| Patent application number | Description | Published |
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| 20080224301 | Lead Structure for a Semiconductor Component and Method for Producing the Same - A lead structure for a semiconductor component includes: external leads for external connections outside a plastic housing composition, internal leads for electrical connections within the plastic housing composition, and a chip mounting island composed of the lead material. While leaving free contact pads of the internal leads, the top sides of the chip mounting island and the internal leads are equipped with nanotubes as an anchoring layer. The plastic housing composition is arranged in the interspaces between the nanotubes arranged on the internal leads, while an adhesive composition for the semiconductor chip is arranged in the interspaces between the nanotubes arranged on the chip mounting island. The adhesive composition and the plastic housing composition fill the interspaces in a manner free of voids. | 09-18-2008 |
| 20080303172 | METHOD FOR STACKING SEMICONDUCTOR CHIPS AND SEMICONDUCTOR CHIP STACK PRODUCED BY THE METHOD - Apparatus for packaging two chips includes, in some embodiments, a first chip having at least one elevation and at least one cutout on a bottom thereof. It also includes a second chip having at least one elevation and at least one cutout on a top thereof. In some embodiments disclosed, the elevations and cutouts of the first chip and the second chip are configured to allow the elevations to be intermeshed with the cutouts when the chips are stacked with the bottom of the first chip engaging the top of the second chip. | 12-11-2008 |
| 20080315438 | SEMICONDUCTOR DEVICE INCLUDING A STRESS BUFFER - An integrated circuit includes a first surface configured for mounting to a carrier, an active area of the integrated circuit spaced from the first surface, a bond pad disposed over and in electrical communication with the active area, and a ceramic inorganic stress-buffering layer disposed between the active area and the bond pad. | 12-25-2008 |
| 20090026558 | SEMICONDUCTOR DEVICE HAVING A SENSOR CHIP, AND METHOD FOR PRODUCING THE SAME - A semiconductor sensor device and method is disclosed. In one embodiment, the semiconductor device includes a cavity housing and a sensor chip. In one embodiment, the cavity housing has an opening to the surroundings. The sensor region of the sensor chip faces said opening. The sensor chip is mechanically decoupled from the cavity housing. In one embodiment, the sensor chip is embedded into a rubber-elastic composition on all sides in the cavity of the cavity housing. | 01-29-2009 |
| 20090039484 | Semiconductor device with semiconductor chip and method for producing it - A semiconductor chip has at least one first contact and one second contact on its top side and has connecting elements which are arranged jointly on a structure element and which connect the first contact and the second contact of the top side of the semiconductor chip to the external contacts. | 02-12-2009 |
| 20090280314 | THERMOPLASTIC-THERMOSETTING COMPOSITE AND METHOD FOR BONDING A THERMOPLASTIC MATERIAL TO A THERMOSETTING MATERIAL - Composite with a first part composed of a thermoset material and with a second part composed of a thermoplastic material, and with an adhesion-promoter layer located between these, where the first part has been bonded by way of the adhesion-promoter layer to the second part, and where the adhesion-promoter layer comprises pyrolytically deposited semiconductor oxides and/or pyrolytically deposited metal oxides. | 11-12-2009 |
| 20100207277 | SEMICONDUCTOR COMPONENT HAVING A STACK OF SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING THE SAME - A semiconductor component including a stack of semiconductor chips, the semiconductor chips being fixed cohesively one on top of another, is disclosed. The contact areas of the semiconductor chips are led as far as the edges of the semiconductor chips and conductor portions extend at least from an upper edge to a lower edge of the edge sides of the semiconductor chips in order to electrically connect the contact area of the stacked semiconductor chips to one another. | 08-19-2010 |
| Patent application number | Description | Published |
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| 20080312663 | COMPUTER-ASSISTED JOINT ANALYSIS USING SURFACE PROJECTION - A system and method for computer-assisted joint analysis, wherein the joint elements in a three-dimensional imaging data set are segmented and then projected onto a two-dimensional or three-dimensional reference area for interference analysis and surgical planning. | 12-18-2008 |
