| Patent application number | Description | Published |
|---|
| 20090005117 | Contactless smart SIM - A mobile communicator including a housing including a main portion and a removable portion, cellular telephone circuitry located within the main portion of the housing, a SIM card mounted in the main portion of the housing, a battery mounted between the removable portion of the housing and the SIM card and a contactless functionality antenna mounted intermediate the removable portion and the battery and communicating with the SIM card. | 01-01-2009 |
| 20090123704 | Electronic inlay structure and method of manufacture thereof - An electronic inlay structure including first and second sheets of an inlay substrate arranged in generally side to side, spaced parallel arrangement, having a gap therebetween, a flexible web material arranged to overlie the gap and edges of the first and second sheets of the inlay structure adjacent the gap, third and fourth sheets arranged in registration with the first and second sheets respectively, over the first and second sheets of the inlay substrate and partially over the flexible web material and bonded thereto, electronic circuitry associated with at least one of the first, second, third and fourth sheets and lamination enclosing the first, second, third and fourth sheets, the electronic circuitry and the web material together to create the inlay structure. | 05-14-2009 |
| 20090123743 | Method of manufacture of wire imbedded inlay - A method of manufacture of wire-embedded inlays, the method including providing a substrate, applying a coating to the substrate, which coating melts at an elevated temperature characteristic of wire-embedding, thereby producing an inlay substrate and when the coating is solid, employing wire embedding techniques for embedding a wire into the inlay substrate. | 05-14-2009 |
| 20100200661 | ELECTRONIC INTERFACE APPARATUS AND METHOD AND SYSTEM FOR MANUFACTURING SAME - A method for manufacture of an electronic interface card ( | 08-12-2010 |
| 20100293784 | ELECTRONIC INTERFACE APPARATUS AND METHOD AND SYSTEM FOR MANUFACTURING SAME - A method for manufacture of an electronic interface card including defining a pair of apertures in a substrate layer, associating an antenna with the substrate layer such that opposite ends of the antenna terminate at the apertures, placing a conductor in each of the apertures, connecting the antenna to the conductor, forming a recess in the substrate layer, attaching continuous connection wires to a plurality of chip modules, attaching the continuous connection wires to a plurality of conductors on a corresponding plurality of the substrate layers, cutting the continuous connection wires so as to retain portions thereof which connect each chip module to a corresponding pair of conductors and sealing the chip module in the recess. | 11-25-2010 |
| 20110043430 | MANUFACTURE OF A SMART CARD - Methods for manufacturing a smart card inlay. In a first embodiment, the method includes initially connecting a first end ( | 02-24-2011 |
