Patent application number | Description | Published |
20080211332 | MOTOR - A motor having a busbar unit which is accommodated in a housing along with an armature includes a relay wherein the connection between the armature and the relay is secured. By virtue of such a configuration, reliability of the connection between the armature and the relay is improved. In the busbar unit, a plurality of first busbars and a plurality of second busbars each having a substantially arcuate shape are arranged so as to be circumferentially spaced apart from one another. The first busbars do not overlap with the second busbars in the axial and radial directions thereby reducing the dimensions of the motor in the axial and radial directions. | 09-04-2008 |
20080211356 | MOTOR - A motor includes a housing having a substantially cylindrical shape accommodating therein a stator portion and a rotor portion. The housing includes a housing body having an opening at an upper side thereof, and a lid portion arranged between an armature and a sensor so as to close the opening of the housing body. Since the lid portion is made of a magnetic material and is arranged between the armature and the sensor, a magnetic effect on the sensor caused by a magnetic force generated at the armature is minimized. By virtue of such configuration in which the lid portion of the housing functions as a magnetic shield, the motor can be smaller in the axial direction compared with a configuration in which an extra layer of magnetic shield is arranged. | 09-04-2008 |
20080211357 | MOTOR - A motor includes a sensor which magnetically detects an angular position centered about a central axis of a rotor core with respect to an armature. The sensor preferably includes a yoke which has a substantially annular shape, is made of a magnetic material, is arranged substantially perpendicularly to the central axis and is affixed to a shaft, a sensor magnet affixed at the yoke, a magnet cover which covers a surface of the sensor magnet other than a portion in contact with the yoke, a first Hall element and a second Hall element both of which are arranged facing in an axial direction a surface of the sensor magnet opposite from a surface thereof at which the yoke is arranged. Since the sensor magnet is covered by the yoke and the magnet cover, even when the sensor magnet is damaged, the damaged sensor magnet is prevented from damaging other components of the motor. By virtue of such configuration, the reliability of the motor is improved. | 09-04-2008 |
20120313477 | STATOR UNIT AND MOTOR - A stator unit including a coil in which a distance between an m−1-th turn and an m-th turn is wider than each distance in a first turn to the m−1-th turn. The m+1-th turn is disposed between the m−1-th turn and the m-th turn. Further, in a cross-section perpendicular to a central axis and passing a tooth, an angle between a line segment connecting respective centers of the m+1-th turn and the m−1-th turn and a line segment connecting respective centers of the m+1-th turn and the m-th turn is about 120° or more. With this structure, bulging in a circumferential direction of the coil adjacent to an inner peripheral portion of the tooth can be suppressed and a clearance can be secured between adjacent coils such that the number of turns of the coil can be increased. | 12-13-2012 |
20130257184 | ROTOR UNIT, ROTATING ELECTRICAL MACHINE, AND METHOD FOR MANUFACTURING ROTOR UNIT - A rotor unit includes a rotor core made of laminated steel sheets that are vertically laminated, and a holder made of resin. The rotor core and the holder are fixed together through insert molding. For this reason, the process of manufacturing the rotor core and the holder is shortened. Additionally, in the outer peripheral surface of the rotor core, a portion of resin that defines the holder is present between the plurality of steel sheets that defines the rotor core. For this reason, the fixing strength of the rotor core and the holder improves. Additionally, since a separation between the rotor core and the holder is prevented, magnets can be easily press-fitted. | 10-03-2013 |
20130257211 | ROTOR UNIT, ROTATING ELECTRICAL MACHINE, AND METHOD OF MANUFACTURING ROTOR UNIT - A rotor unit includes a plurality of rotating bodies arranged along a central axis. Each of the plurality of rotating bodies includes an annular rotor core surrounding the central axis, a plurality of magnets arranged in the circumferential direction around the rotor core, and a holder arranged to hold the magnets. Further, the holder includes a plurality of partitioning portions each axially extending between respective ones of the plurality of magnets. The axial dimension of the plurality of partitioning portions is longer than the axial dimension of the respective ones of the plurality of magnets which are held by the plurality of partitioning portions. Further, the plurality of rotating bodies is disposed in a state where the circumferential positions of the plurality of magnets are out of alignment. | 10-03-2013 |
