| Patent application number | Description | Published |
|---|
| 20080204520 | Print Head and a Method of Print Head Operation with Compensation for Ink Supply Pressure Variation - Disclosed is an inkjet print head for ejecting ink droplets, the print head comprises a micro machined chip, a holder that holds the chip and a manifold made as a recess in the holder for distributing ink to the micro machined chip. Sidewalls form the manifold. At least one of the sidewalls forming the manifold is a flexible sidewall. The sidewall deforms as a function of the print head operational pattern and changes the manifold volume such that it maintains ink pressure constant. | 08-28-2008 |
| 20080204533 | A Method of Ink Supply to Inkjet Print Head Array - Disclosed is an inkjet print head array with improved ink supply system. The system includes an ink manifold having at least two ink supply channels, a plurality of print head modules disposed along ink supply channels and forming the array, with each of the print head modules having at least two ink inlet ports. The ports are in fluid communication with the ink supply channels. Each of the ink supply channels supplies ink to each of the ports at a different flow rate, although the resulting ink supply flow rate is equal for each print head module. | 08-28-2008 |
| 20090135219 | METHOD OF COOLING AND SERVICING AN INKJET PRINT HEAD ARRAY - A compliant cooling conduit is employed to extract heat from an inkjet print head array. The cooler conduit is implemented as a flexible conduit placed between the heat emitting surfaces. Cooling fluid pressure presses the conduit to the heat emitting parts of the print head modules. When fluid pressure is removed the conduit collapses and provides convenient access for print head service. | 05-28-2009 |
| 20100032075 | PRINT HEAD WITH REDUCED BONDING STRESS AND METHOD - A method for reducing stress between a silicon chip and a bonded mounting structure having a coefficient of thermal expansion substantially different from a coefficient of thermal expansion of the silicon chip includes the step of bonding a thermal stress-attenuating layer between the silicon chip and the mounting structure. The thermal stress-attenuating layer has a coefficient of thermal expansion that is substantially similar to the coefficient of thermal expansion of the silicon chip. | 02-11-2010 |
| 20100214388 | ELECTRO-WETTING-ON-DIELECTRIC PRINTING - An electro-wetting-on-dielectric printing system includes a drum and an electrode array disposed on a surface of the drum, which is made up of individually addressable electrodes and an ink-phobic coating overlaying the electrodes. Electrically charging a portion of the electrodes allows ink to adhere to a portion of the ink-phobic coating in proximity to the charged electrodes. A method for electro-wetting-on-dielectric printing includes selectively charging individually addressable electrodes within an electrode array, and passing the electrode array through an ink bath, wherein ink adheres areas proximate to charged electrodes to form an image. The image is then transferred to the substrate. | 08-26-2010 |
| 20110050808 | PIEZOELECTRIC PRINTHEAD AND RELATED METHODS - A piezoelectric printhead and related methods provide a first metallic electrode and a second metallic electrode deposited over a top surface and a bottom surface, respectively, of a piezoceramic plate. The second electrode is segmented into a plurality of electrode segments. A diaphragm is positioned over a plurality of pressure chambers, where the diaphragm includes a conductor positioned over each chamber. The piezoceramic plate is attached to the diaphragm such that each conductor on the diaphragm faces multiple electrode segments. | 03-03-2011 |
