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Haeger
Carl Haeger, Reynoldsburg, OH US
| Patent application number | Description | Published |
|---|---|---|
| 20090229809 | DEVICE CAPABLE OF THERMALLY COOLING WHILE ELECTRICALLY INSULATING - The present disclosure relates to a device for thermally cooling while electrically insulating. The device contains a first adhesive layer, polyimide substrate, a second adhesive layer and a heat sink. The first adhesive layer and the second adhesive layer are a vinyl or acrylic polymer. The polyimide substrate has at least two polyimide layers. The polyimide layers are derived from at least one aromatic dianhydride and at least one aromatic diamine. The adhesive layers and the polyimide layers may contain thermally conductive fillers, light absorbing pigments or mixtures of both. | 09-17-2009 |
| 20100108140 | DEVICE CAPABLE OF THERMALLY COOLING WHILE ELECTRICALLY INSULATING - The present disclosure relates to a device for thermally cooling while electrically insulating. The device contains a first adhesive layer, substrate, a second adhesive layer and a heat sink. The first adhesive layer and the second adhesive layer are a vinyl or acrylic based polymer. The adhesive layers and the substrate may contain thermally conductive fillers, light absorbing pigments or mixtures of both. | 05-06-2010 |
Christian Haeger, Emsbüren DE
| Patent application number | Description | Published |
|---|---|---|
| 20110053747 | DEVICE AND METHOD FOR PRODUCING BAGS - The invention describes an apparatus ( | 03-03-2011 |
Christian Haeger, Emsbüren DE
| Patent application number | Description | Published |
|---|---|---|
| 20110053747 | DEVICE AND METHOD FOR PRODUCING BAGS - The invention describes an apparatus ( | 03-03-2011 |
Daniel A. Haeger, Goleta, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20110044364 | STRUCTURE AND METHOD FOR ACHIEVING SELECTIVE ETCHING IN (Ga,Al,In,B)N LASER DIODES - A structure and method that can be used to achieve selective etching in (Ga, Al, In, B) N laser diodes, comprising fabricating (Ga, Al, In, B) N laser diodes with one or more Al-containing etch stop layers. | 02-24-2011 |
Edward S. Haeger, Park City, UT US
| Patent application number | Description | Published |
|---|---|---|
| 20100250759 | WORKSTATION VIRUS LOCKDOWN IN A DISTRIBUTED ENVIRONMENT - Systems and methods for insuring that a client computer has up-to-date virus protection are provided, and include initiating a boot sequence pursuant to a boot image on a client computer for accessing a network, accessing a remote management server according to a preliminary instruction from the boot image, determining whether the client includes a latest virus file and forwarding the latest virus file if the client does not include the latest virus file. | 09-30-2010 |
Robert John Haeger, Hales Corners, WI US
| Patent application number | Description | Published |
|---|---|---|
| 20090220807 | Hot Melt Pressure Sensitive Adhesives for Paper Labels - A HMPSA is provided that preferably includes at least a) from 30 to 50% of a mixture of triblock and diblock styrenic copolymers having an overall styrene content comprised between 14 and 40%, b) from 40 to 55% of a tackifying resin with a softening temperature comprised between 70 and 150° C. obtainable by hydrogenating, polymerizing or copolymerizing mixtures of aliphatic unsaturated hydrocarbons having about 5, 9 or 10 carbon atoms; c) from 4 to 20% of a hydrocarbon oil with an aromatic content less than 15%; d) from 1 to 6% of a filler selected among calcium carbonate or a low molecular weight homopolymer or copolymer of polyethylene. A laminated system is also provided that includes at least an adhesive layer utilizing the HMPSA and paper facestock. Also included are PSA labels obtainable from the laminated system with a reduced tendency to discolor after storage. | 09-03-2009 |