20140375161 | STATOR UNIT AND MOTOR - A stator unit including a coil in which a distance between an m−1-th turn and an m-th turn is wider than each distance in a first turn to the m−1-th turn. The m+1-th turn is disposed between the m−1-th turn and the m-th turn. Further, in a cross-section perpendicular to a central axis and passing a tooth, an angle between a line segment connecting respective centers of the m+1-th turn and the m−1-th turn and a line segment connecting respective centers of the m+1-th turn and the m-th turn is about 120° or more. With this structure, bulging in a circumferential direction of the coil adjacent to an inner peripheral portion of the tooth can be suppressed and a clearance can be secured between adjacent coils such that the number of turns of the coil can be increased. | 12-25-2014 |
Patent application number | Description | Published |
20080246132 | Semiconductor device and method of manufacturing semiconductor device - This semiconductor device includes a semiconductor chip, and a lead arranged around the semiconductor chip to extend in a direction intersecting with the side surface of the semiconductor chip, and having at least an end farther from the semiconductor chip bonded to a package board, wherein a joint surface to the package board and an end surface orthogonal to the joint surface are formed on the end of the lead farther from the semiconductor chip, and a metal plating layer made of a pure metal is formed on the end surface. | 10-09-2008 |
20090051049 | Semiconductor device, substrate and semiconductor device manufacturing method - The semiconductor device can prevent damages on a semiconductor chip even when a soldering material is used for bonding the back surface of the semiconductor chip to the junction plane of a chip junction portion such as an island or a die pad. This semiconductor device includes a semiconductor chip and a chip junction portion having a junction plane that is bonded to the back surface of the semiconductor chip with a soldering material. The junction plane is smaller in size than the back surface of the semiconductor chip. This semiconductor device may further include a plurality of extending portions which extend respectively from the periphery of the junction plane to directions parallel with the junction plane. | 02-26-2009 |
20090115050 | Interposer And Semiconductor Device - An interposer and a semiconductor device including the interposer are provided, which can prevent thermal warpage of an insulative substrate thereof. The interposer is to be provided together with a semiconductor chip in a semiconductor device and, when the semiconductor device is mounted on a mount board, disposed between the semiconductor chip and the mount board. The interposer includes: an insulative substrate of an insulative resin; an island provided on one surface of the insulative substrate to be bonded to a rear surface of the semiconductor chip via a bonding agent; a thermal pad provided on the other surface of the insulative substrate opposite from the one surface in generally opposed relation to the island with the intervention of the insulative substrate; and a thermal via extending through the insulative substrate from the one surface to the other surface to connect the island to the thermal pad in a thermally conductive manner. | 05-07-2009 |
20100006995 | RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD - A resin-encapsulated semiconductor device having a semiconductor chip which is prevented from being damaged. The resin-encapsulated semiconductor device comprises a semiconductor chip including a silicon substrate, a die pad to which the semiconductor chip is secured through a first solder layer, a resin-encapsulating layer encapsulating the semiconductor chip, and lead terminals electrically connected to the semiconductor chip and including inner lead portion covered with the resin-encapsulating layer. The lead terminals are made of copper or a copper alloy. The die pad is made of 42 alloy or a cover alloy and has a thickness (about 0.125 mm) less than the thickness (about 0.15 mm) of the lead terminals. | 01-14-2010 |
20100013069 | SEMICONDUCTOR DEVICE, LEAD FRAME AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device and a lead frame capable of preventing development of defective mounting resulting from a burr and a method of manufacturing a semiconductor device with the lead frame are provided. The semiconductor device includes a semiconductor chip and a lead arranged on the periphery of the semiconductor chip to extend in a direction intersecting with the side surface of the semiconductor chip, so that at least an end portion on the side farther from the semiconductor chip is bonded to a mounting substrate. A groove opened on a surface bonded to the mounting substrate and an end face on the side farther from the semiconductor chip is formed in the lead over the full width in the width direction orthogonal to the thickness direction and along the end face. An embedded body made of solder is embedded in the groove. | 01-21-2010 |
20100270666 | Semiconductor device and method of manufacturing semiconductor device - The semiconductor device according to the present invention includes a semiconductor chip, a solid plate to which the semiconductor chip is bonded, and a bonding member made of a BiSn-based material interposed between the semiconductor chip and the solid plate, while the bonding member has a heat conduction path made of Ag for improving heat conductivity between the semiconductor chip and the solid plate. | 10-28-2010 |
