Gunturi
Ramachandra Murthy Gunturi, Banaglore IN
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20140269156 | COMPACT DEVICE FOR ENHANCING THE MIXING OF GASEOUS SPECIES - Apparatus and system for mixing gas comprising a first valve coupled to a first conduit controlling flow of a first gas, a second valve coupled to a second conduit controlling flow of a second gas, a controller controlling the valves, a base block with a first gas input coupled to the first conduit, a second gas input coupled to the second conduit and an output opening, a mixing chamber formed within the base block, wherein the mixing chamber is coupled to the first gas input and the second gas input to receive input gases, an inner block disposed within the mixing chamber, the inner block including a body with an inner volume and one or more perimeter holes formed through the body coupling the mixing chamber to the inner volume of the inner block; and a gas outlet configured to flow gas through the output opening of the base block. | 09-18-2014 |
Sarma Gunturi, Bangalore IN
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20090003469 | Frequency Offset Correction When Decoding A Packet Encoded In A Frequency Modulated Signal - Frequency offset correction when decoding a packet encoded in a frequency modulated signal. Different symbols encoded in the packet may be corrected by different frequency offsets. In an embodiment, the frequency modulated signal is received on one of the signals of a multi-carrier signal (e.g., based on Orthogonal Frequency Domain Multiplexing, OFDM) and each packet is encoded according to 802.11(a) having the same long sequence repeating multiple times in a header portion. The repetitive sequence is used to compute the different offsets for different symbols. | 01-01-2009 |
20090003493 | CORRECTING FOR CARRIER FREQUENCY OFFSET IN MULTI-CARRIER COMMUNICATION SYSTEMS - A multi-carrier (MC) receiver receives a multi-carrier signal containing data symbols as well as pilot symbols. The MC receiver estimates a carrier frequency offset in a downconverted base-band multi-carrier signal in the frequency domain based on deviations of one or more characteristics of the pilot signals from predetermined values, and corrects for the offset in the time domain. In an embodiment, a second order phase locked loop (PLL) estimates the phase of the pilot signals to determine the carrier frequency offset. Changes in pilot phases caused due to the time domain correction are cancelled to allow the PLL to minimize deviations from the lock position. | 01-01-2009 |
Sarma S. Gunturi, Bangalore IN
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20090252269 | DIGITAL RADIO PROCESSOR ARCHITECTURE WITH REDUCED DCO MODULATION RANGE REQUIREMENT - A method of achieving reduced modulation range requirement in a Digitally Controlled Oscillator (DCO) which is deployed as part of a DRP (Digital Radio Processor) and tuned to a tuning frequency range having operating-channel center-frequencies, wherein phase difference between consecutive samples is termed as FCW (Frequency Control Word), uses the steps of digitally modifying and limiting the FCW so that the FCW does not exceed known FCW thresholds, e.g., chosen from π/2, π/4, π/8, and redistributing the FCWs while maintaining a cumulative sum of phases and without significant EVM (Error Vector Magnitude) degradation. The FCW threshold can be chosen arbitrarily and need not be in the form of π/2 | 10-08-2009 |
20110051639 | DYNAMIC LOW POWER RADIO MODES - A receiver in a packet based communication system includes a programmable block and a detection block that detects at least one of an operating condition of the receiver and a protocol condition of the communication system. Further, the receiver includes a control circuit coupled to the programmable block that controls the programmable block to transition to a set of radio modes according to at least one of the operating condition and the protocol condition. | 03-03-2011 |
Sarma S. Gunturi, Plano, TX US
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20120002471 | Memory Bit Redundant Vias - An integrated circuit containing a memory array with memory bits and a differential sense amplifier for reading the logic state of the memory bits. The integrated circuit also contains redundant vias which are in the via path that couples a bitline to Vss. Moreover, an integrated circuit containing a FLASH memory bit with redundant vias in the via path from the bitline to Vss. | 01-05-2012 |
20120257441 | MEMORY BIT REDUNDANT VIAS - An integrated circuit containing a memory array with memory bits and a differential sense amplifier for reading the logic state of the memory bits. The integrated circuit also contains redundant vias which are in the via path that couples a bitline to Vss. Moreover, an integrated circuit containing a FLASH memory bit with redundant vias in the via path from the bitline to Vss. | 10-11-2012 |
Sarma S. Gunturi, Banglore IN
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20140161202 | METHOD, SYSTEM AND APPARATUS FOR REDUCING THE PEAK-TO-AVERAGE RATIO OF A SIGNAL - A peak-to-average ratio (PAR) of a signal is reduced by clipping the signal at a threshold level and replacing desired frequency tones of the clipped signal with set of frequency tones of the signal. In one embodiment, the PAR of a signal is reduced by adding a peak cancellation signal to the received signal. The peak cancellation signal is generated by clipping the received signal at a threshold level and generating a difference signal by subtracting the received signal from the clipped signal. The peak cancellation signal thus generated is scaled by a scaling factor and added to the received signal to reduce the PAR of the received signal. The scaling factor is adjusted to maintain the desired quality of the received signal. In one embodiment, the PAR of an orthogonal frequency division multiplexed (OFDM) signal may be reduced. | 06-12-2014 |
