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Haibara

Takuzo Haibara, Shizuoka JP

Patent application numberDescriptionPublished
20100211471COMMODITY SALE DATA PROCESSING APPARATUS AND CONTROL METHOD FOR THE SAME - A receipt detection unit which detects the presence of a receipt issued by a receipt issuing unit provided in a commodity sale data processing apparatus, and an operator detection unit which detects the presence of an operator of the apparatus, are provided. Then, it is notified that a receipt is left on condition that the receipt is detected by the receipt detection unit and the operator is not detected by the operator detection unit.08-19-2010
20110210168SELF-CHECKOUT TERMINAL AND CONTROL METHOD THEREFORE - According to one embodiment, a self-checkout terminal includes a reading unit, a registration processing unit, a determining unit, a checking unit, and a settlement processing unit. The reading unit reads a data code. The registration processing unit acquires sales limitation information. The determining unit determines, according to the limitation information, whether the commodity is subjected to sales limitation. The checking unit transmits, when it is determined that the commodity is subjected to the sales limitation, data for checking whether a limit condition is satisfied and determines whether data of completion of the check is returned. The settlement processing unit inhibits shift to settlement processing for the commodity subjected to the sales limitation and enables, when the checking unit determines that the data of the completion of the check is received, the shift to the settlement processing for the commodity and subjects the commodity to the settlement processing.09-01-2011

Teruaki Haibara, Ashigarakami-Gun JP

Patent application numberDescriptionPublished
20110264356ABNORMAL COMBUSTION DETECTING DEVICE FOR INTERNAL COMBUSTION ENGINE AND CONTROL DEVICE FOR INTERNAL COMBUSTION ENGINE - The present invention has an object to make abnormal combustion of an internal combustion engine detectable by simple means at low cost. For this purpose, an abnormal combustion detecting device provided by the present invention uses a direct injection injector as means for detecting abnormal combustion. In the direct injection injector relating to the abnormal combustion detecting device, a sack chamber is provided at a tip end of a nozzle body, and a nozzle hole is formed to cause the sack chamber and a combustion chamber to communicate with each other. A needle is housed inside the nozzle body, and the sack chamber is opened and closed by the needle, whereby a fuel is directly injected into the combustion chamber. The abnormal combustion detecting device detects lift of the needle from a closing position by, for example, a sensor, and determines that abnormal combustion occurs in the combustion chamber by the fact that lift of the needle is detected at a non-operational time of the direct injection injector.10-27-2011

Teruo Haibara, Hikari JP

Patent application numberDescriptionPublished
20100139711Cleaning method of semiconductor wafer - A wax removal method uniformly removes wax adhering to a wafer surface and reduces the problems of re-adhesion of particles and filter clogging of a cleaning bath during cleaning. The method uses cleaning liquid which contains microbubbles.06-10-2010
20100163084Micro Bubble Generating Device and Silicon Wafer Cleaning Apparatus - A micro-bubble generating device is provided with a micro-bubble generating mechanism and a leading conduit provided with a widening section and a tube part, the widening section and the tube part in communication with each other in the leading conduit. The widening section has a hollow shape which has an axis Z as a central axis, and has base surfaces and a peripheral surface, and communicates with a nozzle of the micro-bubble-generating mechanism via one base surface of the widening section, and communicates with the tube part via the other base surface. The cross section orthogonal to a flow axis Z of the micro-bubbles of the widening section is larger than the cross section orthogonal to the flow axis Z of the tube part.07-01-2010

Teruo Haibara, Hikari Yamaguchi JP

Patent application numberDescriptionPublished
20090145457Method For The Wet-Chemical Treatment Of A Semiconductor Wafer - A method for the wet-chemical treatment of a semiconductor wafer involves: a) rotating a semiconductor wafer; b) applying a cleaning liquid comprising gas bubbles having a diameter of 100 μm or less to the rotating wafer such that a liquid film forms on the wafer; c) exposing the rotating semiconductor wafer to a gas atmosphere containing a reactive gas; and d) removing the liquid film from the wafer.06-11-2009