20110115089 | Semiconductor device, production method for the same, and substrate - A semiconductor device is provided in which a semiconductor chip is bonded to a substrate with a sufficiently increased bonding strength and cracking is assuredly prevented which may otherwise occur due to heat shock, heat cycle and the like. The semiconductor device includes a semiconductor chip and a substrate having a bonding area to which the semiconductor chip is bonded via a metal layer. The metal layer includes an Au—Sn—Ni alloy layer and a solder layer provided on the Au—Sn—Ni alloy layer. Undulations are formed in an interface between the Au—Sn—Ni alloy layer and the solder layer. | 05-19-2011 |
20110140256 | SEMICONDUCTOR DEVICE, SUBSTRATE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - The semiconductor device can prevent damages on a semiconductor chip even when a soldering material is used for bonding the back surface of the semiconductor chip to the junction plane of a chip junction portion such as an island or a die pad. This semiconductor device includes a semiconductor chip and a chip junction portion having a junction plane that is bonded to the back surface of the semiconductor chip with a soldering material. The junction plane is smaller in size than the back surface of the semiconductor chip. This semiconductor device may further include a plurality of extending portions which extend respectively from the periphery of the junction plane to directions parallel with the junction plane. | 06-16-2011 |
20110156226 | INTERPOSER AND SEMICONDUCTOR DEVICE - An interposer and a semiconductor device including the interposer are provided, which can prevent thermal warpage of an insulative substrate thereof. The interposer is provided with a semiconductor chip in a semiconductor device andmay be disposed between the semiconductor chip and a mount board. The interposer includes: a substrate of an insulative resin; an island on one surface of the substrate to be bonded to a rear surface of the chip; a thermal pad on the other surface opposite the one surface opposed to the island with the intervention of the substrate; and a thermal via extending through the substrate from the one surface to the other surface to thermally connect the island to the thermal pad. | 06-30-2011 |
20120007247 | Resin-Encapsulated Semiconductor Device - A resin-sealed semiconductor device includes a semiconductor chip including a silicon substrate; a die pad on which the semiconductor chip is secured via a solder layer; a sealing resin layer sealing the semiconductor chip; and lead terminals connected electrically with the semiconductor chip. One end portion of the lead terminals is covered by the sealing resin layer. The die pad and the lead terminals are formed of copper and a copper alloy, and the die pad is formed with a thickness larger than a thickness of the lead terminals, which is a thickness of 0.25 mm or more. | 01-12-2012 |
20120153444 | SEMICONDUCTOR DEVICE - A semiconductor device according to the present invention includes a semiconductor chip, an electrode pad made of a metal material containing aluminum and formed on a top surface of the semiconductor chip, an electrode lead disposed at a periphery of the semiconductor chip, a bonding wire having a linearly-extending main body portion and having a pad bond portion and a lead bond portion formed at respective ends of the main body portion and respectively bonded to the electrode pad and the electrode lead, and a resin package sealing the semiconductor chip, the electrode lead, and the bonding wire, the bonding wire is made of copper, and the entire electrode pad and the entire pad bond portion are integrally covered by a water-impermeable film. | 06-21-2012 |
20140091464 | SEMICONDUCTOR DEVICE - The semiconductor device of the present invention includes a semiconductor substrate provided with semiconductor elements, a lower layer wiring pattern which includes first wiring and second wiring, the first wiring and the second wiring disposed separately so as to be flush with each other, and the first wiring and the second wiring being fixed at a mutually different potential, an uppermost interlayer film disposed on the lower layer wiring pattern, a titanium nitride layer disposed on the uppermost interlayer film so as to cover the first wiring and the second wiring, and the titanium nitride having the thickness of 800 Å or more, and a pad metal disposed on the titanium nitride layer. | 04-03-2014 |
20140312513 | SEMICONDUCTOR DEVICE, SUBSTRATE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - The semiconductor device can prevent damages on a semiconductor chip even when a soldering material is used for bonding the back surface of the semiconductor chip to the junction plane of a chip junction portion such as an island or a die pad. This semiconductor device includes a semiconductor chip and a chip junction portion having a junction plane that is bonded to the back surface of the semiconductor chip with a soldering material. The junction plane is smaller in size than the back surface of the semiconductor chip. This semiconductor device may further include a plurality of extending portions which extend respectively from the periphery of the junction plane to directions parallel with the junction plane. | 10-23-2014 |
20140332944 | RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD - A resin-encapsulated semiconductor device having a semiconductor chip which is prevented from being damaged. The resin-encapsulated semiconductor device ( | 11-13-2014 |