Sarma Sundaresware Gunturi US
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20110211620 | SWITCHING BETWEEN TRANSMIT AND RECEIVE MODES IN A WIRELESS TRANSCEIVER - A wireless transceiver decodes a receive signal to extract data contained in the receive signal. A processing block contained in the wireless transceiver then initiates a power-ON of the transmit radio portions of the transceiver prior to initiating a power-OFF of the receive radio portions. The technique enables the transceiver to meet timing requirements when operating in environments that require an acknowledgement to be sent in response to receipt of data. | 09-01-2011 |
Satish Gunturi, Albany, NY US
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20080283579 | Method for bonding electronic components - A first electronic component, e.g., a semiconductor die and a second electronic component, e.g., a substrate, each with a main surface, are bonded to each other by applying at least one metal layer comprising an indium layer on each of the main surfaces. Then the semiconductor die and the substrate are aligned against each other with their main surfaces facing each other. The die and substrate with the metal layers in between form an arrangement, which is introduced into a compression means. Afterwards the arrangement is compressed in the compression means at a pressure in a range of 10 to 35 MPa, and heat in a range of 230 to 275° C. is applied to the arrangement, by which temperature and pressure the electronic components are bonded to each other. The compression process is performable in oxygeneous gas atmosphere inside the compression means. | 11-20-2008 |
Satish Gunturi, Kantonsspital CH
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20080202257 | Coriolis mass flowmeter with an oscillatable straight measuring tube - The disclosure relates to a Coriolis mass flowmeter with an oscillatable straight measuring tube consisting of a corrosion-resistant metal, in particular of titanium or a titanium alloy, to which are attached mounted parts connected directly to the measuring tube for the implementation of the Coriolis measurement principle. Furthermore, stabilizing elements running parallel to the measuring tube are coupled to the measuring tube via mounted parts connected directly to the measuring tube, the mounted parts and the stabilizing elements consisting of a metal other than that of the measuring tube. The stabilizing elements are manufactured from a second material which possesses a coefficient of thermal expansion adapted to the metal of the measuring tube. The mounted parts connected directly to the measuring tube are manufactured from a third material which possesses a higher coefficient of thermal expansion than the metal of the measuring tube. | 08-28-2008 |
Satish Sivarama Gunturi, Niskayuna, NY US
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20110266665 | PRESS-PACK MODULE WITH POWER OVERLAY INTERCONNECTION - Systems and methods for utilizing power overlay (POL) technology and semiconductor press-pack technology to produce semiconductor packages with higher reliability and power density are provided. A POL structure may interconnect semiconductor devices within a semiconductor package, and certain embodiments may be implemented to reduce the probability of damaging the semiconductor devices during the pressing of the conductive plates. In one embodiment, springs and/or spacers may be used to reduce or control the force applied by an emitter plate onto the semiconductor devices in the package. In another embodiment, the emitter plate may be recessed to exert force on the POL structure, rather than directly against the semiconductor devices. Further, in some embodiments, the conductive layer of the POL structure may be grown to function as an emitter plate, and regions of the conductive layer may be made porous to provide compliance. | 11-03-2011 |
Satish Sivarama Gunturi, Albany, NY US
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20100038058 | HEAT SINK AND COOLING AND PACKAGING STACK FOR PRESS-PACKAGES - A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink. | 02-18-2010 |
20100315782 | INTEGRAL HEAT SINK WITH SPIRAL MANIFOLDS - A heat sink is provided for directly cooling at least one electronic device package having an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material, where the cooling piece defines at least one inlet manifold configured to receive a coolant and at least one outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and are disposed in a spiral arrangement. The cooling piece further defines a number of millichannels disposed in a radial arrangement and configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink. | 12-16-2010 |
20110135956 | METHOD OF JOINING MATERIALS, AND ARTICLES MADE THEREWITH - A method of joining a first component and a second component is provided. The first component has a surface that comprises at least about 75% by volume of a refractory metal. The second component has a coefficient of thermal expansion greater than a coefficient of thermal expansion of the first component. The method includes disposing a coating on the surface of the first component. The coating includes an adhesion layer and a wetting layer disposed over the adhesion layer. The method further includes disposing a bonding material between the first and second components and joining them. The bonding material has a melting temperature lower than a melting temperature of the second component. An article made using the method is also presented. | 06-09-2011 |
