Han, Asan-Si
Bo-Won Han, Asan-Si KR
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20160111169 | MEMORY TEST APPARATUS - A memory test apparatus includes a test board unit including a first test board configured to load for testing a first memory system including a plurality of memory modules. A second test board is configured to load for testing a second memory system including a plurality of memory modules. A power unit comprises a first power supply unit configured to supply the first test board with a first power for testing the first memory system, a second power supply unit configured to supply the second test board with a second power for testing the second memory system, and a power supply control unit configured to control at least one of a supply timing of the first power and a supply timing of the second power. | 04-21-2016 |
Byung-Uk Han, Asan-Si KR
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20120319123 | Display Device and Method of Manufacturing the Same - A display device may include a first substrate comprising a display region and a non-display region surrounding the display region, a first metal wiring formed in the display region of the first substrate, a second metal wiring formed in the non-display region of the first substrate, a sealing member formed on the second metal wiring, and a second substrate disposed on the sealing member so as to face the first substrate. The first metal wiring and the second wiring are made of the same material. | 12-20-2012 |
Dae Young Han, Asan-Si KR
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20120285622 | PLASMA DEVICE - A plasma device includes: a reaction chamber; an upper electrode positioned upward in the reaction chamber; a lower electrode facing the upper electrode; a baffle plate enclosing the lower electrode and including a plurality of cutouts formed at the edge thereof, wherein a boundary line of the cutout is connected to a boundary line of the baffle plate, thereby forming a recess portion at the edge of the baffle plate. The cutouts of the baffle plate change the flow of the reactive gas in the chamber, helping achieve a more uniform etch. | 11-15-2012 |
Eun Hee Han, Asan-Si KR
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20130171565 | ORGANIC ANTI REFLECTIVE LAYER COMPOSITION - Disclosed is an organic antireflective film composition which includes a monomer containing two or more thiol groups and a monomer containing two or more vinyl groups, as crosslinking agents. When the organic antireflective film composition is used, an antireflective film formed from the composition can be rapidly etched in an ultrafine pattern forming process, and the curing rate can be increased, while the etching rate is increased, without using an acid generator and a curing agent or by using the agents only in small amounts. | 07-04-2013 |
Giju Han, Asan-Si KR
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20110260817 | SLIM TYPE HIGH VOLTAGE TRANSFORMER - A slim-type high voltage transformer includes a case, and a transformer portion configured by mounting at least primary and secondary winding coils wound in the shape of a rectangular or elliptic track to protruding grooves formed in the interior of the case and then mounting a first copperplate core on the primary and secondary winding coils. In the transformer, the transformer portion further includes an insulating member interposed between the primary and secondary winding coils and the first copperplate core. Accordingly, a bobbin for winding a coil is not used, so that the height of the transformer can be minimized, thereby decreasing the size of products. Also, a winding is divided into two sections to be molded, so that the insulation and heat generation of the winding can be effectively controlled, thereby improving the stability of the transformer. | 10-27-2011 |
20110260818 | SLIM TYPE HIGH VOLTAGE TRANSFORMER - A slim-type high voltage transformer includes a case, and a plurality of transformer portions configured by mounting a plurality of primary and secondary winding coils to protruding grooves formed in the interior of the case and then mounting a first copperplate core on the primary and secondary winding coils. In the transformer, the plurality of transformer portions are disposed bilaterally symmetric, and share at least one copperplate core and an insulating member interposed between the primary and secondary winding coils and the copperplate core. Accordingly, a bobbin for winding a coil is not used, so that the height of the transformer can be minimized, thereby decreasing the size of products. Also, a winding is molded, so that the insulation and heat generation of the winding can be effectively controlled, thereby improving the stability of the transformer. | 10-27-2011 |
Hun Han, Asan-Si KR
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20120207561 | ROUTER APPARATUS - A router apparatus is provided. The router apparatus includes a plurality of panels stacked vertically; a router bit which cuts the panels simultaneously; a first supporting unit connected to one end of the router bit, and a second supporting unit connected to the other end of the router bit. A guide rail is formed in the second supporting unit in order to guide a movement of the router bit. | 08-16-2012 |
Jeehoon Han, Asan-Si KR
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20150309763 | SYSTEM AND METHOD FOR IMAGE DISPLAY - An image display system includes a plurality of unit display devices, an image data buffer, and a location recognition unit. The location recognition unit recognizes the locations of the unit display devices and provides the image data buffer with location data. When the image data driver determines that the unit display devices are arranged in a first pattern, the plurality of unit display devices together displays a first image that corresponds to the first pattern. | 10-29-2015 |
