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Guerin
Charles L. Guerin, Morin Heights CA
| Patent application number | Description | Published |
|---|---|---|
| 20100070891 | System and method for configuring an application via a visual map interface - The present invention provides a system and method for configuring an application via a visual map interface. The method involves providing a visual map into which a user can enter configuration data for the application. The visual map includes predefined topics that correspond to configurable portions of the application, and the user enters the configuration data as subtopics to the predefined topics. The predefined topics may be defined by a programmer or system administrator for the configurable application. When the configurable application requests the configuration data, the applicable data entered into the subtopics is sent to the configurable application. | 03-18-2010 |
Luc Guerin, Bromont CA
| Patent application number | Description | Published |
|---|---|---|
| 20110044369 | SILICON CARRIER OPTOELECTRONIC PACKAGING - An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with wiring. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. A plurality of OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the OE elements positioned in optical alignment with the optical via for receiving the light. A carrier is interposed between electrical interconnect elements. The carrier is positioned between the wiring of the silicon layer and a circuit board and the carrier is electrically connecting first interconnect elements connected to the wiring of the silicon layer and second interconnect elements connected to the circuit board. | 02-24-2011 |
Luc Guerin, Granby CA
| Patent application number | Description | Published |
|---|---|---|
| 20090072392 | Techniques For Forming Solder Bump Interconnects - Interconnects are formed on attachment points of a wafer by performing several steps. A plurality of cavities having a predetermined shape is formed in a semiconductor substrate. These cavities are then filled with an interconnect material to form the interconnects. The interconnects are subsequently attached to the attachment points of the wafer. | 03-19-2009 |
| 20090123589 | METHODS INVOLVING MARKING MOLDS - An exemplary method for marking molds, the method comprising, configuring a milling machine to operate with a diamond coated bit having an angle of approximately 60 degrees, and engraving a unique identifier on a bottom surface of a borosilicate glass injection molded soldering mold with the milling machine. | 05-14-2009 |
Nuno Alexandre Guerin, Cascais PT
| Patent application number | Description | Published |
|---|---|---|
| 20090246055 | DISCHARGE CHAMBER FOR DUAL DRIVE SCROLL COMPRESSOR - A dual drive compressor is disclosed including a discharge chamber having a wall disposed therein forming a plurality of discharge zones within the discharge chamber to attenuate pulsations caused by a fluid received in the compressor and improve a performance of the compressor. | 10-01-2009 |