsiang
Han-Hsiang Chiang, New Taipei City TW
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20150380607 | Light Emitting Diode Device - A light emitting diode device is provided. The light emitting diode device has a substrate, a plurality of metal pads, a plurality of LEDs and a first metal conductive wire. A plurality of first metal pads of the metal pads are disposed on a first surface of the substrate, and the LEDs are disposed on a part of the first metal pads. Each of the LEDs has at least one first electrode contact. The first electrode contact of each of the LEDs electrically connected to the first metal conductive wire has the same electrode contact polarity. Moreover, another light emitting diode device is also provided. | 12-31-2015 |
Han-Hsiang Huang, Hsinchu TW
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20130154372 | POWER-FACTOR-CORRECTED RESONANT CONVERTER AND PARALLEL POWER-FACTOR-CORRECTED RESONANT CONVERTER - A resonant converter with power factor correction includes a power-obtaining circuit, an energy-storage element and an energy-transferred circuit. The power-obtaining circuit is used for receiving an input line voltage. The energy-storage element is coupled between the power-obtaining circuit and the energy-transferred circuit. The energy-transferred circuit is used for generating an output power. In a first time period, based on a first control signal, the energy-storage element and the power-obtaining circuit operate a soft switching so that the energy-storage element is charged to obtain the input line power and generate an energy-storage voltage. In a second time period, based on a second control signal, the energy-storage element and the energy-transferred circuit operate a soft switching so that the energy-storage element is discharged to make the energy-storage voltage converted into the output power. | 06-20-2013 |
20130170259 | METHOD AND APPARATUS FOR CONTROLLING THE EQUIVALENT RESISTANCE OF A CONVERTER - The disclosure provides a method for controlling an equivalent resistance of a converter. The method includes receiving a power source input signal, generating a first control signal according to a voltage level and a state of the power source input signal to adjust an equivalent resistance of the voltage conversion module and cause the voltage conversion module to operate in the damper mode or the converter mode, when the voltage conversion module operates in the converter mode converting the power source input signal to an output signal, and when the voltage conversion module operates in the damper mode detecting the voltage level or the current level of the power source input signal, and adjusting the equivalent resistance so that the voltage conversion module could operate in the bleeder mode or the converter mode to convert the power source input signal to the output signal. | 07-04-2013 |
20140002035 | COMMON-CORE POWER FACTOR CORRECTION RESONANT CONVERTER | 01-02-2014 |
Han-Hsiang Huang, Donggang Township TW
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20090057823 | Semiconductor Structure with a Discontinuous Material Density for Reducing Eddy Currents - A semiconductor structure includes an inductor; and a semiconductor substrate underlying the inductor, having a discontinuous material density across a plane underneath and in parallel with the inductor, thereby reducing eddy currents induced by an electrical current flowing through the inductor. | 03-05-2009 |
Han-Hsiang Lee, Taipei City TW
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20120075808 | ELECTRONIC PACKAGE STRUCTURE - An electronic package structure is provided. The electronic package structure comprises a substrate, a first electronic element, and a second electronic element. The substrate includes a heat-dissipating plate and a circuit board disposed on the heat-dissipating plate. The first electronic element is disposed on the heat-dissipating plate and coupled to the circuit board. The second electronic element is disposed on the circuit board and coupled to the circuit board. | 03-29-2012 |
20120313229 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - The invention discloses a package structure for better heat-dissipation or EMI performance. A first conductive element and a second conductive element are both disposed between the top lead frame and the bottom lead frame. The first terminal of the first conductive element is electrically connected to the bottom lead frame, and the second terminal of the first conductive element is electrically connected to the top lead frame. The third terminal of the second conductive element is electrically connected to the bottom lead frame, and the fourth terminal of the second conductive element is electrically connected to the top lead frame. In one embodiment, a heat dissipation device is disposed on the top lead frame. In one embodiment, the molding compound is provided such that the outer leads of the top lead frame are exposed outside the molding compound. | 12-13-2012 |
Han-Hsiang Lee, Taipei TW
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20110199746 | ELECTRONIC SYSTEM WITH A COMPOSITE SUBSTRATE - A composite substrate made of a circuit board mounted on a lead frame is used for an electronic system package. High heat generated electronic components are adapted to mount on the lead frame and relatively low heat generated electronic components are adapted to mount on the circuit board. Metal lines are used for electrical coupling between the circuitry of the IC chip and the circuit board. An electronic system with the composite substrate gains both advantages—good circuitry arrangement capability from the circuit board and good heat distribution from the lead frame. | 08-18-2011 |
20130328181 | ELECTRONIC SYSTEM WITH A COMPOSITE SUBSTRATE - A composite substrate made of a conductive pattern structure mounted on a lead frame is used for an electronic system package. High heat generated electronic components are adapted to mount on the lead frame and relatively low heat generated electronic components are adapted to mount on the conductive pattern structure. Metal lines are used for electrical coupling between the circuitry of the IC chip and the conductive pattern structure. An electronic system with the composite substrate gains both advantages—good circuitry arrangement capability from the conductive pattern structure and good heat distribution from the lead frame. | 12-12-2013 |
20150102475 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - The invention discloses a package structure for better heat-dissipation or EMI performance. A first conductive element and a second conductive element are both disposed between the top lead frame and the bottom lead frame. The first terminal of the first conductive element is electrically connected to the bottom lead frame, and the second terminal of the first conductive element is electrically connected to the top lead frame. The third terminal of the second conductive element is electrically connected to the bottom lead frame, and the fourth terminal of the second conductive element is electrically connected to the top lead frame. In one embodiment, a heat dissipation device is disposed on the top lead frame. In one embodiment, the molding compound is provided such that the outer leads of the top lead frame are exposed outside the molding compound. | 04-16-2015 |
Han-Hsiang Lin, Taipei City TW
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20130045362 | METHOD FOR MAKING A CONDUCTIVE LAMINATE - A method for making a conductive laminate includes: (a) forming a photocurable layer on a substrate, the photocurable layer including at least one photocurable prepolymer that has a plurality of reactive functional groups and that has a functional group equivalent weight ranging from 70 to 700 g/mol; (b) covering partially the photocurable layer using a patterned mask; (c) exposing the photocurable layer through the patterned mask using a first light source; (d) removing the patterned mask; (e) exposing the photocurable layer to a second light source to cure second regions of the photocurable layer which have not been cured, so as to form a microstructure; and (f) forming a conductive layer on the microstructure. | 02-21-2013 |
Han-Hsiang Lin, Taoyuan County TW
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20130280660 | METHOD OF PATTERING NONMETAL CONDUCTIVE LAYER - A method of patterning a nonmetal conductive layer on a circuit board is provided. A nonmetal conductive layer and a negative photoresist layer are sequentially formed on a substrate of a circuit board. Then, the negative photoresist layer is exposed through a patterned photomask and then developed by a developing solution. Next, the nonmetal conductive layer is etched. The remained photoresist layer is finally removed by a non-alkaline stripper solution to obtain a patterned nonmetal layer on the substrate. | 10-24-2013 |