Patent application number | Description | Published |
20100301703 | INTEGRATION OF PIEZOELECTRIC MATERIALS WITH SUBSTRATES - Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer. | 12-02-2010 |
20100314969 | MECHANICAL RESONATING STRUCTURES AND METHODS - Apparatus and methods of connecting mechanical resonating structures to a body are described. Multi-element anchors may include a flexible portion that flexes when the mechanical resonating structure vibrates. The flexible portion may have a length related to the resonance frequency of the mechanical resonating structures. Some of the multi-element anchors include elements that are oriented perpendicularly to each other. MEMS incorporating such structures are also described. | 12-16-2010 |
20110121682 | SIGNAL AMPLIFICATION BY HIERARCHAL RESONATING STRUCTURES - An electromechanical resonating structure, including: first level major elements coupled to each other to form a second or higher level hierarchy; and first level sub-micron size minor elements with a characteristic frequency and coupled to each of the first level major elements to form a second level hierarchy in which a signal is effectively amplified by vibrating each of the plurality of major elements in at least one mode determined by the geometry and dimensions of the first level sub-micron minor elements. | 05-26-2011 |
20110187227 | INTEGRATION OF PIEZOELECTRIC MATERIALS WITH SUBSTRATES - Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer. | 08-04-2011 |
20120006113 | Microelectromechanical Gyroscopes and Related Apparatus and Methods - In one embodiment, an apparatus includes a resonant structure having a plate, a drive electrode and a sense electrode. The resonant structure defines an axis substantially orthogonal to a plane defined by the plate when the resonant structure is not excited. The plate is formed from a piezoelectric material. The drive electrode is configured to excite the resonant structure, and the sense electrode is configured to sense a signal in response to rotation of the resonant structure about the axis. | 01-12-2012 |
20120013413 | TIMING OSCILLATORS AND RELATED METHODS - Timing oscillators as well as related methods and devices are described. A timing oscillator may include a mechanical resonating structure with major elements and minor elements coupled to the major element. The timing oscillator can generate stable signals with low phase noise at very high frequencies which allows a timing oscillator to be used effectively in a number of devices including computers and mobile phones for time and data synchronization purposes. The signal generated by the timing oscillator can be tuned using a driver circuit and a compensation circuit. | 01-19-2012 |
20120024058 | MICROELECTROMECHANICAL GYROSCOPES AND RELATED APPARATUS AND METHODS - In one embodiment, an apparatus comprises a micromechanical gyroscope and a circuit. The micromechanical gyroscope is configured to be excited in a first mode by a drive signal, and configured to be excited in a second mode by a gyroscopic effect. The circuit is coupled to the micromechanical gyroscope and configured to detect the gyroscopic effect when the micromechanical gyroscope is in the second mode. | 02-02-2012 |
20120056510 | INTEGRATION OF PIEZOELECTRIC MATERIALS WITH SUBSTRATES - Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer. | 03-08-2012 |
20120067124 | RESONANT SENSING USING EXTENSIONAL MODES OF A PLATE - A device or system that incorporates teachings of the present disclosure may include, for example, a resonant structure having a plate, a mass and a set of electrodes. The plate can have an extensional mode at a frequency when excited. The set of electrodes can be used to measure an acceleration of the mass when the acceleration of the mass changes the frequency of the plate. Other embodiments are disclosed. | 03-22-2012 |
20120074810 | MECHANICAL RESONATING STRUCTURES INCLUDING A TEMPERATURE COMPENSATION STRUCTURE - Mechanical resonating structures are described, as well as related devices and methods. The mechanical resonating structures may have a compensating structure for compensating temperature variations. | 03-29-2012 |
20120280594 | MICROELECTROMECHANICAL SYSTEMS (MEMS) RESONATORS AND RELATED APPARATUS AND METHODS - Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer. | 11-08-2012 |
20130140651 | MICROELECTROMECHANICAL SYSTEMS (MEMS) RESONATORS AND RELATED APPARATUS AND METHODS - Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer. | 06-06-2013 |
20130140944 | MICROELECTROMECHANICAL SYSTEMS (MEMS) RESONATORS AND RELATED APPARATUS AND METHODS - Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer. | 06-06-2013 |
20130140958 | MICROELECTROMECHANICAL SYSTEMS (MEMS) RESONATORS AND RELATED APPARATUS AND METHODS - Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer. | 06-06-2013 |
20130200752 | METHODS AND APPARATUS FOR MECHANICAL RESONATING STRUCTURES - Mechanical resonating structures and related methods are described. The mechanical resonating structures may provide improved efficiency over conventional resonating structures. Some of the structures have lengths and widths and are designed to vibrate in a direction approximately parallel to either the length or width. They may have boundaries bounding the length and width dimensions, which may substantially align with nodes or anti-nodes of vibration. | 08-08-2013 |
20130307154 | INTEGRATED CIRCUIT WIRING FABRICATION AND RELATED METHODS AND APPARATUS - Integrated circuits having electrically conductive traces are described. The electrically conductive traces may be formed of multiple electrically conductive layers. One or more of the multiple electrically conductive layers may have a cut formed therein to form a gap in that electrically conductive layer. One or more electrical conductive layers of the electrical conductive traces may bridge the gap. | 11-21-2013 |
20130313947 | INTEGRATION OF PIEZOELECTRIC MATERIALS WITH SUBSTRATES - Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer. | 11-28-2013 |
20130334929 | RESONATOR ELECTRODES AND RELATED METHODS AND APPARATUS - Resonator structures and electrodes are described, as well as methods for manufacturing the same. Resonator electrodes may be formed using two or more photolithographic steps and masks, with different masks being used to define different features of the electrodes. The masks may create self-aligned electrodes, which can be aligned with one or more anchors of the resonator. | 12-19-2013 |
20140137648 | MICROELECTROMECHANICAL GYROSCOPES AND RELATED APPARATUS AND METHODS - In one embodiment, an apparatus comprises a micromechanical gyroscope and a circuit. The micromechanical gyroscope is configured to be excited in a first mode by a drive signal, and configured to be excited in a second mode by a gyroscopic effect. The circuit is coupled to the micromechanical gyroscope and configured to detect the gyroscopic effect when the micromechanical gyroscope is in the second mode. | 05-22-2014 |