| Patent application number | Description | Published |
|---|
| 20090056448 | BIDIRECTIONAL READOUT CIRCUIT FOR DETECTING DIRECTION AND AMPLITUDE OF CAPACITIVE MEMS ACCELEROMETERS - There is provided a bidirectional readout circuit for detecting direction and amplitude of an oscillation sensed at a capacitive microelectromechanical system (MEMS) accelerometer, the bidirectional readout circuit converting capacitance changes of the capacitive MEMS accelerometer into a time change amount by using high resolution capacitance-to-time conversion technology and outputting the time change amount as the direction and the amplitude of the oscillation by using time-to-digital conversion (TDC) technology, thereby detecting not only the amplitude of the oscillation but also the direction thereof, which is capable of being applied to various MEMS sensors. | 03-05-2009 |
| 20090188110 | MICRO HEAT PIPE WITH POLIGONAL CROSS-SECTION MANUFACTURED VIA EXTRUSION OR DRAWING - A method for fabricating a metal micro heat pipe with a polygonal cross-section to allow working fluid to flow by capillary force generated at edges of the polygonal of the micro heat pipe. The polygonal cross-section is formed of a single metal layer via a single drawing process. The micro heat pipe is formed of a single metal plate. | 07-30-2009 |
| 20090320595 | MICROMACHINED SENSOR FOR MEASURING VIBRATION - There is provided a micromachined sensor for measuring a vibration, based on silicone micromachining technology, in which a conductor having elasticity is connected to masses moving due to a force generated by the vibration and the vibration is measured by using induced electromotive force generated due to the conductor moving in a magnetic field. | 12-31-2009 |
| 20100009514 | METHOD OF FABRICATING MICRO-VERTICAL STRUCTURE - A method of fabricating a micro-vertical structure is provided. The method includes bonding a second crystalline silicon (Si) substrate onto a first crystalline Si substrate by interposing an insulating layer pattern and a cavity, etching the second crystalline Si substrate using a deep reactive ion etch (DRIE) process along a [111] crystal plane vertical to the second crystalline Si substrate, and etching an etched vertical surface of the second crystalline Si substrate using a crystalline wet etching process to improve the surface roughness and flatness of the etched vertical surface. As a result, no morphological defects occur on the etched vertical surface. Also, footings do not occur at an etch end-point due to the insulating layer pattern. In addition, the micro-vertical structure does not float in the air but is fixed to the first crystalline Si substrate, thereby facilitating subsequent processes. | 01-14-2010 |
| 20100012300 | HEAT UNIFORMING DEVICE FOR ELECTRONIC APPARATUS - Provided is a heat uniforming device for an electronic apparatus, which improves the flow and circulation of operating fluid through evaporation and condensation using capillary attraction. The heat uniforming device for the electronic apparatus includes: an evaporation unit comprised of a planar first plate including a first multi-channel capillary region for evaporating an externally injected operating fluid due to heat transmitted from a heating source; and a condensation unit comprised of a planar second plate including a second multi-channel capillary region for condensing vapor supplied from the evaporation unit and a return region having a fluid path that communicates with all channels of the second multi-channel capillary region. | 01-21-2010 |
| 20100050771 | CAPACITIVE ACCELEROMETER - A conventional capacitive accelerometer has a limitation in reducing a distance between a sensing electrode and a reference electrode, and requires a complex process and a separate method of correcting a clearance difference caused by a process error. However, the capacitive accelerometer of the present invention has high sensitivity, can be simply manufactured by maintaining a very narrow distance between a reference electrode and a sensing electrode, and can make it unnecessary to individually correct each manufactured accelerometer by removing or drastically reducing a functional difference due to a process error. | 03-04-2010 |
| 20100059212 | HEAT CONTROL DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided are a heat control device and a method of manufacturing a heat control device. The method of manufacturing a heat control device having an envelope used as a path of a working fluid that absorbs/dissipates heat by a latent heat transfer and a groove formed in an inner wall of the envelope and generating a capillary force moving the working fluid, wherein the method includes: providing first and second templates each including a protruding portion having a shape corresponding to the groove; forming first and second deposition films by depositing metal on the first and second templates; stacking first and second metal plates respectively on the first and second deposition films; burning out the first and second templates from the first and second metal plates; and forming the envelope by combining the first and second metal plates. | 03-11-2010 |
| 20100243214 | FLAT PLATE TYPE MICRO HEAT TRANSPORT DEVICE - There is provided a flat plate type micro heat transport device formed of two plates coupled with each other to be opposite to each other, each of which includes: a reservoir formed to store a moving fluid charged via an inlet; a evaporator formed separated from the reservoir to generate vapor having latent heat by vaporizing the moving fluid; a vapor flow path formed to be connected to the evaporator, through which the vapor having latent heat is transported; a condenser formed to be connected to the vapor flow path and to condense the vapor having latent heat; and a liquid flow path formed to be connected to the condenser and the evaporator and separately from the vapor flow path to transport a liquid obtained by condensing the vapor. The device may efficiently control heat with respect to portable electronic devices by effectively transportring heat generated by a heat source. | 09-30-2010 |
| 20100251826 | MICRO PIEZORESISTIVE PRESSURE SENSOR AND MANUFACTURING METHOD THEREOF - A micro semiconductor-type pressure sensor and a manufacturing method thereof are provided. The micro semi-conductor-type pressure sensor is implemented by etching a cavity-formation region of a substrate to form a plurality of trenches, oxidizing the plurality of trenches through a thermal oxidation process to form a cavity-formation oxide layer, forming a membrane-formation material layer on upper portions of the cavity-formation oxide layer and the substrate, forming a plurality of etching holes in the membrane-formation material layer, removing the cavity-formation oxide layer through the plurality of etching holes to form a cavity buried in the substrate, forming a membrane reinforcing layer on an upper portion of the membrane-formation material layer to form a membrane for closing the cavity, and forming sensitive films made of a piezoresisive material on an upper portion of the membrane. | 10-07-2010 |
| 20100258278 | FLAT PLATE TYPE MICRO HEAT SPREADING DEVICE - A flat plate type heat spreading device is provided. The flat plat type heat spreading device can reduce heat by generating phase transition of liquid by using heat of a heat source so as to solve various problems caused by heat generated in components of electronic devices such as personal computers or mobile phones. Specifically, the flat plate type heat spreading device includes a lower plate for evaporating liquid, a middle plate combined with an upper surface of the lower plate, which separately includes a path through which evaporated vapor passes and a path through which condensed fluid flows into the lower plate, and an upper plate combined with an upper surface of the middle plate, which condenses the evaporated vapor. | 10-14-2010 |
| 20110079372 | HEAT TRANSFER DEVICE WITH FUNCTIONS OF POWER GENERATION - Provided is a heat transfer device which has a function of generating power through vibration of capillary grooves having a thin piezoelectric film deposited thereon, in addition to a heat transfer function of discharging heat transferred from a heating element to the outside. | 04-07-2011 |
| 20110133758 | HIGH RESOLUTION CIRCUIT FOR CONVERTING CAPACITANCE-TO-TIME DEVIATION - There is provided a high resolution circuit for converting a capacitance-to-time deviation including a capacitance deviation detecting unit generating two detection signals having a phase difference corresponding to variations of capacitance of an micro electro mechanical system (MEMS) sensor; a capacitance deviation amplifying unit dividing frequencies of the two detection signals to amplify the phase difference corresponding to the capacitance deviation; and a time signal generating unit generating a time signal having a pulse width corresponding to the amplified phase difference. | 06-09-2011 |
