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Hamagishi
Kenichiro Hamagishi, Kyoto JP
| Patent application number | Description | Published |
|---|---|---|
| 20110001388 | MOTOR - In a busbar unit, which is a distributing device arranged to supply electrical currents to coils, a busbar holder is arranged to support coil connection busbars and sensor connection busbars. Conductor wire connection portions of the coil connection busbars are exposed on both axial sides and welded to a conductor wire defining the coils. The sensor connection busbars are combined with a plurality of electronic components to define a Hall IC circuit designed to output and receive electrical signals to or from Hall ICs. Sensor connection portions of the sensor connection busbars are exposed on both axial sides, and welded to terminals of the Hall ICs. Electronic component connection portions of the sensor connection busbars are exposed on both axial sides, and welded to the electronic components. | 01-06-2011 |
| 20110006625 | MOTOR - In a busbar unit, which is a distributing device arranged to supply electrical currents to coils, a busbar holder is arranged to support coil connection busbars and sensor connection busbars. A bottom surface portion of a busbar holder body portion includes a bearing holder holding a bearing defined therein, and includes resistors and capacitors defining a portion of a Hall IC circuit arranged thereon. The Hall IC circuit is arranged to input and output electrical signals to or from Hall ICs. An upper surface portion includes sensor holders each holding a separate one of the Hall ICs defined therein. A connector portion is arranged to project radially outward from the busbar holder body portion. The sensor connection busbars and each of the coil connection busbars are arranged one above another along an axial direction. | 01-13-2011 |
Shinya Hamagishi, Fujisawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20090059534 | ELECTRONIC EQUIPMENT - In order to ensure waterproofing between a resin enclosure case and a heat sink, a canopy structure is provided in a portion, in which water is likely to penetrate, so as to prevent the water from entering the portion, thereby directing the water flow to the outside of the enclosure. This makes it easy to install and remove an electronic unit, so that an electronic component integrally formed with the heat sink can be easily replaced. | 03-05-2009 |
| 20100181108 | ELECTRONIC EQUIPMENT - Electronic equipment installed outdoors to house an internal unit is provided, meeting the waterproof standard and having an easily replaceable structure of the internal unit. The electronic equipment has an enclosure having a cover and a case with an opening and an air vent, and an internal unit in which an electronic component is mounted. The internal unit has a heat sink and radiation fins for releasing heat generated by the electronic component. The fins are inserted into the opening. The heat sink has a draining portion formed below the fins in a direction perpendicular to an extending direction of the radiation fins, a groove for waterproofing around the fins except an upper portion thereof, and two protrusions for fitting above the fins. The case has a rib for waterproofing around the opening except an upper portion thereof, and two holes for fitting above the opening. | 07-22-2010 |
| 20110072834 | COOLING STRUCTURE OF ELECTRONIC EQUIPMENT - In an environment in which influence of heat energy from the outside is received, for example, when a large temperature difference occurs in an electronic equipment by external factors such as solar insolation or when a temperature difference occurs in the electronic equipment by heat of another device installed in the neighborhood, it is difficult to stabilize the temperature of the equipment within an allowable temperature range due to the influence of the external environment. An electronic equipment has a structure in which an electronic component contained in a housing is thermally connected to a housing inner wall through plural heat conduction members and a heat conduction control member, and the amount of heat transported from the electronic component to the housing inner wall is controlled by using the heat conduction control member. The amount of heat to be transported is decreased for a housing surface whose temperature rises by influence of the external environment, the amount of heat to be transported is increased for a housing surface which is not influenced by the external environment, and the temperature of the electronic component is stabilized within the allowable temperature range. | 03-31-2011 |
Toshimitsu Hamagishi, Kyoto JP
| Patent application number | Description | Published |
|---|---|---|
| 20080259978 | Exposure device and circuit board for laser controller - In an exposure device comprising a laser controller that is configured as a circuit board capable of independently being changed, and that controls the emission of laser light from a laser emitter emitting laser light on receipt of an instruction for control given from a main controller responsible for overall control of the operation of the exposure device, error control information that is obtained in advance with regard to the circuit board and controls variations of a controlling factor due to a circuit error of the circuit board is stored into a memory provided to the laser controller prior to the provision of the circuit board to the exposure device. On receipt of an instruction for control given from the main controller to cause the emission of laser light in a predetermined amount of light, the laser controller determines a condition of emission of laser light based on the error control information stored in the memory to cause the laser emitter to emit laser light under the condition of emission. | 10-23-2008 |