Jee-Hoon Han, Asan-Si KR
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20150268693 | DISPLAY APPARATUS - A display apparatus includes a display portion configured to display an image, a frame surrounding the display portion, and a block in which a groove is defined. The frame includes a plurality of protrusions. The protrusions have same shapes and are arranged spaced apart by a uniform gap. The groove of the block is configured to receive a protrusion of the frame. | 09-24-2015 |
20150277026 | DISPLAY DEVICE - A display device in a display panel; a backlight unit configured to provide light to the display panel, the display pan& being arranged at a side of a first surface of the backlight unit; and a first light adjustment unit configured to be arranged at a side of a second surface of the backlight unit opposite to the first surface of the backlight unit, the first light adjustment unit including a plurality of reflection portions, reflection portions of the plurality of reflection portions being rotatable so as to be switchable between a light transmission mode and a light reflection mode. | 10-01-2015 |
Jeong-Geun Han, Asan-Si KR
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20090068916 | METHOD OF MANUFACTURING CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESIVE HAVING THE SAME, AND METHOD OF MANUFACTURING DISPLAY APPARATUS USING THE SAME - In an anisotropic conductive adhesive containing a conductive particle, the conductive particle includes a resin particle that is provided with a cavity formed therein and a conductive layer surrounding a surface of the resin particle. The cavity is formed by mixing the resin particle with a reactant and partially removing the reactant from the resin particle. Thus, the conductive particle may readily absorb an external pressure, thereby providing an improved malleability to the conductive particle. | 03-12-2009 |
20120152455 | METHOD OF MANUFACTURING CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESIVE HAVING THE SAME, AND METHOD OF MANUFACTURING DISPLAY APPARATUS USING THE SAME - In an anisotropic conductive adhesive containing a conductive particle, the conductive particle includes a resin particle that is provided with a cavity formed therein and a conductive layer surrounding a surface of the resin particle. The cavity is formed by mixing the resin particle with a reactant and partially removing the reactant from the resin particle. Thus, the conductive particle may readily absorb an external pressure, thereby providing an improved malleability to the conductive particle. | 06-21-2012 |
Kyoungtai Han, Asan-Si KR
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20140098317 | ARRAY SUBSTRATE AND LIQUID CRYSTAL DISPLAY HAVING THE SAME - An array substrate includes a gate line, a data line insulated from and crossing the gate line, and a pixel connected to the gate line and the data line. The pixel includes at least one thin film transistor connected to the gate line and the data line, and a pixel electrode connected to the thin film transistor. The pixel electrode includes a trunk portion having a cross shape and a plurality of branch portions inclined to the trunk portion and spaced apart from each other. Each branch portion includes a first area extended from the trunk portion and a second area extended from the first area, and the second area has a width greater than a width of the first area. | 04-10-2014 |
Myeongbo Han, Asan-Si KR
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20140352163 | METHOD OF MEASURING FLATNESS OF CHAMFERING TABLE - A method of measuring a flatness of a chamfering table includes the steps of positioning a substrate on the chamfering table, chamfering an edge of the substrate a plurality of times with a chamfering wheel while varying a relative height of the chamfering wheel with respect to a height of the substrate, locating symmetric chamfered points where the chamfered edge is top-bottom symmetric, matching values of the relative height of the chamfering wheel to the found symmetric chamfered points, and obtaining the flatness of the chamfering table from the values of the relative height of the chamfering wheel that are matched to the symmetric chamfered points. | 12-04-2014 |
20140357160 | METHOD AND APPARATUS OF SYMMETRICALLY CHAMFERING SUBSTRATE - A method of symmetrically chamfering a substrate includes repeating, at least a plurality of times, the steps of chamfering an edge of the substrate using a chamfering wheel, measuring an asymmetric chamfering deviation (y) of the edge of the substrate which is chamfered, and controlling a relative position of the chamfering wheel with respect to the substrate by a value of a function f(y) of the variable y. It is possible to constantly symmetrically chamfer the edge of the substrate via active response to a change in the chamfering environment without a hardware-based operation of the related art. | 12-04-2014 |
Myung-Sup Han, Asan-Si KR
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20110042983 | NOZZLE FOR HOLDING A SUBSTRATE AND APPARATUS FOR TRANSFERRING A SUBSTRATE INCLUDING THE SAME - A nozzle for holding a substrate may include a nozzle head and a nozzle body. The nozzle head may provide the substrate with compressed air. The nozzle body may be connected to the nozzle head. The nozzle body may be arranged facing the semiconductor substrate. The nozzle body may have a substantially flat supporting surface which provides a uniform gap between the substrate and the nozzle body. The nozzle body may have a first passageway which allows the compressed air to pass through toward the substrate to form a vacuum between the substantially flat supporting surface and the substrate. | 02-24-2011 |