| 20080319449 | COMPUTER-ASSISTED PLANNING METHOD FOR CORRECTING CHANGES IN THE SHAPE OF JOINT BONES - The patent discloses a system and method for correcting changes in the shape of joint bones in a bone joint, including: providing a three-dimensional imaging data set of a bone joint; identifying the joint bones in the data set based on the shapes of the joint bones; inscribing a portion of a joint bone to be reconstructed with a base shape; determining contour deviations of the inscribed joint bone from the base shape by ascertaining contour distances between the base shape and the shape of the inscribed joint bone in different incision planes; determining a three-dimensional deviating volume using the contour deviations; and using the deviating volume for correction planning. | 12-25-2008 |
| 20090003673 | DETERMINING CORRESPONDENCE OBJECT PAIRS FOR MEDICAL NAVIGATION - A system and method for determining the position of correspondence object pairs including A-objects and B-objects that represent the same objects of the same anatomical body structure in two different reference frames A and B, including: defining A-objects and B-objects that each represent different objects of the body structure in their respective reference frames; determining geometric relationship data A and geometric relationship data B that describe a geometric relationship between the A-objects based on positions of the A-objects in the reference frame A and the B-objects in the B reference frame; and providing data derived or extracted from the geometric relationship data A and from the geometric relationship data B to allow a comparison of a geometric relationship between at least two A-objects to a geometric relationship between at least two B-objects. | 01-01-2009 |
| 20090247861 | CALIBRATION METHOD FOR AXIALLY DETERMINATE MEDICAL INSTRUMENTS - The invention relates to a calibration method for an axially determinate medical instrument, wherein:
| 10-01-2009 |
| 20090285465 | JOINT RECONSTRUCTION PLANNING USING MODEL DATA - The invention relates to a computer-assisted planning method for reconstructing changes in shape on joint bones, comprising the following steps:
| 11-19-2009 |
| 20100049493 | PLANNING ASSISTANCE FOR CORRECTING JOINT ELEMENTS - The invention relates to a planning assistance method for correcting joint elements, in which:
| 02-25-2010 |
| Patent application number | Description | Published |
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| 20100278079 | APPARATUS AND METHOD FOR DETERMINING A COINCIDENCE OF A POSITION WITH A REFERENCE POSITION - An apparatus for determining a coincidence of a position with a reference position, wherein radio signals from fixedly positioned radio transmitters can be received at the position, having a provider for providing properties of the radio signals of the fixedly positioned radio transmitters at the position, wherein the provided properties of the radio signals include transmitter identifications identifying the radio transmitters, a separator for separating the radio transmitters into a first number of radio transmitters previously recorded transmitter identifications of which at the reference position are identical with transmitter identifications provided at the position, and into a second number of radio transmitters previously recorded transmitter identifications of which at the reference position and transmitter identifications provided at the position are different, and a determiner for determining a measure of matching for the position on the basis of the provided properties of the radio signals, wherein both properties of the first number of radio transmitters and properties of the second number of radio transmitters are taken into account in the determination of a measure of matching, and wherein the properties of the first number of radio transmitters and the properties of the second number of radio transmitters enter the measure of matching differently. | 11-04-2010 |
| 20110153632 | APPARATUS AND METHOD FOR ALLOCATING A CURRENT MEASUREMENT VALUE FOR A GEOGRAPHICAL POSITION TO A MAP OBJECT - An apparatus for allocating a current measurement value for a geographical position to a map object of a geographical map, wherein the current measurement value originates from a series of adjacent measurement values for adjacent geographical positions, having a processor for determining a first probability measure indicating whether the current measurement value can be allocated to a first map object to which at least one adjacent measurement value of the series has already been allocated previously, and for determining a second probability measure indicating whether the current measurement value can be allocated to a second map object having an intersection with the first map object, if the first probability measure indicates that an allocation of the current measurement value to the first map object is unlikely. | 06-23-2011 |