20110317368 | HEAT SINKS WITH C-SHAPED MANIFOLDS AND MILLICHANNEL COOLING - A heat sink for cooling at least one electronic device package includes a lower lid, an upper lid, and a body formed of at least one thermally conductive material. The body is disposed between and sealed to the lower and upper lids and defines a tapered inlet distribution chamber configured to receive a coolant, C-shaped inlet manifolds configured to receive the coolant from the tapered inlet distribution chamber, inverted C-shaped outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and disposed in a circular arrangement. The outlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the inlet chamber. The body further defines a tapered outlet chamber configured to receive the coolant from the outlet manifolds, where the inlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the tapered outlet chamber. Millichannels are formed in the body or are formed in at least one of the lids and are configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels are disposed in a radial arrangement, and the millichannels and the inlet and outlet manifolds are further configured to cool one of the upper and lower contact surfaces of the electronic device package. A lidless heat sink is also provided. | 12-29-2011 |
20110317369 | HEAT SINKS WITH MILLICHANNEL COOLING - A heat sink for cooling at least one electronic device package includes a lower lid, an upper lid and a body formed of at least one thermally conductive material. The body is disposed between and sealed to the lower and upper lids and defines inlet manifolds configured to receive a coolant and outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and are disposed in a circular or spiral arrangement. Millichannels are formed in the body or in the lids, are disposed in a radial arrangement, and are configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to cool one of the upper and lower contact surfaces of the electronic device package. Heat sinks with a single lid are also provided. | 12-29-2011 |
20130313906 | REMOTE LOAD BYPASS SYSTEM - A load bypass switch enables continuous power to remote loads in the event of 1) failure of one or more remote loads, or 2) faults within the remote loads, within a dc power system. The bypass switch utilizes the passive components of the dc loads or inverters and therefore reduces overall component count. A black start method for the remote dc system uses the same passives present inside the loads/inverters and simultaneously uses some of the features of the bypass switch. A bypass-module-yard uses multiple bypass switches enabling continuous power to the remote loads in the event of failure of one or more power distribution cables (in-feed to the remote loads) located remotely in the dc system. | 11-28-2013 |
20150022975 | METHOD AND SYSTEM FOR AN IMMERSION BOILING HEAT SINK - A method and system for cooling a heat-generating component are provided. The system includes a heat generating electronic component including a heat conductive face, a heat sink device including at least one open face pin fin array surface directly coupled to the conductive face, each fin including a distal end including an outwardly facing contact area, the contact areas covering only a portion of the conductive face, the contact areas configured to carry electrical current therethrough, and an immersion of dielectric fluid contained in a vessel, the vessel including a heat-conductive hull at least partially submerged in a heat sink fluid. | 01-22-2015 |
Surya Gunturi, Fremont, CA US
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20120290334 | System and Method for Producing a Flexible Geographical Grid - A variable resolution grid provides a mechanism for focusing specific concentrations of risk exposure on a geographical grid to determine projected loss caused by a particular catastrophe. The geographic grid provides a stable base map by using latitudes and longitudes to define the grid points and cells. Each cell is assigned a geographic identifier or geocode that identifies the location of the cell and its associated resolution. The resolution of the grid may be varied depending in part, on the resolution of any available of hazard data. | 11-15-2012 |
20140114700 | System and Method for Producing a Flexible Geographical Grid - A variable resolution grid provides a mechanism for focusing specific concentrations of risk exposure on a geographical grid to determine projected loss caused by a particular catastrophe. The geographic grid provides a stable base map by using latitudes and longitudes to define the grid points and cells. Each cell is assigned a geographic identifier or geocode that identifies the location of the cell and its associated resolution. The resolution of the grid may be varied depending in part, on the resolution of any available of hazard data. | 04-24-2014 |
Venkata Maruti Viswanath Gunturi, Minneapolis, MN US
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20140058674 | Shortest Travel Path Determination Using Critical Start Time Points - A shortest path from a source to a destination for a current start time in a set of start times is determined. A processor identifies a critical start time in the set of start times that is temporally separated from the current start time by at least one intermediate start time. The shortest path from the source to the destination for the current start time is set as the shortest path for the at least one intermediate start time without separately determining the shortest path for the at least one intermediate start time. A different shortest path is determined from the source to the destination for the critical start time. | 02-27-2014 |
20150051944 | Conveyance Planning Using Dartboard Network - A processor constructs a shortest forest of paths between a set of destination nodes and a set of source nodes, each path passing through a same number of intermediate nodes. The processor selects a set of node-independent paths from the shortest forest of paths such that no two node-independent paths pass through a same node other than a source node or a destination node of the node-independent paths. The processor uses the node-independent paths to schedule movement of items from at least one source node in the set of source nodes to at least one destination node in the set of destination nodes. | 02-19-2015 |