Patent application number | Description | Published |
20090215615 | METHOD OF FORMING SUPPORTED NANOPARTICLE CATALYSTS - A method of forming a supported catalyst, the method comprising forming a colloidal suspension of platinum-iron catalyst nanoparticles in a solvent, depositing at least a portion of the catalyst nanoparticles onto support particles, and removing at least a portion of the iron from the deposited catalyst nanoparticles. | 08-27-2009 |
20100227272 | Highly Functional Multiphoton Curable Reactive Species - A multiphoton curable photoreactive composition including hydantoin hexaacrylate and a photoinitiator system. In some embodiments, the multiphoton curable photoreactive composition consists essentially of hydantoin hexaacrylate and a photoinitiator system. Additionally, the applying a multiphoton curable photoreactive composition comprising hydantoin hexaacrylate and a photoinitiator system may be applied to a substrate and a portion of the multiphoton curable photoreactive composition may be at least partially cured to form an at least partially cured structure. | 09-09-2010 |
20100279566 | PASSIVE ELECTRICAL ARTICLE - A passive electrical article including a dielectric layer having a nonwoven material. | 11-04-2010 |
20110117750 | NOVEL WET ETCHING AGENT FOR II-VI SEMICONDUCTORS AND METHOD - A novel etching agent for etching II-VI semiconductors is provided. The etching agent includes an aqueous solution of potassium permanganate and phosphoric acid. This etching solution can etch II-VI semiconductors at a rapid rate but tend to be much less reactive with III-V semiconductors. The provided agent can be used in a method for etching II-VI semiconductors. | 05-19-2011 |
20110243500 | LIGHT GUIDES HAVING ENHANCED LIGHT EXTRACTION - Lightguides, devices incorporating lightguides, processes for making lightguides, and tools used to make lightguides are described. A lightguide includes light extractors arranged in a plurality of regions on a surface of the lightguide. The orientation of light extractors in each region is arranged to enhance uniformity and brightness across a surface of the lightguide and to provide enhanced defect hiding. The efficiency of the light extractors is controlled by the angle of a given light extractor face with respect to a light source illuminating the light guide. | 10-06-2011 |
20130004967 | MICROWELL ARRAY ARTICLES AND METHODS OF USE - The disclosure provides microstructured articles and methods useful for detecting an analyte in a sample. The articles include microwell arrays. The articles can be used with an optical system component in methods to detect or characterize an analyte | 01-03-2013 |
20130130270 | FILTRATION METHODS AND DEVICES - A method of filtering a liquid sample that includes passing a sample comprising at least one biological organism through a filter membrane at a water volume flux of at least 100 L/m | 05-23-2013 |
20130221393 | LIGHT EMITTING DIODE COMPONENT COMPRISING POLYSILAZANE BONDING LAYER - In one embodiment, a semiconductor component, such as a wavelength converter wafer, is described wherein the wavelength converter is bonded to an adjacent inorganic component with a cured bonding layer comprising polysilazane polymer. The wavelength converter may be a multilayer semiconductor wavelength converter or an inorganic matrix comprising embedded phosphor particles. In another embodiment, the semiconductor component is a pump LED component bonded to an adjacent component with a cured bonding layer comprising polysilazane polymer. The adjacent component may the described wavelength converter(s) or another component comprised of inorganic material(s) such as a lens or a prism. Also described are methods of making semiconductor components such as wavelength converters and LED's. | 08-29-2013 |
20130256640 | ASSEMBLY AND ELECTRONIC DEVICES INCLUDING THE SAME - An assembly includes a dielectric layer in contact with a semiconductor layer. The dielectric layer includes a cross-linked polymeric material having isocyanurate groups, wherein the dielectric layer is free of zirconium oxide particles. The semiconductor layer includes a non-polymeric organic semiconductor material, and is substantially free of electrically insulating polymer. Electronic components and devices including the assembly are also disclosed. | 10-03-2013 |