Sang-Kyeong Han, Asan-Si KR
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20130342236 | TEST INTERFACE BOARDS AND TEST SYSTEMS - A test interface board comprises at least one switch matrix including a plurality of switching elements that connect a plurality of connection nodes to each other. The at least one switch matrix is configured to connect a plurality of channels of an automatic test equipment (ATE) to respective pin positions corresponding to a device under test (DUT) in response to switching control signals. The plurality of channels provide test operation signals for testing the DUT. A control logic is configured to generate the switching control signals based on pin configuration information of the DUT. | 12-26-2013 |
Sang-Sun Han, Asan-Si KR
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20120206940 | BACKLIGHT ASSEMBLY - A backlight assembly includes a light emitting part, a light guide plate, a bracket and receiving container. The light emitting part generates light. The light guide plate includes a first side surface which receives the light, and a second side surface adjacent to the first side surface. The bracket is fixed to the second side surface of the light guide plate. The receiving container includes a bottom, and a sidewall perpendicularly extending from the bottom, and receives the light emitting part and the light guide plate. The sidewall includes combining portions which are combined with the bracket. | 08-16-2012 |
Se Hyun Han, Asan-Si KR
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20130128280 | METHOD FOR MEASURING THREE-DIMENSION SHAPE OF TARGET OBJECT - A method of measuring a 3D shape, which can measure a 3D shape of target objects on a board by searching a database for bare board information when a measuring object is not set to a normal inspection mode or by performing bare board teaching when the board is supplied from a supplier having not the bare board information is provided. The method of measuring a 3D shape includes operation S | 05-23-2013 |
Seunghun Han, Asan-Si KR
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20140151863 | SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME - A semiconductor package includes a wiring board, a semiconductor chip mounted on the wiring board, and a mounting connection terminal electrically connecting a bonding pad of the semiconductor chip to a first connection pad of the wiring board. The mounting connection terminal includes a core portion and a connecting shell solder portion substantially surrounding the core portion. The core portion of the mounting connection terminal is not in contact with the bonding pad of the semiconductor chip. | 06-05-2014 |
20140346667 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor package comprising: a lower semiconductor package comprising a lower semiconductor chip mounted on a lower package substrate and a lower molding layer substantially covering the lower semiconductor chip and having through holes arranged in a first direction and a second direction. The first direction is different from the second direction; and for each of the through holes, first and second upper widths of the through hole in the first and second directions are less than a third upper width of the through hole in a third direction that is a diagonal direction with respect to the first and second directions. | 11-27-2014 |
20150270242 | SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME - A semiconductor package includes a wiring board, a semiconductor chip mounted on the wiring board, and a mounting connection terminal electrically connecting a bonding pad of the semiconductor chip to a first connection pad of the wiring board. The mounting connection terminal includes a core portion and a connecting shell solder portion substantially surrounding the core portion. The core portion of the mounting connection terminal is not in contact with the bonding pad of the semiconductor chip. | 09-24-2015 |
Seung-Hun Han, Asan-Si KR
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20140091463 | SEMICONDUCTOR PACKAGE APPARATUS - According to example embodiments of inventive concepts, a semiconductor package apparatus includes a first semiconductor package including a first substrate, a first solder resist layer on the first substrate, and a first sealing member that covers and protects the first solder resist layer, and a plurality of solder balls on the first substrate. The plurality of solder balls includes a first solder ball having a first height and a second solder ball having a second height that is different from the first height. The first sealing member includes holes that expose the solder balls. | 04-03-2014 |
Songyi Han, Asan-Si KR
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20160029449 | METHOD OF DRIVING BACKLIGHT UNIT AND DISPLAY DEVICE HAVING THE BACKLIGHT UNIT - According to an exemplary embodiment, a display device includes a backlight unit and a display panel. The backlight unit comprises a single light emitting diode string with a plurality of light emitting diodes that are connected to each other in series and configured to emit light. The backlight unit also comprises a detector configured to generate a first voltage and a second voltage with respect to an output voltage for driving the single light emitting diode string, sample the first voltage at a predetermined time interval to generate a sample voltage, and compare a level of the sample voltage with a level of the second voltage to generate a compared result. The display panel is configured to receive light from the backlight unit to display an image. The compared result determines whether the output voltage is applied to the light emitting diode string. | 01-28-2016 |
Song-Yi Han, Asan-Si KR
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20130038232 | LIGHT UNIT AND DRIVING METHOD THEREOF - A light unit includes: an integrated power (“IP”) board which receives power supply and converts the power supply into a high voltage and a supply voltage; a lamp; and a terminal board (“T board”) which receives the high voltage from the IP board to turn on the lamp, receives the supply voltage from the IP board to transfer the supply voltage to the IP board, in which the IP board transfers the high voltage to the T board after the IP board receives the supply voltage from the T board. | 02-14-2013 |
20150156836 | LIGHT EMITTING DEVICE INCLUDING LIGHT EMITTING DIODE AND DRIVING METHOD THEREOF - A light emitting device includes a light emitting unit and a constant current controller. The light emitting unit includes at least one LED string. The constant current controller is connected to a cathode terminal of the LED string and controls a driving current flowing through the LED string. The constant current controller includes a transistor connected to the cathode terminal of the LED string. A switching unit and a sensing resistor are connected to the transistor. The switching unit connects and disconnects between the sensing resistor and the transistor. | 06-04-2015 |
20160042699 | LIGHT SOURCE DEVICE, DRIVING METHOD THEREOF AND DISPLAY DEVICE HAVING THE SAME - A light source device capable of preventing luminance from being decreased, a driving method of the light source device and a display device having the light source device are disclosed. Alight source device includes a plurality of light-emitting diode (“LED”) strings and an LED driving circuit. The LED strings include LEDs emitting lights connected in serial. The LED driving circuit supplies a driving voltage to the LED strings. The LED driving circuit maximizes the driving voltage supplied to the LED strings by using the minimum string current of string currents supplied to each LED string in an initial driving period. The LED driving circuit supplies the maximum driving voltage to the LED strings by blocking a current flowing through a sensing resistor disposed to sense the minimum string current in a normal driving period. | 02-11-2016 |
Yoonoh Han, Asan-Si KR
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20130260592 | SEMICONDUCTOR CHIP PACKAGE TEST SOCKETS - A semiconductor chip package test socket may include a socket housing; a plurality of probe needles in the socket housing; a conductive pad on the probe needles; a floating guide configured to cover an edge of the conductive pad and configured to provide a semiconductor chip package on the conductive pad; and/or clamps fixed at the socket housing. The clamps may combine the floating guide with the socket housing. | 10-03-2013 |
Yoon-Oh Han, Asan-Si KR
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20130118956 | METHOD OF TESTING AN OBJECT AND APPARATUS FOR PERFORMING THE SAME - A method of testing objects and an apparatus for performing the same, the method including loading the objects into a testing unit through a loading unit; testing the objects in the testing unit and determining whether the objects are normal objects or abnormal objects; unloading the tested objects from the testing unit to an unloading unit; directly reversely loading the abnormal objects from the unloading unit into the testing unit when the objects are determined to be abnormal objects; and re-testing the abnormal objects in the testing unit. | 05-16-2013 |
Youngbin Han, Asan-Si KR
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20150321359 | PICKER ASSEMBLY - A picker assembly includes a picker, a driving member coupled to the picker, the driving member adjusting a position of the picker, a pair of first fixing members on a lower surface of the driving member, the pair of first fixing members being adjacent to a portion at which the driving member and the picker are connected, and a pair of second fixing members on the picker, the pair of second fixing members being coupled to respective first fixing members through latching and fixing. | 11-12-2015 |
Younho Han, Asan-Si KR
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20120139964 | DISPLAY PANEL MODULE AND MULTI-PANEL DISPLAY APPARATUS INCLUDING THE SAME - A display panel module includes a display panel, a lens sheet, and an upper polarizing plate. The display panel includes a display region in which an image is displayed, and a non-display region in which the image is not displayed. The lens sheet faces a light emitting surface of the display panel and changes a path of a portion of light emitted from the display region of the display panel, to transmit the portion of the light onto the non-display region of the display panel. The upper polarizing plate faces a light exiting surface of the lens sheet, and transmits only light traveling parallel to a polarizing axis | 06-07-2012 |
Youn-Ho Han, Asan-Si KR
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20130044509 | BACKLIGHT ASSEMBLY AND DISPLAY APPARATUS HAVING THE SAME - A backlight assembly includes a first light guide plate, a second light guide plate, a light source part and a cover part. The second light guide plate is spaced apart from the first light guide plate. The light source part includes a first light source providing light to the first light guide plate and a second light source providing light to the second light guide plate. The cover part is disposed over the light source part. The cover part overlaps with a portion of the first light guide plate and a portion of the second light guide plate. A display apparatus having the above configuration has a narrow bezel and a thin profile. | 02-21-2013 |